S. Ng, A. Vaidya, V. Venkataraman, B. Murcko, K. Srihari, R. Rai
{"title":"Environmental Conservation Through Lead-Free Electronics Manufacturing","authors":"S. Ng, A. Vaidya, V. Venkataraman, B. Murcko, K. Srihari, R. Rai","doi":"10.1109/ISEE.2006.1650059","DOIUrl":null,"url":null,"abstract":"This paper discusses a research project to reduce and subsequently eliminate environmentally hazardous materials at a particular electronics manufacturer. In working with this industrial partner (a manufacturer of substrates and printed circuit board assemblies), the goal was to find a suitable lead-free alternative to the present SnPb alloy and also identify alternative lead free components. This strategy can serve as a blueprint for similar initiatives across the electronics manufacturing service (or EMS) provider spectrum. The evaluation and selection of a solder paste is extremely important and literature is replete with articles that address the critical nature of solder paste and its affect on yield and solder joint reliability","PeriodicalId":141255,"journal":{"name":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","volume":"47 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEE.2006.1650059","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper discusses a research project to reduce and subsequently eliminate environmentally hazardous materials at a particular electronics manufacturer. In working with this industrial partner (a manufacturer of substrates and printed circuit board assemblies), the goal was to find a suitable lead-free alternative to the present SnPb alloy and also identify alternative lead free components. This strategy can serve as a blueprint for similar initiatives across the electronics manufacturing service (or EMS) provider spectrum. The evaluation and selection of a solder paste is extremely important and literature is replete with articles that address the critical nature of solder paste and its affect on yield and solder joint reliability