通过无铅电子制造来保护环境

Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. Pub Date : 2006-05-08 DOI:10.1109/ISEE.2006.1650059

S. Ng, A. Vaidya, V. Venkataraman, B. Murcko, K. Srihari, R. Rai

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引用次数: 1

摘要

本文讨论了一个研究项目，以减少并随后消除在一个特定的电子制造商对环境有害的材料。在与这个工业合作伙伴(一家基板和印刷电路板组件制造商)的合作中，我们的目标是找到一种合适的无铅替代品来替代目前的SnPb合金，并确定替代的无铅组件。此策略可以作为跨电子制造服务(或EMS)提供商范围的类似计划的蓝图。锡膏的评估和选择是非常重要的，文献中充满了关于锡膏的关键性质及其对良率和焊点可靠性的影响的文章

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Environmental Conservation Through Lead-Free Electronics Manufacturing

This paper discusses a research project to reduce and subsequently eliminate environmentally hazardous materials at a particular electronics manufacturer. In working with this industrial partner (a manufacturer of substrates and printed circuit board assemblies), the goal was to find a suitable lead-free alternative to the present SnPb alloy and also identify alternative lead free components. This strategy can serve as a blueprint for similar initiatives across the electronics manufacturing service (or EMS) provider spectrum. The evaluation and selection of a solder paste is extremely important and literature is replete with articles that address the critical nature of solder paste and its affect on yield and solder joint reliability

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Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.

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