E-learning packaging technologies course in the frame of the MSYSTECH European project

2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2010-12-03 DOI:10.1109/SIITME.2010.5650874

M. Pantazica, N. Codreanu, P. Svasta, C. Ionescu

引用次数: 0

Abstract

The paper presents the e-learning “Packaging Technologies” course developed in the frame of the mSysTech (E-Training Microsystems Technologies) European project. The objective of this multi-media course is to introduce the learners in microsystems packaging technologies, including design, analysis, fabrication, assembling, characterization and testing. In addition, this course will also introduce the most recent developments of micro-/nano-fabrication technologies.

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MSYSTECH欧洲项目框架下的电子学习包装技术课程

本文介绍了在mSysTech(电子培训微系统技术)欧洲项目框架下开发的电子学习“封装技术”课程。本多媒体课程的目的是向学习者介绍微系统封装技术，包括设计、分析、制造、组装、表征和测试。此外，本课程还将介绍微/纳米制造技术的最新发展。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME)

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