Sensors Update最新文献

筛选
英文 中文
Market Data — Sensors in Household Appliances† 市场数据-家用电器传感器†
Sensors Update Pub Date : 2003-02-01 DOI: 10.1002/SEUP.200390008
G. Tschulena
{"title":"Market Data — Sensors in Household Appliances†","authors":"G. Tschulena","doi":"10.1002/SEUP.200390008","DOIUrl":"https://doi.org/10.1002/SEUP.200390008","url":null,"abstract":"In Europe, the household industry produces millions of washing machines, dishwashers, cookers, refrigerators, home comfort appliances, small appliances, heating and climate control and security and safety-related devices. Here, the use of sensors and microsystem products has a long tradition regarding relatively simple devices, such as temperature sensors or level sensors. However, the rate of introduction of new and improved sensors in household appliances has now increased, and the use of modern sensors with intelligent control systems is a key for differentiation between different appliance products and companies. Therefore, some more general sensor application areas are described, and also specific sensors which have been developed in recent years. Additionally, an outlook is given for possible new products and features which may be introduced in the future.","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115989285","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Modular Microoptical Systems for Sensors and Telecommunication 用于传感器和电信的模块化微光学系统
Sensors Update Pub Date : 2003-02-01 DOI: 10.1002/SEUP.200390005
U. Wallrabe, J. Mohr
{"title":"Modular Microoptical Systems for Sensors and Telecommunication","authors":"U. Wallrabe, J. Mohr","doi":"10.1002/SEUP.200390005","DOIUrl":"https://doi.org/10.1002/SEUP.200390005","url":null,"abstract":"This paper focuses on fabrication and assembly processes of modular and hybrid microoptical systems in use in sensor and telecommunication fields. These microoptical systems are made by a huge variety of processes, which are commonly known as microsystem technology. Nevertheless, quite a lot of them are based on the LIGA process, since LIGA is an “assembly friendly” technology. \u0000 \u0000 \u0000 \u0000Modular microoptical systems typically comprise several functions incorporating mechanical or electromechanical components beside the optical elements. The assembly of the diverse submounts and components is performed actively as well as passively. In many cases, all of these functions can be combined on one single chip. In several cases, however, a pair of chips, which is assembled in a flip-chip like way, is used. \u0000 \u0000 \u0000 \u0000The framework of the paper leads to a definition of the terminus “modular microoptical system” and argues for the advantages of such a modular design approach. It closes with some remarks on automatic assembly strategies.","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121163447","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Large Area Digital X‐ray Imaging 大面积数字X射线成像
Sensors Update Pub Date : 2003-02-01 DOI: 10.1002/SEUP.200390002
S. Tao, K. Karim, P. Servati, Czang-Ho Lee, A. Nathan
{"title":"Large Area Digital X‐ray Imaging","authors":"S. Tao, K. Karim, P. Servati, Czang-Ho Lee, A. Nathan","doi":"10.1002/SEUP.200390002","DOIUrl":"https://doi.org/10.1002/SEUP.200390002","url":null,"abstract":"This chapter reviews amorphous silicon devices for large area flat panel imaging technology. We present Schottky and p-i-n diode image sensors and elaborate on their operating principles, electrical and optoelectronic characteristics including stability, along with the challenges associated with reduction of the dark current. Issues pertinent to sensor-thin film transistor integration for different active matrix pixel architectures for high fill factor imaging arrays are presented along with optimization of materials and processing conditions for reduced threshold voltage shift, reduced parasitics and leakage current, and enhanced mechanical integrity. Extension of the current fabrication processes to low (∼120°C) temperature, enabling fabrication of flexible imaging array (on plastic substrates), is also discussed.","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125635091","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Review: Automatic Model Reduction for Transient Simulation of MEMS‐based Devices 综述:基于MEMS的器件瞬态仿真的自动模型缩减
Sensors Update Pub Date : 2002-12-01 DOI: 10.1002/SEUP.200211105
E. Rudnyi, J. Korvink
{"title":"Review: Automatic Model Reduction for Transient Simulation of MEMS‐based Devices","authors":"E. Rudnyi, J. Korvink","doi":"10.1002/SEUP.200211105","DOIUrl":"https://doi.org/10.1002/SEUP.200211105","url":null,"abstract":"The rapid development of MEMS-based devices requires 3D time-dependent simulations for coupled physical domains (thermal, mechanical, electrical, etc.). This in turn requires the solution of high-dimensional ordinary differential equations (ODEs) that result from space discretization of the device. However, instead of a “brute force” approach to integrate a large system of ODEs, one can use modern mathematical methods to reduce the system's dimension. The goal of the present paper is to review them from an engineering perspective. It is shown that in many cases important for practice the order of ODEs can be reduced by several orders of magnitude almost without sacrificing precision.","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132170020","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 117
Microelectronic Bonding Processes Monitored by Integrated Sensors 集成传感器监测微电子键合过程
Sensors Update Pub Date : 2002-12-01 DOI: 10.1002/SEUP.200211103
M. Mayer, J. Schwizer
{"title":"Microelectronic Bonding Processes Monitored by Integrated Sensors","authors":"M. Mayer, J. Schwizer","doi":"10.1002/SEUP.200211103","DOIUrl":"https://doi.org/10.1002/SEUP.200211103","url":null,"abstract":"Real-time monitoring methods are beneficial for the control, optimization, and failure analysis of microelectronic packaging processes. The focus of this chapter is on the real-time monitoring of two widely used processes, soft solder die bonding and thermosonic ball bonding. The methods presented here use uniquely developed microsensors integrated on custom-made test chips using commercial double-metal CMOS processes. \u0000 \u0000 \u0000 \u0000For the soft solder die bonding process, nine aluminum-based resistive temperature detectors were integrated on various locations on a test chip. The temperature was monitored during the placement of the test chip on the leadframe. The experimental results describe the wetting and spreading effects of the molten solder under the drip. Together with numerical results obtained with a transient thermal finite element model, the beginning of wetting can be quantified. For the soft solder PbSn10, wetting occurred around 30 ms after touch down. This method hence can be used to determine wetting times under different process conditions. The wetting time determines an upper limit of the through put of the process. \u0000 \u0000 \u0000 \u0000For the thermosonic ball bonding process, temperature and force sensors were integrated on test chips. The sensors are aluminum resistors and piezoresistive p+- and n+-diffused resistors placed around bond pads. A bond quality parameter can be derived from the temperature signal variation during bonding. The piezoresistive sensors permit the measurement of forces in the x-, y-, and z-directions simultaneously. The ultrasonic tangential force signal reached a typical value of 0.12 N on a 50μm diameter contact zone and revealed significant process characteristics. Four process phases are identified which are necessary for a successful ball bond formation. These phases are assigned to initial stiction, sliding, bond growth, and deformation effects.","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130610892","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 30
Electronic Tongues and Combinations of Artificial Senses 电子舌头和人工感官的组合
Sensors Update Pub Date : 2002-12-01 DOI: 10.1002/SEUP.200211107
F. Winquist, C. Krantz-Rülcker, I. Lundström
{"title":"Electronic Tongues and Combinations of Artificial Senses","authors":"F. Winquist, C. Krantz-Rülcker, I. Lundström","doi":"10.1002/SEUP.200211107","DOIUrl":"https://doi.org/10.1002/SEUP.200211107","url":null,"abstract":"The technique of electronic tongues or taste sensors has developed very fast during the last years due to its large potential, and the interest for the concept is steadily increasing. In principle, they function in the same way as the electronic nose, but are used in the aqueous phase. In this article, the technique as such is described, as well as different types of electronic tongues, based on potentiometry or voltametry. Also the combination of different artificial senses is discussed. \u0000 \u0000Different sensing principles can be used in electronic tongues or taste sensors, such as electrochemical methods like potentiometry or voltametry, optical methods or measurements of mass changes based on e.g. quartz crystals. The first concept of an electronic tongue or taste sensor was based on ion sensitive lipid membranes and developed to response to the basic tastes of the tongue, that is sour, sweet, bitter, salt and “umami”. It has been further developed and is commercialized. The detecting part is an eight-channel multi sensor, placed on a robot arm and controlled by a computer. This taste sensing system has mainly dealt with discrimination and estimation of the taste of different drinks. \u0000 \u0000An electronic tongue, based on potentiometric sensor arrays of two general kinds, conventionally ones such as pH, sodium and potassium selective electrodes, and specially designed ones, has also been described. This system has been used for recognition of different kinds of drinks such as tea, soft drinks, juices and beers and compounds of relevance for pollution monitoring in river water. \u0000 \u0000The use of voltametry as sensing principle in an electronic tongue has also been developed. This electronic tongue consists of a number of working electrodes made of different materials, a reference electrode and an auxiliary electrode. Different types of pulsed voltametry were applied. Application examples include classification of fruit juices, test for bacterial growth in milk or water quality. \u0000 \u0000A hybrid electronic tongue has also been developed, based on the combination of the measurement techniques potentiometry, voltametry and conductivity. \u0000 \u0000By using a combination of different artificial senses, the analytical capability will be considerably increased. Thus, the combination of an electronic tongue and an electronic nose for classification of different fruit juices was investigated. Furthermore, a special “artificial mouth” or “crush chamber” has been designed, in which information corresponding to three senses could be obtained — “auditory” by a microphone, “tactile” by a force sensor and “olfaction” by a gas sensor array, thus collecting information mimicking these three human sense. In this artificial mouth crispy products could be crushed under controlled conditions to make a complete sensory evaluation, all five human senses are involved. A new approach for the assessment of human based quality evaluation has been obtained by the design of an electronic sensor he","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"221 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116417340","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 31
Nanotube Membrane Sensors: Resistive Sensing and Ion Channel Mimetics 纳米管膜传感器:电阻传感和离子通道模拟
Sensors Update Pub Date : 2002-12-01 DOI: 10.1002/SEUP.200211102
Marc Wirtz, C. Martin
{"title":"Nanotube Membrane Sensors: Resistive Sensing and Ion Channel Mimetics","authors":"Marc Wirtz, C. Martin","doi":"10.1002/SEUP.200211102","DOIUrl":"https://doi.org/10.1002/SEUP.200211102","url":null,"abstract":"Nanotubule membranes are utilized for sensing applications and ion channel mimetics. The nanotubule membranes are composed of either gold or alumina. The gold nanotubule membranes are prepared via electroless deposition of Au on to the pore walls of a polycarbonate membrane, ie, the pores act as templates for the nanotubes. These membranes are a new class of molecular sieves and can be used to separate small molecules on the basis of molecular size. In addition, the use of these membranes in new approaches to electrochemical sensing is discussed. In this case, a current is forced through the nanotubes, and analyte molecules present in a contacting solution phase modulate the value of this transmembrane current. We further discuss synthetic micropore and nanotube membranes that mimic the function of a ligand-gated ion channel, ie, these membranes can be switched from an ‘off’ state (no or low ion current through the membrane) to an ‘on’ state (higher ion current) in response to the presence of a chemical stimulus, eg, drug or surfactant. Ion channel mimics are based on both modified Au nanotube and microporous alumina membranes. \u0000 \u0000 \u0000 \u0000First published online: July 12, 2002.","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128483247","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
Signal Processing Architectures for Chemical Sensing Microsystems 化学传感微系统的信号处理体系结构
Sensors Update Pub Date : 2002-12-01 DOI: 10.1002/SEUP.200211104
D. Wilson, T. Roppel
{"title":"Signal Processing Architectures for Chemical Sensing Microsystems","authors":"D. Wilson, T. Roppel","doi":"10.1002/SEUP.200211104","DOIUrl":"https://doi.org/10.1002/SEUP.200211104","url":null,"abstract":"This paper reviews several levels of signal processing and associated architectures for chemical sensing microsystems that use either arrays of optical or of physical sensors. Many chemical sensors, because of their interaction and vulnerability to the environment, have been eliminated from inclusion in sensing systems that require high precision and accuracy. This discussion evaluates parametric vs. nonparametric techniques and linear vs. nonlinear signal processing approaches for addressing chemical classification problems using imperfect sensing technologies. Hardware implementations of signal processing and biologically inspired signal processing are also reviewed. Future research into the development of more accurate chemical classification systems demands the customization of current approaches, so that underlying principles of chemical sensors and associated interfering influences do not overburden the computational space, thereby allowing higher accuracy rates.","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"84 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115869987","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
CMOS Single Chip Gas Detection Systems — Part I CMOS单芯片气体检测系统。第1部分
Sensors Update Pub Date : 2002-12-01 DOI: 10.1002/SEUP.200211106
C. Hagleitner, A. Hierlemann, O. Brand, H. Baltes
{"title":"CMOS Single Chip Gas Detection Systems — Part I","authors":"C. Hagleitner, A. Hierlemann, O. Brand, H. Baltes","doi":"10.1002/SEUP.200211106","DOIUrl":"https://doi.org/10.1002/SEUP.200211106","url":null,"abstract":"Sensor arrays based on industrial CMOS-technology combined with post-CMOS micromachining (CMOS MEMS) are a promising approach to low-cost sensors. In the first part of this article [1], the state of research on CMOS-based gas sensor systems was reviewed, and a platform technology for monolithic integration of three different transducers on a single chip was described. In this second part, the transduction principles of three polymer-based gas sensors are detailed and the read-out circuitry is portrayed. The first transducer is a micromachined resonant cantilever. The absorption of analyte in the chemically sensitive polymer causes shifts in resonance frequency as a consequence of changes in the oscillating mass. The cantilever acts as the frequency-determining element in an oscillator circuit, and the resulting frequency change is read out by an on-chip counter. The second transducer is a planar capacitor with polymer-coated interdigitated electrodes. This transducer monitors changes in the dielectric constant upon absorption of the analyte into the polymer matrix. The sensor response is read out as a differential signal between the coated sensing capacitor and a passivated reference capacitor, both of which are incorporated into the input stage of a switched capacitor second-order ΣΔ-modulator. The third transducer is a thermoelectric calorimeter, which detects enthalpy changes upon ab-/desorption of analyte molecules into a polymer film located on a thermally insulated membrane. The enthalpy changes in the polymer film cause transient temperature variations, which are detected via polysilicon/aluminum thermocouples (Seebeck effect). The small signals in the μV-range are first amplified with a low-noise chopper amplifier, then converted to a digital signal using a ΣΔ-A/D-converter and finally decimated and filtered with a digital decimation filter.","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127275749","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 32
Glucose Biosensors: 40 Years of Advances and Challenges 葡萄糖生物传感器:40年的进步与挑战
Sensors Update Pub Date : 2001-08-01 DOI: 10.1002/1616-8984(200201)10:1<107::AID-SEUP107>3.0.CO;2-Q
Joseph Wang
{"title":"Glucose Biosensors: 40 Years of Advances and Challenges","authors":"Joseph Wang","doi":"10.1002/1616-8984(200201)10:1<107::AID-SEUP107>3.0.CO;2-Q","DOIUrl":"https://doi.org/10.1002/1616-8984(200201)10:1<107::AID-SEUP107>3.0.CO;2-Q","url":null,"abstract":"Forty years have passed since Clark and Lyons proposed the concept of glucose enzyme electrodes. Excellent economic prospects and fascinating potential for basic research have led to many sensor designs and detection principles for the biosensing of glucose. Indeed, the entire field of biosensors can trace its origin to this glucose enzyme electrode. This review examines the history of electrochemical glucose biosensors, discusses their current status and assesses future prospects in connection primarily to the control and management of diabetes.","PeriodicalId":154848,"journal":{"name":"Sensors Update","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133980393","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 193
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信