Sensors Update最新文献

Sensors for Catheter Applications 导管应用传感器

Sensors Update Pub Date : 2003-12-01 DOI: 10.1002/SEUP.200390018

P. French, D. Tanase, J. Goosen

引用次数: 21

Microelectronic Chips for Molecular and Cell Biology 分子和细胞生物学的微电子芯片

Sensors Update Pub Date : 2003-12-01 DOI: 10.1002/SEUP.200390015

M. Tartagni, L. Altomare, R. Guerrieri, A. Fuchs, N. Manaresi, G. Medoro, R. Thewes

引用次数: 3

Fluorescent Ion‐Sensing Microspheres for Multiplexed Chemical Analysis of Clinical and Biological Samples 荧光离子传感微球用于临床和生物样品的多重化学分析

Sensors Update Pub Date : 2003-12-01 DOI: 10.1002/SEUP.200390014

S. Peper, E. Bakker

引用次数: 10

Technology‐Driven Alternatives for Smart Sensor Interfaces 智能传感器接口的技术驱动替代方案

Sensors Update Pub Date : 2003-12-01 DOI: 10.1002/SEUP.200390013

A. Baschirotto, P. Malcovati

引用次数: 12

Optical Sensors in Medical Care 医疗保健中的光学传感器

Sensors Update Pub Date : 2003-12-01 DOI: 10.1002/SEUP.200390017

P. Öberg

{"title":"Optical Sensors in Medical Care","authors":"P. Öberg","doi":"10.1002/SEUP.200390017","DOIUrl":"https://doi.org/10.1002/SEUP.200390017","url":null,"abstract":"Optical assessment of physiological parameters constitutes a group of measurement principles, which are very attractive because they often provide simple, non-invasive, continuous physiological monitoring conditions. \u0000 \u0000 \u0000 \u0000Optical principles have been used in medical diagnosis since the dawn of the medical sciences. Well-known examples are the typical pallor of an anaemic patient or the yellowish skin of a baby with jaundice. Skin colours, and changes in skin colours, are typical for a number of infectious diseases. \u0000 \u0000 \u0000 \u0000The interest for diagnosis, based on optical principles, has increased in recent years, partly because of the availability of new instruments and methods utilizing new optical technology. \u0000 \u0000 \u0000 \u0000For a long time optical instruments have been used for analysis of samples taken from the patient in the laboratory. In these types of instruments, an optical beam typically passes a cuvette containing the sample and properties of the sample can be extracted by analysing absorption or scattering of light from the sample. A newer trend is that data are collected directly from a patient, thereby eliminating the need of sample collection. \u0000 \u0000 \u0000 \u0000This paper discusses the principles of three such optical diagnostic measurements: \u0000 \u0000 \u0000 \u0000Near infrared spectroscopy, pulse oximetry, laser Doppler flowmetry/imaging. \u0000 \u0000 \u0000 \u0000These three methods have been chosen as examples of bio-optical progress and because they represent technologies at various stages of introduction into use in health care.","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"84 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129257354","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

Modeling, Simulation, and Experimentation of a Promising New Packaging Technology: Parallel Fluidic Self-Assembly of Microdevices 一种有前途的新封装技术的建模、仿真和实验:微器件的平行流体自组装

Sensors Update Pub Date : 2003-12-01 DOI: 10.1002/SEUP.200390012

J. Lienemann, A. Greiner, J. Korvink, X. Xiong, Y. Hanein, K. Böhringer

{"title":"Modeling, Simulation, and Experimentation of a Promising New Packaging Technology: Parallel Fluidic Self-Assembly of Microdevices","authors":"J. Lienemann, A. Greiner, J. Korvink, X. Xiong, Y. Hanein, K. Böhringer","doi":"10.1002/SEUP.200390012","DOIUrl":"https://doi.org/10.1002/SEUP.200390012","url":null,"abstract":"The parallel fluidic self-assembly of microdevices is a new technology that promises to speed up the production of complex microsystems made up of many separate parts. The technology brings many advantages. First, it enables a mix of chipmaking technologies for each of the component parts, with each technology selected for its particular technical or financial benefits. Second, it eliminates the need for pick-and-place assembly that would unnecessarily slow down any manual assembly technique. Third, it enables massively parallel assembly, almost independent of the number of parts involved, and thereby mimics the elegant parallelism inherent in microchip circuit manufacture. \u0000 \u0000 \u0000 \u0000In this chapter we explore this new technology with the ultimate goal of discovering the practical limits for its practical use in manufacturing real microsystems. The driving force of the assembly process is interface surface tension, and our approach is to find the simplest models that correctly describe the attachment, orientation, and bonding of parts to a suitably prepared substrate. We follow both an analytical and a numerical approach in describing the surface tension effects, the latter mainly to gain geometrical generality, and we couple modeling and simulation with suitable laboratory experiments. The ultimate goal of this work is to find practical design rules with which to select bond site geometries and the properties of participating liquids, and to find practical tolerances for all required geometrical and rheological parameters. This chapter extensively documents all results found to date, and carefully cites other work in this area.","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125947802","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 35

Microvalve for Fuel Cells and Miniature Gas Chromatographic System 用于燃料电池和微型气相色谱系统的微阀

Sensors Update Pub Date : 2003-12-01 DOI: 10.1002/SEUP.200390019

P. Hesketh, J. S. Bintoro, R. Luharuka

引用次数: 22

MEMS in RF Filter Applications: Thin‐film Bulk Acoustic Wave Technology MEMS在射频滤波器中的应用:薄膜体声波技术

Sensors Update Pub Date : 2003-02-01 DOI: 10.1002/SEUP.200390006

R. Aigner

引用次数: 46

Automotive Sensor Market 汽车传感器市场

Sensors Update Pub Date : 2003-02-01 DOI: 10.1002/SEUP.200390007

K. Reinhart, M. Illing

{"title":"Automotive Sensor Market","authors":"K. Reinhart, M. Illing","doi":"10.1002/SEUP.200390007","DOIUrl":"https://doi.org/10.1002/SEUP.200390007","url":null,"abstract":"Since the late 1970s electronic systems have found increasing use in the automobile. The value of electronics in cars has increased from near zero in the 1970s to almost 20% in a 2000 model mid-class car. In luxury cars this content is even higher. At the same time, electronics are responsible for the majority of innovations and thus contribute strongly to differentiate the car from competitor products. Essentially all of the electronics systems — be it engine management, safety systems or convenience features — need one or multiple sensor signals as input to their signal processing. Over 100 different sensor applications in the car are known; a full-featured luxury car typically contains 100 sensors or more. Therefore, the sensor market has seen at least as strong growth rates as the electronics market over the last two decades and will continue to do so for the foreseeable future. This chapter gives an overview of the automotive sensor market. It starts with a general overview of market size and growth and puts it into perspective with other relevant markets such as the general sensor market and the electronics market. The major distinctive features of the automotive market are explained. Another section details some of the major trends in technologies, products and certain regions. Finally, various market segments are highlighted in more detail. In conclusion, an outlook on possible future developments is given.","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"114 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123330053","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Ionomer-coated Electrodes and Nanoelectrode Ensembles as Electrochemical Environmental Sensors: Recent Advances and Prospects 离子包覆电极和纳米电极组合作为电化学环境传感器:最新进展与展望

Sensors Update Pub Date : 2003-02-01 DOI: 10.1002/SEUP.200390004

P. Ugo, L. Moretto, Francesca Vezzà

引用次数: 1