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2008 12th IEEE Workshop on Signal Propagation on Interconnects最新文献

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Behavioral Models of Input/Output Buffers Including Core Noise Coupling 包括核心噪声耦合的输入/输出缓冲器行为模型
2008 12th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2008-05-12 DOI: 10.1109/SPI.2008.4558343
I. Stievano, C. Siviero, F. Canavero, I. Maio
{"title":"Behavioral Models of Input/Output Buffers Including Core Noise Coupling","authors":"I. Stievano, C. Siviero, F. Canavero, I. Maio","doi":"10.1109/SPI.2008.4558343","DOIUrl":"https://doi.org/10.1109/SPI.2008.4558343","url":null,"abstract":"This paper addresses the generation of enhanced models of the input/output buffers of digital integrated circuits. The proposed models overcome the current limitations of the state-of-the-art models and can be obtained from device port transient responses only. They can be effectively implemented as SPICE subcircuits in any commercial tool for signal integrity or core noise simulations.","PeriodicalId":142239,"journal":{"name":"2008 12th IEEE Workshop on Signal Propagation on Interconnects","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115035518","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
PLL Jitter Analysis with Various Power Delivery Networks on a Board 电路板上各种供电网络的锁相环抖动分析
2008 12th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2008-05-12 DOI: 10.1109/SPI.2008.4558358
Young-Sang Son, Ji-Hoon Lim, Jin-Yong Jeon, W. Jung, Seongsoo Lee, J. Wee
{"title":"PLL Jitter Analysis with Various Power Delivery Networks on a Board","authors":"Young-Sang Son, Ji-Hoon Lim, Jin-Yong Jeon, W. Jung, Seongsoo Lee, J. Wee","doi":"10.1109/SPI.2008.4558358","DOIUrl":"https://doi.org/10.1109/SPI.2008.4558358","url":null,"abstract":"Increasing frequency and reducing time margin have made desigen of power delivery neworks (PDNs) on board to be an integral part of chip designs. Power delivery network designs are usually achieved by mounting the decoupling capacitors on power plates so that the designed power impedance is relatively lower on the interested frequency ranges. But, some parts out of frequency-dependant impedance profile of power delivery networks that make the major effect on noise performances of digital, RF, and analog chips does not be very clear according to chip's family. In this paper, we demonstrate the analysis of power delivery networks for the multiple voltage domains on an analog PLL jitter performance. We look for self impedances of chip mounted on board according to decoupling capacitor's size, their positions, and DC-DC chip. We analyze the PLL's jitter characteristics depending on self-impedance profiles for core and IO circuit. Through this work, it is clear that the PDNs design concept which is considering inherent operation characteristics should be adapted for the efficient and costive system.","PeriodicalId":142239,"journal":{"name":"2008 12th IEEE Workshop on Signal Propagation on Interconnects","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115036044","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A New miniaturized Planar Electromagnetic Bandgap (EBG) Structure with Dual Slits 一种新型小型化平面双狭缝电磁带隙结构
2008 12th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2008-05-12 DOI: 10.1109/SPI.2008.4558370
S. Farzan, A. Sankar
{"title":"A New miniaturized Planar Electromagnetic Bandgap (EBG) Structure with Dual Slits","authors":"S. Farzan, A. Sankar","doi":"10.1109/SPI.2008.4558370","DOIUrl":"https://doi.org/10.1109/SPI.2008.4558370","url":null,"abstract":"This paper proposes a new planar EBG structure with dual slits included into the large metal patches and small connecting branches that connect adjacent EBG cells in the power/ground (P/G) plane pair. The paper then lunges into the study of a tuning method, to achieve isolation at the frequency of interest by scaling the extents of either of the slits in the proposed Dual Slits EBG (DS-EBG) structure without scaling the entire geometry. Further this paper investigates the bandwidth optimization method without affecting the center frequency of interest and the size of the metal patches. This paper supports the proposal with simulation results and measurements made on the proposed structure with unit cell size of 5.4 mm times 5.4 mm, the center frequency was tuned from 1.7 to over 6 GHz. The bandgap was widened to 2 GHz against the original bandgap of 1 GHz without changing the size of the DS-EBG structure for a given center frequency of 2.4 GHz, by using the bandwidth optimization method proposed.","PeriodicalId":142239,"journal":{"name":"2008 12th IEEE Workshop on Signal Propagation on Interconnects","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124030713","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Crosstalk Noise Reduction Techniques Using SOI Substrate 基于SOI衬底的串扰降噪技术
2008 12th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2008-05-12 DOI: 10.1109/SPI.2008.4558399
F. Hasani, N. Masoumi, B. Forouzandeh
{"title":"Crosstalk Noise Reduction Techniques Using SOI Substrate","authors":"F. Hasani, N. Masoumi, B. Forouzandeh","doi":"10.1109/SPI.2008.4558399","DOIUrl":"https://doi.org/10.1109/SPI.2008.4558399","url":null,"abstract":"As integrated circuits (ICs) are scaled into nanometre dimensions and operate in gigahertz frequencies, interconnects have become critical in determining system performance and reliability. In this paper we propose a new approach to investigate crosstalk reduction techniques using Silicon On Insulator (SOI) substrate. Coupling through common silicon substrate has become an important limiting factor in high performance ICs. A study of the advantages of using SOI substrate in contrast to bulk is presented in this paper. Through MATLAB software, a system of three coupled wires is modeled as RC distributed networks. A resistive model is used to model both SOI and bulk substrates. The results are compared to the bulk in order to show the advantages of using SOI substrate to reduce crosstalk noise in deep sub micron technology.","PeriodicalId":142239,"journal":{"name":"2008 12th IEEE Workshop on Signal Propagation on Interconnects","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125900574","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Use of the SPP Technique to Account for Inhomogeneities in Differential Printed-Circuit-Board Wiring 使用SPP技术来解释差分印刷电路板布线中的不均匀性
2008 12th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2008-05-12 DOI: 10.1109/SPI.2008.4558375
A. Deutsch, R. Krabbenhoft, C. Surovic, B. Rubin, T. Winkel
{"title":"Use of the SPP Technique to Account for Inhomogeneities in Differential Printed-Circuit-Board Wiring","authors":"A. Deutsch, R. Krabbenhoft, C. Surovic, B. Rubin, T. Winkel","doi":"10.1109/SPI.2008.4558375","DOIUrl":"https://doi.org/10.1109/SPI.2008.4558375","url":null,"abstract":"The short-pulse propagation (SPP) time-domain technique is shown to be able to easily account for the inhomogeneities found in typical printed-circuit-board wiring. SPP is used to generate broadband predictive models for differential lines with different glass-fiber-to-epoxy-resin ratios and also for the soldermask layers used on top and bottom of typical boards. In both cases, a two-step extraction procedure is employed to obtain the broadband complex permittivity for the inhomogeneous structures and correlation with TDT measurements is used to validate the technique. Some examples of the effect of using different epoxy resin contents on the total loss are shown for 7.0 mil and 10.0 mil pitch differential wiring.","PeriodicalId":142239,"journal":{"name":"2008 12th IEEE Workshop on Signal Propagation on Interconnects","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114964620","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Domain Decomposition via Electromagnetic Hooks for the Modeling of Complete RF blocks 基于电磁钩子的区域分解技术在射频模块建模中的应用
2008 12th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2008-05-12 DOI: 10.1109/SPI.2008.4558351
J. Niehof, H. Janssen, W. Schilders, W. Schoenmaker, D. Ioan, G. Ciuprina, W. Pflanzl
{"title":"Domain Decomposition via Electromagnetic Hooks for the Modeling of Complete RF blocks","authors":"J. Niehof, H. Janssen, W. Schilders, W. Schoenmaker, D. Ioan, G. Ciuprina, W. Pflanzl","doi":"10.1109/SPI.2008.4558351","DOIUrl":"https://doi.org/10.1109/SPI.2008.4558351","url":null,"abstract":"To cope with the complexity and size of modern RF SoC designs, a new type of domain decomposition has been developed that makes use of electric and magnetic connectors. This new concept has been tested on a number of practical examples that are all produced and measured within the project. To illustrate the success of the algorithm, it is applied to a set of coupled integrated inductors, and results are compared with measurements and simulations using tools from MAGWEL and Agilent (Momentum). Domain decomposition is a powerful method to enable accurate electromagnetic simulation of complex, large layouts. The accuracy / simulation speed trade off is conveniently controlled by the number of hooks on the decomposition interface.","PeriodicalId":142239,"journal":{"name":"2008 12th IEEE Workshop on Signal Propagation on Interconnects","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121715969","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Electromagnetic analysis of RF interconnect 射频互连的电磁分析
2008 12th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2008-05-12 DOI: 10.1109/SPI.2008.4558376
Y. C. Mombo Boussougou, T. Le Gouguec, Y. Quéré, D. Le Berre, P. Martin, F. Huret
{"title":"Electromagnetic analysis of RF interconnect","authors":"Y. C. Mombo Boussougou, T. Le Gouguec, Y. Quéré, D. Le Berre, P. Martin, F. Huret","doi":"10.1109/SPI.2008.4558376","DOIUrl":"https://doi.org/10.1109/SPI.2008.4558376","url":null,"abstract":"Today, the performances of integrated electronic circuits are limited by global interconnects. To achieve in performance, one needs to consider new solutions to carry the information in the chips or along the system. This communication deals with the study of RF interconnects, which is among the options under discussion within the ITRS [1]. At first, we recall the concept of RF interconnects to further illustrate it in the case of 4-bit transmission. Then, we calculate the transfer function of a complete RF interconnect to identify the parameters to be optimized, in order to increase the gain and obtain relative plane curves over a wide frequency band. Finally, we conduct on electromagnetic study of various coupling options that can be expected when using the available technologies.","PeriodicalId":142239,"journal":{"name":"2008 12th IEEE Workshop on Signal Propagation on Interconnects","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116216060","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Parasitic influence, on signal integrity, of several victim lines placed asymmetrically beside and symmetrically at both sides of an attacker interconnect and mutually 对信号完整性的寄生影响，不对称地放置在攻击者旁边和对称地放置在攻击者两侧的几条受害线相互互连
2008 12th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2008-05-12 DOI: 10.1109/SPI.2008.4558392
F. Ponchel, J. Legier, E. Paleczny, C. Seguinot, D. Deschacht
{"title":"Parasitic influence, on signal integrity, of several victim lines placed asymmetrically beside and symmetrically at both sides of an attacker interconnect and mutually","authors":"F. Ponchel, J. Legier, E. Paleczny, C. Seguinot, D. Deschacht","doi":"10.1109/SPI.2008.4558392","DOIUrl":"https://doi.org/10.1109/SPI.2008.4558392","url":null,"abstract":"Far end crosstalk on victim lines located near an aggressor as well as rise time and propagation delay at the end of the attacker are evaluated. It is done thanks to a home made software based on full wave electromagnetic finite element and transient analysis simulation. These investigations are carried out when the aggressor lossy interconnect of less than one micron square area is symmetrically and asymmetrically placed in an arrangement of three, five and eight copper lossy lines, in case of low, medium and strong mutual effects. Our signal integrity points out that two neighbour lines on both sides of an active interconnect (i.e. the aggressor) are a good compromise to understand more complicated situation on greatest number of unintentionally coupled interconnects. We have verified this fact even in case of small spacing or high permittivity material which filled partially the spacing between interconnects (i.e. strong mutual effects).","PeriodicalId":142239,"journal":{"name":"2008 12th IEEE Workshop on Signal Propagation on Interconnects","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121464184","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Blackbox Macromodel with S-Parameters and Fast Convolution 具有s参数和快速卷积的黑盒宏模型
2008 12th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2008-05-12 DOI: 10.1109/SPI.2008.4558338
J. Schutt-Ainé, Jilin Tan, C. Kumar, F. Al-Hawari
{"title":"Blackbox Macromodel with S-Parameters and Fast Convolution","authors":"J. Schutt-Ainé, Jilin Tan, C. Kumar, F. Al-Hawari","doi":"10.1109/SPI.2008.4558338","DOIUrl":"https://doi.org/10.1109/SPI.2008.4558338","url":null,"abstract":"In this paper, the scattering parameters of blackbox multi-port networks are pre-processed in the frequency domain to satisfy causality. Next, they are approximated to yield weighted delta functions in the time domain thus allowing the fast simulation. The resulting procedure leads to a robust, accurate and efficient macromodel generation scheme.","PeriodicalId":142239,"journal":{"name":"2008 12th IEEE Workshop on Signal Propagation on Interconnects","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116824294","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
MOCHA, MOdelling and CHAracterization for SiP -Signal and Power Integrity Analysis MOCHA, SiP信号和功率完整性分析的建模和表征
2008 12th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2008-05-12 DOI: 10.1109/SPI.2008.4558357
A. Girardi, A. Conci, R. Izzi, T. Lessio, F. Canavero, I. Stievano, H. Dudek, D. Hardisty, M. Tarantini, M. Dieudonné, J. V. Hese, T. Cunha, Jose C. Pedro, Christophe Gaquiere, N. Vellas
{"title":"MOCHA, MOdelling and CHAracterization for SiP -Signal and Power Integrity Analysis","authors":"A. Girardi, A. Conci, R. Izzi, T. Lessio, F. Canavero, I. Stievano, H. Dudek, D. Hardisty, M. Tarantini, M. Dieudonné, J. V. Hese, T. Cunha, Jose C. Pedro, Christophe Gaquiere, N. Vellas","doi":"10.1109/SPI.2008.4558357","DOIUrl":"https://doi.org/10.1109/SPI.2008.4558357","url":null,"abstract":"This paper describes the research activity that is being carried out in the MOCHA project, a cooperative R&D effort at the European scale. The aim of the project is to develop reliable modelling and simulation solutions for SiP design verification.","PeriodicalId":142239,"journal":{"name":"2008 12th IEEE Workshop on Signal Propagation on Interconnects","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131957935","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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