射频互连的电磁分析

Y. C. Mombo Boussougou, T. Le Gouguec, Y. Quéré, D. Le Berre, P. Martin, F. Huret
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引用次数: 9

摘要

今天,集成电子电路的性能受到全球互连的限制。为了提高性能,需要考虑新的解决方案,以便在芯片中或沿着系统携带信息。本通讯涉及射频互连的研究,这是ITRS[1]正在讨论的选项之一。首先,我们回顾射频互连的概念,以便在4位传输的情况下进一步说明它。然后,我们计算了一个完整的射频互连的传递函数,以确定需要优化的参数,以增加增益并获得宽频带内的相对平面曲线。最后,我们对使用现有技术时可能出现的各种耦合选项进行了电磁研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electromagnetic analysis of RF interconnect
Today, the performances of integrated electronic circuits are limited by global interconnects. To achieve in performance, one needs to consider new solutions to carry the information in the chips or along the system. This communication deals with the study of RF interconnects, which is among the options under discussion within the ITRS [1]. At first, we recall the concept of RF interconnects to further illustrate it in the case of 4-bit transmission. Then, we calculate the transfer function of a complete RF interconnect to identify the parameters to be optimized, in order to increase the gain and obtain relative plane curves over a wide frequency band. Finally, we conduct on electromagnetic study of various coupling options that can be expected when using the available technologies.
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