Optimization of a boost switching-mode power supply using electro-thermal modeling and simulation

C. Negrea, M. Rangu, P. Svasta
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引用次数: 3

Abstract

One of the major drawbacks in the typical design flow of electronic equipment is the lack of synchronization between design stages. Schematic design and thermal management are rarely correlated, although electrical and thermal parameters are very closely linked. Poor thermal design can have severe consequences on the reliability and functionality of the equipment and is often the main cause of component failure. As power density increases on the printed circuit board this problem becomes critical. Our paper presents a method of mixing electrical and thermal simulation with the goal of improving functional parameters and thermal stress behavior. Switching-mode power supply circuits have high power density and are likely to fail due to thermal stress, so as a support application for our method we will use a boost switching-mode power supply designed for automotive use.
利用电热建模与仿真优化升压开关电源
典型电子设备设计流程的主要缺点之一是设计阶段之间缺乏同步。原理图设计和热管理很少相关,尽管电气和热参数密切相关。不良的热设计会对设备的可靠性和功能产生严重后果,并且通常是部件故障的主要原因。随着印刷电路板上功率密度的增加,这个问题变得至关重要。本文提出了一种混合电模拟和热模拟的方法,目的是改善功能参数和热应力行为。开关模式电源电路具有高功率密度,并且很可能由于热应力而失效,因此作为我们方法的支持应用,我们将使用专为汽车使用的升压开关模式电源。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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