Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.最新文献

Environmental Assessment of SWNT Production SWNT生产环境评估

Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. Pub Date : 2006-05-08 DOI: 10.1109/ISEE.2006.1650028

J. Isaacs, A. Tanwani, M. Healy

引用次数: 38

Environmental Conservation Through Lead-Free Electronics Manufacturing 通过无铅电子制造来保护环境

Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. Pub Date : 2006-05-08 DOI: 10.1109/ISEE.2006.1650059

S. Ng, A. Vaidya, V. Venkataraman, B. Murcko, K. Srihari, R. Rai

引用次数: 1

Integrating End-of-Life Evaluation in Conceptual Design 在概念设计中整合生命终结评估

Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. Pub Date : 2006-05-08 DOI: 10.1109/ISEE.2006.1650069

C. Herrmann, A. Frad, T. Luger, F. Krause, Z. Ragan

引用次数: 11

Evaluation of Metal Leaching from End-of-Life Laptop Computers Using the TCLP and Other Standard Leaching Tests 使用TCLP和其他标准浸出试验评价报废笔记本电脑的金属浸出

Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. Pub Date : 2006-05-08 DOI: 10.1109/ISEE.2006.1650082

Y. Jang, T. Townsend, Hyunmyung Yoon

{"title":"Evaluation of Metal Leaching from End-of-Life Laptop Computers Using the TCLP and Other Standard Leaching Tests","authors":"Y. Jang, T. Townsend, Hyunmyung Yoon","doi":"10.1109/ISEE.2006.1650082","DOIUrl":"https://doi.org/10.1109/ISEE.2006.1650082","url":null,"abstract":"The proper management of discarded electronic devices (often called electronic waste) is an emerging issue for solid waste professionals throughout the world because of the large growth of the waste stream, and the content of toxic metals in them, most notably heavy metals such as lead. Laptop computers are becoming one of the components of discarded electronic devices and will continue to increase in the waste stream in the future. The objective of this study was to examine leaching potential of metals from discarded laptop computers using the scale-up toxicity characteristic leaching procedure (TCLP), other standard leaching tests such as California waste extraction test (Cal WET), and the synthetic precipitation leaching procedure (SPLP) and actual landfill leachates as leaching solution. The results showed that the scale-up TCLP resulted in relatively high lead found in the leachate with an average of 23.3 mg/L. The average level was less than those by the standard TCLP and WET (37.0 mg/L and 86.0 mg/L, respectively), but much greater than those by the SPLP and the extractions with the landfill leachates (0.55 mg/L and 1.47 mg/L, respectively). All other target metals (Ag, As, Ba, Cd, Cr, Hg, Se) were found to be either less than or close to their detection limits. The pH of the leaching solution and the ability of the organic acids in the TCLP and WET to complex with lead were identified as major factors that controlled the amount of lead leached from laptop computers","PeriodicalId":141255,"journal":{"name":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","volume":"303 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128626280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Novel nanotechnology for environmentally friendly interconnect materials in microelectronic packaging applications 微电子封装应用中环保互连材料的新型纳米技术

Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. Pub Date : 2006-05-08 DOI: 10.1109/ISEE.2006.1650027

Yi Li, K. Moon, C. Wong

{"title":"Novel nanotechnology for environmentally friendly interconnect materials in microelectronic packaging applications","authors":"Yi Li, K. Moon, C. Wong","doi":"10.1109/ISEE.2006.1650027","DOIUrl":"https://doi.org/10.1109/ISEE.2006.1650027","url":null,"abstract":"Recently, anisotropic conductive adhesives (ACAs) have attracted increasing interests as environmentally friendly materials in electronic packaging industry because they are lead-free, require fewer processing steps, such as fluxing and cleaning (reducing processing cost), allow a low processing temperature (enabling the use of heat-sensitive and low-cost components and substrates), and fine pitch interconnect capability (enabling the miniaturization of electronic devices). In this study, effects of nano silver (Ag) particles on electrical properties of ACA formulations were firstly investigated. It is discovered that nano silver (Ag) particles exhibited sintering behavior at significantly lower temperatures (<200°C) than the melting point (Tm of Ag is 960°C). The sintered nano Ag particles significantly reduced the ACA joint resistance and enhanced the current carrying capability of ACAs. In addition, a novel approach of self-assembled monolayers (SAMs) was used to treat nano Ag fillers to improve the interface properties of ACA joints. These SAM-treated ACAs were thermally stable at processing temperatures of the ACA samples. By introducing the novel SAM materials into the interfaces between nano metal fillers and the substrate bond pads, the conductivity and current carrying capability of ACAs were further improved due to the stronger bonding between nano fillers and SAM and consequently, it improved interface properties of the high performance ACA for potential microprocessor applications. This improvement enabled the possibility of replacing lead-containing solder interconnects in electronic industry.","PeriodicalId":141255,"journal":{"name":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128665858","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Technological Use Histories for Solder Metals 焊接金属的技术使用历史

Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. Pub Date : 2006-05-08 DOI: 10.1109/ISEE.2006.1650061

T. Graedel, J. Dong, Mao Jiansu

引用次数: 2

Improving metal returns and eco-efficiency in electronics recycling - a holistic approach for interface optimisation between pre-processing and integrated metals smelting and refining 提高金属回收和电子回收的生态效率-预处理和综合金属冶炼和精炼之间界面优化的整体方法

Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. Pub Date : 2006-05-08 DOI: 10.1109/ISEE.2006.1650064

C. Hagelűken

引用次数: 184

Functionality Test of End-of-Life TFT LCD Panels 报废TFT液晶面板的功能测试

Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. Pub Date : 2006-05-08 DOI: 10.1109/ISEE.2006.1650090

R. Ladanyi, P. Miklosi

引用次数: 4

Environmental Impacts On HydroPower Solution Selection 环境对水电解决方案选择的影响

Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. Pub Date : 2006-05-08 DOI: 10.1109/ISEE.2006.1650095

S. Stevović, Z. Durovic

引用次数: 1

Alternative Power Generation Technologies: Use of Distributed Power for Telecommunications Facilities and Operations 替代发电技术:分布式电力在电信设施和运营中的应用

Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. Pub Date : 2006-05-08 DOI: 10.1109/ISEE.2006.1650036

N. Darghouth, M. Blazek, D. Kammen

引用次数: 1