焊接金属的技术使用历史

Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. Pub Date : 2006-05-08 DOI:10.1109/ISEE.2006.1650061

T. Graedel, J. Dong, Mao Jiansu

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引用次数: 2

摘要

欧洲的立法以及工业和消费者的压力导致了从传统锡铅焊料到无铅焊料的转变。在这项工作中，我们研究了电子焊料中使用或考虑使用的五种金属:锡和铅(传统的焊料金属)，铜和银(大多数无铅焊料中添加到锡中的金属)，以及铋(一些特种焊料的成分)。使用的历史，目前的使用，以及过渡到无铅焊料的潜在影响是讨论的主要主题

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Technological Use Histories for Solder Metals

Legislation in Europe as well as industry and consumer pressure has caused a shift from traditional tin-lead solder to lead-free solder. In this work, we examine five metals used or contemplated for use in electronic solders: tin and lead (the traditional solder metals), copper and silver (the metals added to tin in most non-leaded solders), and bismuth (a constituent of some specialty solders). History of use, current use, and potential effects of a transition to lead-free solder are the main topics of discussion

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Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.

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