Modular Microoptical Systems for Sensors and Telecommunication

Abstract

This paper focuses on fabrication and assembly processes of modular and hybrid microoptical systems in use in sensor and telecommunication fields. These microoptical systems are made by a huge variety of processes, which are commonly known as microsystem technology. Nevertheless, quite a lot of them are based on the LIGA process, since LIGA is an “assembly friendly” technology. Modular microoptical systems typically comprise several functions incorporating mechanical or electromechanical components beside the optical elements. The assembly of the diverse submounts and components is performed actively as well as passively. In many cases, all of these functions can be combined on one single chip. In several cases, however, a pair of chips, which is assembled in a flip-chip like way, is used. The framework of the paper leads to a definition of the terminus “modular microoptical system” and argues for the advantages of such a modular design approach. It closes with some remarks on automatic assembly strategies.