Sensors Update最新文献_第3页

Silicon Photodetectors with a Selective Spectral Response 具有选择性光谱响应的硅光电探测器

Sensors Update Pub Date : 2001-05-01 DOI: 10.1002/1616-8984(200105)9:1<69::AID-SEUP69>3.0.CO;2-Q

R. Wolffenbuttel

{"title":"Silicon Photodetectors with a Selective Spectral Response","authors":"R. Wolffenbuttel","doi":"10.1002/1616-8984(200105)9:1<69::AID-SEUP69>3.0.CO;2-Q","DOIUrl":"https://doi.org/10.1002/1616-8984(200105)9:1<69::AID-SEUP69>3.0.CO;2-Q","url":null,"abstract":"Silicon photodetectors with a spectral response defined by design are described. Micromachining technologies in general and two properties of an integrated silicon photodetector in particular are used for that purpose. Firstly, the wavelength dependence of the absorption coefficient is exploited. Secondly, use is made of the fact that a multi-layer interference filter on top of a pn-junction comes with silicon wafer processing. The silicon complex index of refraction, n* = n – jk, is wavelength dependent in the visible part of the spectrum due to the indirect bandgap at 1.12 eV and the possibility for a direct transition at 3.4 eV, which causes the material to strongly absorb UV light and to almost behave like a transparent material for wavelengths beyond 800 nm. This mechanism enables the design of color sensors and photodiodes with an IR or UV selective response. The transmission of incident light through a surface stack of thin films into the bulk silicon is wavelength dependent. The required compatibility with standard microelectronic processing in silicon limits the range of suitable materials to the silicon-compatible materials conventionally used for integrated circuit fabrication. Accurate data on: crystalline Si, thermally grown SiO2, LPCVD polysilicon, silicon nitride (lowstress and stoichiometric) and oxides (LTO, PSG, BSG, BPSG), PECVD oxynitrides and thin-film metals are provided to improve the predictive quality of simulations. In case of a complete microspectrometer, micromachining steps are usually applied for the realization of a dispersion element. Devices operating in the visible or IR spectral range and based on a grating or a Fabry-Perot etalon are presented.","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125267905","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 17

Sensors and Food Quality 传感器与食品质量

Sensors Update Pub Date : 2001-05-01 DOI: 10.1002/1616-8984(200105)9:1<255::AID-SEUP255>3.0.CO;2-V

P. Connell, G. Guilbault

引用次数: 6

Immunosensors for Diagnostics 诊断用免疫传感器

Sensors Update Pub Date : 2001-05-01 DOI: 10.1002/1616-8984(200105)9:1<283::AID-SEUP283>3.0.CO;2-R

A. Oliva, Helder J Cruz, Carla C. Rosa

引用次数: 9

Micromachined Photoplastic Probes for Scanning Probe Microscopy 扫描探针显微镜用微机械光塑探针

Sensors Update Pub Date : 2001-05-01 DOI: 10.1002/1616-8984(200105)9:1<3::AID-SEUP3>3.0.CO;2-U

G. Genolet, M. Despont, P. Vettiger, N. Rooij

{"title":"Micromachined Photoplastic Probes for Scanning Probe Microscopy","authors":"G. Genolet, M. Despont, P. Vettiger, N. Rooij","doi":"10.1002/1616-8984(200105)9:1<3::AID-SEUP3>3.0.CO;2-U","DOIUrl":"https://doi.org/10.1002/1616-8984(200105)9:1<3::AID-SEUP3>3.0.CO;2-U","url":null,"abstract":"Scanning probe microscopy (SPM) is a well-established technique for surface analysis, but batch-fabricated, low-cost probes still remain a challenging issue. The design and fabrication of entirely photoplastic probes for scanning force microscopy (SFM) have been developed and used for imaging DNA molecules. Using a polymer for the cantilever facilitates the realization of mechanical properties that are difficult to achieve with classical silicon technology. Single lever and cassettes of multiple single-lever probes are presented. The probes are made of an epoxy-based photoresist, which can be structured by standard photolithography and molding techniques. The fabrication process is a simple batch process in which the integrated tips and the levers are defined in one photolithography step. Imaging soft, condensed matter with photoplastic levers, which uses laser beam deflection sensing, exhibits a resolution that compares well with that of commercially available silicon cantilevers. A similar fabrication technique was also developed to fabricate photoplastic tips for scanning near-field optical microscopy (SNOM) that are to be attached to optical fibers. This technique allows optical apertures to be integrated at the end of the well-defined tip directly by probe fabrication, without the need for any post-processing for the aperture formation. Simple fabrication, as well as topographical and optical imaging with such probes, demonstrate the potential of photoplastic-based probes for AFM and SNOM applications.","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117101455","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Markets for Microsystems and Electronics in Automotive Applications 汽车应用中的微系统和电子产品市场

Sensors Update Pub Date : 2001-05-01 DOI: 10.1002/1616-8984(200105)9:1<357::AID-SEUP357>3.0.CO;2-J

T. Köhler, Stephan Mietke, J. Ilgner, M. Werner

引用次数: 1

Detection of Fires by Gas Sensors 用气体传感器探测火灾

Sensors Update Pub Date : 2001-05-01 DOI: 10.1002/1616-8984(200105)9:1<161::AID-SEUP161>3.0.CO;2-A

D. Kohl, J. Kelleter, H. Petig

引用次数: 26

Silica-Tin Oxide Sensor with Molecular Recognition Ability 具有分子识别能力的二氧化硅-氧化锡传感器

Sensors Update Pub Date : 2001-05-01 DOI: 10.1002/1616-8984(200105)9:1<225::AID-SEUP225>3.0.CO;2-6

N. Katada, M. Niwa

引用次数: 1

Multiple Through‐wafer Interconnects for MEMS Applications 用于MEMS应用的多通圆互连

Sensors Update Pub Date : 2001-05-01 DOI: 10.1002/1616-8984(200105)9:1<21::AID-SEUP21>3.0.CO;2-8

M. Heschel, J. Kuhmann, S. Bouwstra

{"title":"Multiple Through‐wafer Interconnects for MEMS Applications","authors":"M. Heschel, J. Kuhmann, S. Bouwstra","doi":"10.1002/1616-8984(200105)9:1<21::AID-SEUP21>3.0.CO;2-8","DOIUrl":"https://doi.org/10.1002/1616-8984(200105)9:1<21::AID-SEUP21>3.0.CO;2-8","url":null,"abstract":"This chapter reports on the design and manufacturing of multiple through-wafer interconnects for stacking of microelectromechanical devices. The feedthroughs have been applied to an interconnect (intermediate) layer for an integrated microphone. The integrated microphone consists of the transducer part and an application specific integrated circuit (ASIC). The two parts are joined by stacking them on top of each other with the interconnect (intermediate) layer between them. The intermediate layer is a multifunctional layer. It provides the microphone with an acoustic frontchamber. The intermediate layer ensures the interchange of acoustical and electrical signals with the environment. Also, the intermediate layer protects the microphone during dicing, chip handling and in operation. The two active components are electrically connected through the intermediate layer by multiple wafer frontside to backside interconnects. The feedthrough interconnects are provided with under bump metallizations (UBM), solder bumps and sealing rings on the microphone side and top surface metallizations (TSM) on the ASIC side. The entire metallization system is based on electroplating techniques. The patterning of the metallizations has been done utilizing an electrodepositable photoresist (EDPR) as a plating mold. Several EDPR processes have been developed which are optimized for the respective metallization. The feedthrough interconnects have been optimized in terms of series resistance and parallel capacitance. Electrical characterization of the feedthrough interconnects has been carried out analytically and experimentally. The series resistance of one single interconnect wire is in the order of 100 mΩ. The parallel (parasitic) capacitance is in the order of 2 pF. Coupling between two adjacent feedthrough interconnects is negligible for low relative humidity ( 90%) the impedance between two wires may be reduced due to a condensed water film. Sensitivity measurements performed before and after bonding of the interconnect layer to the microphone showed identical results which proves sufficient (TΩ) isolation between the feedthrough wires.","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128758015","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Quartz Crystal Microbalance for Bioanalytical Applications 生物分析用石英晶体微天平

Sensors Update Pub Date : 2001-05-01 DOI: 10.1002/1616-8984(200105)9:1<313::AID-SEUP313>3.0.CO;2-E

A. Janshoff, C. Steinem

{"title":"Quartz Crystal Microbalance for Bioanalytical Applications","authors":"A. Janshoff, C. Steinem","doi":"10.1002/1616-8984(200105)9:1<313::AID-SEUP313>3.0.CO;2-E","DOIUrl":"https://doi.org/10.1002/1616-8984(200105)9:1<313::AID-SEUP313>3.0.CO;2-E","url":null,"abstract":"The quartz crystal microbalance (QCM) was first introduced as a mass sensor in gas phase and in vacuum. Since oscillator circuits capable of exciting shear vibrations of quartz resonators under liquid load have been developed, the QCM became accepted as a new powerful technique to monitor adsorption processes at solid/liquid interfaces in chemical and biological research rendering the method an attractive low-cost alternative for bioanalytic applications. In the last decade, adsorption of biomolecules on functionalized surfaces turned out to be one of the paramount applications of piezoelectric transducers comprising the interaction of DNA and RNA with complementary strands, specific recognition of protein-ligands by immobilized receptors, the detection of virus capsids, bacteria, mammalian cells and last but not least the development of complete immunosensors. Piezoelectric transducers allow a label-free detection of molecules; they are more than mere mass sensors since the sensor response is also influenced by interfacial phenomena, viscoelastic properties of the adhered biomaterial, surface charges of adsorbed molecules and surface roughness. These new insights have recently been used to investigate the adhesion of cells, liposomes and proteins onto surfaces allowing to determine morphological changes of cells as a response to pharmacological substances and changes in the water content of biopolymers in situ. However, future will show whether the quartz crystal microbalance will assert itself against established label-free sensor devices like surface plasmon resonance spectroscopy and interferometry.","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128245199","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 59

Microacoustic Sensors for Liquid Monitoring 液体监测用微声传感器

Sensors Update Pub Date : 2001-05-01 DOI: 10.1002/1616-8984(200105)9:1<105::AID-SEUP105>3.0.CO;2-I

F. Herrmann, B. Jakoby, J. Rabe, S. Büttgenbach

{"title":"Microacoustic Sensors for Liquid Monitoring","authors":"F. Herrmann, B. Jakoby, J. Rabe, S. Büttgenbach","doi":"10.1002/1616-8984(200105)9:1<105::AID-SEUP105>3.0.CO;2-I","DOIUrl":"https://doi.org/10.1002/1616-8984(200105)9:1<105::AID-SEUP105>3.0.CO;2-I","url":null,"abstract":"In recent years, much effort has been expended to developing miniaturized, reliable sensors for measuring physical and chemical liquid properties. Microacoustic devices may be employed to determinate physical quantities perturbing the propagation conditions of the acoustic wave, even in liquid environments. For liquid sensors, acoustic modes with shear polarization are often used in order to avoid radiation losses. Examples are shear bulk modes, surface skimming bulk waves, shear-horizontal acoustic plate modes, and Love modes. Furthermore, modes with sagittal polarization may be applied if their phase velocity is sufficiently lower than the sound velocity in the adjacent liquid. General interactions between acoustic waves and liquids are viscous coupling, acoustoelectric effects, and mass loading. The resulting changes in device frequency and attenuation may be utilized for sensing purposes. The general advantages of microacoustic sensors are high sensitivity, simple fabrication, and quasidigital frequency readout. Hence, a wide variety of devices based on different modes for very different applications has been discussed in the relevant literature. The aim of this review is to provide a systematic overview of microacoustic sensors particularlay suited for operation in liquids. First, we provide a brief introduction to surface acoustic wave devices and the underlying physics, basic microacoustic structures, and general measurement techniques. A description of the mechanisms of interaction between liquids and acoustic waves is then followed by a comprehensive survey covering the different types of microacoustic liquid sensors, with emphasis on the mode-specific device properties. Thereafter, aspects of material selection and device fabrication are summarized. Lastly, an overview is given indicating where microacoustic liquid sensors have already been put into practice and where their application may be expected in the near future.","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"105 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122878013","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 38