Y. C. Mombo Boussougou, T. Le Gouguec, Y. Quéré, D. Le Berre, P. Martin, F. Huret
{"title":"射频互连的电磁分析","authors":"Y. C. Mombo Boussougou, T. Le Gouguec, Y. Quéré, D. Le Berre, P. Martin, F. Huret","doi":"10.1109/SPI.2008.4558376","DOIUrl":null,"url":null,"abstract":"Today, the performances of integrated electronic circuits are limited by global interconnects. To achieve in performance, one needs to consider new solutions to carry the information in the chips or along the system. This communication deals with the study of RF interconnects, which is among the options under discussion within the ITRS [1]. At first, we recall the concept of RF interconnects to further illustrate it in the case of 4-bit transmission. Then, we calculate the transfer function of a complete RF interconnect to identify the parameters to be optimized, in order to increase the gain and obtain relative plane curves over a wide frequency band. Finally, we conduct on electromagnetic study of various coupling options that can be expected when using the available technologies.","PeriodicalId":142239,"journal":{"name":"2008 12th IEEE Workshop on Signal Propagation on Interconnects","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Electromagnetic analysis of RF interconnect\",\"authors\":\"Y. C. Mombo Boussougou, T. Le Gouguec, Y. Quéré, D. Le Berre, P. Martin, F. Huret\",\"doi\":\"10.1109/SPI.2008.4558376\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Today, the performances of integrated electronic circuits are limited by global interconnects. To achieve in performance, one needs to consider new solutions to carry the information in the chips or along the system. This communication deals with the study of RF interconnects, which is among the options under discussion within the ITRS [1]. At first, we recall the concept of RF interconnects to further illustrate it in the case of 4-bit transmission. Then, we calculate the transfer function of a complete RF interconnect to identify the parameters to be optimized, in order to increase the gain and obtain relative plane curves over a wide frequency band. Finally, we conduct on electromagnetic study of various coupling options that can be expected when using the available technologies.\",\"PeriodicalId\":142239,\"journal\":{\"name\":\"2008 12th IEEE Workshop on Signal Propagation on Interconnects\",\"volume\":\"35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-05-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 12th IEEE Workshop on Signal Propagation on Interconnects\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPI.2008.4558376\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 12th IEEE Workshop on Signal Propagation on Interconnects","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2008.4558376","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Today, the performances of integrated electronic circuits are limited by global interconnects. To achieve in performance, one needs to consider new solutions to carry the information in the chips or along the system. This communication deals with the study of RF interconnects, which is among the options under discussion within the ITRS [1]. At first, we recall the concept of RF interconnects to further illustrate it in the case of 4-bit transmission. Then, we calculate the transfer function of a complete RF interconnect to identify the parameters to be optimized, in order to increase the gain and obtain relative plane curves over a wide frequency band. Finally, we conduct on electromagnetic study of various coupling options that can be expected when using the available technologies.