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2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)最新文献

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Improved binary HOG algorithm and possible applications in car detection 改进的二进制HOG算法及其在汽车检测中的应用
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259907
M. Ilas
{"title":"Improved binary HOG algorithm and possible applications in car detection","authors":"M. Ilas","doi":"10.1109/SIITME.2017.8259907","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259907","url":null,"abstract":"In this paper we investigate how the HOG algorithm can be successfully modified to work on binary information. We detail the area and the performance evolution when the standard HOG algorithm is adjusted to work on binary images, and introduce an improved binary HOG algorithm. Compared to the HOG working on grayscale images, the improved binary HOG has an extremely small implementation area. Its performance is practically identical to that of the original HOG working on binary images, but reduced compared to that working on grayscale images. Given its extremely small area, the new algorithm can be acceptable for many applications, or it can be used in more complex systems, as part of a preliminary detection stage.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128593599","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Simulation model for automotive high pressure fuel pump 汽车高压燃油泵仿真模型
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259897
László Molnár, A. Gontean, Aurelian Kotlar, P. Svasta
{"title":"Simulation model for automotive high pressure fuel pump","authors":"László Molnár, A. Gontean, Aurelian Kotlar, P. Svasta","doi":"10.1109/SIITME.2017.8259897","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259897","url":null,"abstract":"In this paper we present general details about Gasoline Direct Injection system for passenger vehicles with focus to the High Pressure Fuel Pump (HPFP). Main goal of our work is to determine a reliable and accurate electrical simulation model intended to run in Synopsys Saber™ mixed domain simulator [1], to enhance, optimize and improve the cost of the electronic control circuit driving the pump, while covering functionality in worst case scenarios.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125546035","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Temperature sensitive active tamper detection circuit 温度敏感有源篡改检测电路
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259885
D. Vasile, P. Svasta
{"title":"Temperature sensitive active tamper detection circuit","authors":"D. Vasile, P. Svasta","doi":"10.1109/SIITME.2017.8259885","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259885","url":null,"abstract":"Electronic modules designed for processing sensitive data, such as cryptographic modules, firmware solutions protected by intellectual property rights and secure communication devices, use special circuits designed for protecting these solutions from unauthorized physical access. The main components of these circuits are the conductive mesh structure, which acts as a protective cover, and the active tamper detection circuit. Besides the physical attacks, there are side channel attacks, where an attacker takes advantage of the errors produced by the logic circuits functioning in extreme conditions. When logic circuits are subject of temperatures that exceed the operational limits, they may run with faults and create proper conditions for cryptographic attacks. This paper proposes an active tamper detection circuit that analyses the temperature (and its variation gradient) of the conductive mesh. This method improves and complements the protection functions of the active tamper detection circuits.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116920389","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Presilicon evaluation on correlation power analysis attacks and countermeasures 相关功率分析攻击与对策的预估
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259915
B. Damian, Z. Hascsi, A. Sandulescu
{"title":"Presilicon evaluation on correlation power analysis attacks and countermeasures","authors":"B. Damian, Z. Hascsi, A. Sandulescu","doi":"10.1109/SIITME.2017.8259915","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259915","url":null,"abstract":"Side channel attacks can retrieve sensitive information from secured chips without any invasive procedures. Such a powerful attack is the Correlation Power Analysis (CPA), which makes use of the power traces to gain information regarding the processed data. This paper investigates its efficiency, having different FPGAs under test. The main characteristics of a suitable test environment are highlighted. Additionally, this paper proposes a countermeasure against this type of attack.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124558388","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Microcontroller system for control of the harvester's header propulsion with BLDC motor 微控制器系统控制收割机的头部推进与无刷直流电机
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259879
S. Kadirova, T. Nenov
{"title":"Microcontroller system for control of the harvester's header propulsion with BLDC motor","authors":"S. Kadirova, T. Nenov","doi":"10.1109/SIITME.2017.8259879","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259879","url":null,"abstract":"The reduction of both pollution emissions and fossil fuel dependency has become an objective of energy policies worldwide. In the current research an electronic propulsion system to drive the harvester header with BLDC motor instead of by a hydraulic motor has been develop, on the base of the analysis and comparison of the existing propulsion systems. The electronic system has been practically realized, as both simulation and experimental investigations have been implemented.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129143608","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Hardware in the loop simulation platform for intelligent transport systems 智能交通系统硬件在环仿真平台
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259901
F. Nemtanu, I. Costea, D. Buretea, Luigi-Gabriel OBREJA
{"title":"Hardware in the loop simulation platform for intelligent transport systems","authors":"F. Nemtanu, I. Costea, D. Buretea, Luigi-Gabriel OBREJA","doi":"10.1109/SIITME.2017.8259901","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259901","url":null,"abstract":"The paper presents the main components for a hybrid system used in ITS domain for implementing hardware in the loop simulation. This type of simulation is used especially for systems characterized by high complexity as well as a high level of safety in operation and during maintenance activities. The authors describe the procedure to test different components of an ITS system and exemplify this type of simulation using LabVIEW environment and DAQ boards. The platform for hardware in the loop is developed in LabView environment and various sensors were integrated in the platform. The platform and the research are focused on safety functions more than any other function of the intelligent transport systems.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127614915","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Time measurement techniques for microcontroller performance analysis 微控制器性能分析的时间测量技术
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259853
Alexandru Buturugă, R. Constantinescu, Dan Stoichescu
{"title":"Time measurement techniques for microcontroller performance analysis","authors":"Alexandru Buturugă, R. Constantinescu, Dan Stoichescu","doi":"10.1109/SIITME.2017.8259853","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259853","url":null,"abstract":"The most frequent performance evaluation for a CPU (Central Processing Unit), be it a standalone CPU or a microcontroller integrated CPU, is the amount of time needed to perform a certain task or to execute a certain algorithm. This paper presents an analysis of different time measurement techniques for microcontroller CPU instructions execution. This analysis is based mainly on the time measurement errors that could appear in the presented measurement methods and also this paper describes the algorithms used in these experiments to create the CPU load. Also, in the experimental results section there is a short comparison between two microcontrollers as a proof of concept. The original contributions to this paper are: the design of the testing setup, both hardware and software, the developing of the software for the microcontrollers used in the experiment and most importantly, the experimental results regarding the presented measurement techniques.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131301343","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Investigating the effect of large SMD components on heating during vapour phase soldering 研究大型SMD元件在气相焊接过程中对加热的影响
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259854
A. Géczy, A. Nagy, B. Illés, Z. Gyorgy, D. Bušek
{"title":"Investigating the effect of large SMD components on heating during vapour phase soldering","authors":"A. Géczy, A. Nagy, B. Illés, Z. Gyorgy, D. Bušek","doi":"10.1109/SIITME.2017.8259854","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259854","url":null,"abstract":"The paper presents fundamental investigations into the field of vapour phase soldering, specially focusing on the effect of large surface mounted components (e.g. shadowing and possible consequent tombstoning). During the vapour phase reflow the heat transfer processes are based on condensation and the temperature distributions are affected by the geometry and thermal masses of the heated assemblies. The paper investigates the problem from the aspect of components with high thermal mass, which may affect the process of condensation, due to their increased thermal requirements. The experimental is based on FR4 type printed circuit boards, where large packages (SMD capacitors) are attached with SMD adhesives on the top surface of the board at specified locations. The thermocouples are fixed in bores inside the PCB at given locations to highlight any possibility of shadowing (caused by condensate flow blocking effect or vapour consumption) and inside the components where any significant transient effects serve information about the process itself. The measurements are logged with a custom data logger device, which was developed specifically for the investigations. The initial results show that shadowing might not be a problem even near large components, however the overall heating characteristics of the board and the components are affected by the relatively large thermal masses of the applied packages.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131531421","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Intelligent video surveillance system 智能视频监控系统
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259891
Virgil Claudiu Banu, I. Costea, F. Nemtanu, I. Bădescu
{"title":"Intelligent video surveillance system","authors":"Virgil Claudiu Banu, I. Costea, F. Nemtanu, I. Bădescu","doi":"10.1109/SIITME.2017.8259891","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259891","url":null,"abstract":"This scientific paper present architecture for a perimeter security system dedicated to critical transport infrastructures protection, such as the airport. To counteract human errors and low capacity of the existing security systems to provide redundancy at certain functional levels and high availability, an innovative security system concept was designed, able to provide redundancy at analysis and image processing level. By joining the latest technologies available for CCTV, perimeter protection, virtualization and networking, the security system that underpins the conceptual architecture, detailed further, enhances the security of the site by using adaptive algorithms for processing data.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"123 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116500387","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Modelling glow curves of thermoluminescent radiometric devices 热释光辐射测量装置的发光曲线建模
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259893
C. Ionescu, E. Pajuste, J. Prikulis, M. Dima, S. Sokovnin, P. Krug
{"title":"Modelling glow curves of thermoluminescent radiometric devices","authors":"C. Ionescu, E. Pajuste, J. Prikulis, M. Dima, S. Sokovnin, P. Krug","doi":"10.1109/SIITME.2017.8259893","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259893","url":null,"abstract":"Thermoluminescent (TLD) radiation dosimeters enjoy wide usage due to low cost and simplicity of use. They however require complex device modelling in order to extract the measured dose. A new glow peak model and fit method are presented, that offer a more robust fit to the glow-curves and allows operators to enter visually inspectable parameters (rather than physical quantities difficult to estimate from the visual inspection of the glow curves themselves). Fits performed on the GLOCANIN-challenge's RefGlow-002 and RefGlow-009 [2] are presented, highlighting the good performance of the GEMINI C++ code written.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114505797","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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