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1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)最新文献

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Reliability evaluation of ultrathin gate oxides grown on Si wafers stored in clean stocker with a UV/photoelectron source 用紫外/光电子源在硅晶片上生长超薄栅氧化物的可靠性评价
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664596
H. Tobimatsu, W. Mizubayashi, T. Fujii, Kentaro Shibahara, Shin Yokoyama, Masataka Hirose
{"title":"Reliability evaluation of ultrathin gate oxides grown on Si wafers stored in clean stocker with a UV/photoelectron source","authors":"H. Tobimatsu, W. Mizubayashi, T. Fujii, Kentaro Shibahara, Shin Yokoyama, Masataka Hirose","doi":"10.1109/ISSM.1997.664596","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664596","url":null,"abstract":"With scaling down of the size of semiconductor devices, the influence not only of particles but also of gaseous contamination becomes serious in semiconductor manufacturing processes. UV/photoelectron method, by which particles are charged by photoelectrons from UV irradiated metal surface and collected on electrodes by an electric field, is effective not only for particles but also for gaseous contamination such as, NH/sub 3/, NO/sub X/, SO/sub 2/ and organic compounds. By attaching photocatalyst (TiO/sub 2/) with UV/photoelectron source (photocatalyst method), the gaseous contamination is more effectively reduced. We investigate the influence of gaseous contamination on the gate oxide reliability. By protecting the Si wafer from carbon contamination using the UV/photoelectron or the photocatalyst method, the reliability of gate oxides is improved.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128752154","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
0.25 /spl mu/m integrated circuit yield model design and validation 0.25 /spl mu/m集成电路成品率模型设计与验证
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664557
F. Lakhani, D. Dance, R. Williams
{"title":"0.25 /spl mu/m integrated circuit yield model design and validation","authors":"F. Lakhani, D. Dance, R. Williams","doi":"10.1109/ISSM.1997.664557","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664557","url":null,"abstract":"This paper provides an overview of the design and the methods used to establish validated defect density targets for a 0.25 /spl mu/m process tool set based on a new SEMATECH yield model. This is the first model to provide industry tool targets derived from real manufacturing data. Besides the model design and the model validation approach, the paper provides particles per wafer pass (PWP) tool targets (for top ten yield detractors) to achieve 90%, random defect limited yield (RDLY) for a 0.25 /spl mu/m logic process. Future work to optimize the model further is outlined as well.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132274113","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Sense and sensibility: the scaleable minifab 理智与情感:可伸缩的迷你车
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664491
J. Duley, V. Varma, S. Wood
{"title":"Sense and sensibility: the scaleable minifab","authors":"J. Duley, V. Varma, S. Wood","doi":"10.1109/ISSM.1997.664491","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664491","url":null,"abstract":"The objective of the scaleable minifab is cost competitive, low risk IC manufacturing to satisfy a business need. This paper analyzes the capital and operating costs of a fab, and shows how the data can be used to improve the cost structures of modular IC manufacturing while containing capital risk. A modular fab can limit capital risk by allowing capacity to be added in an incremental way when needed. The paper shows that the cost per wafer is higher for the smaller fab as predicted by economics of scale. In addition, the lower wafer cost benefit of economies of scale is overshadowed by the cost penalty of under-utilization of fab capacity. This suggests that a fab should be designed in a modular way, starting small in size and growing in modules when needed. Keeping utilization high will result in a lower average wafer cost than a larger fab with economies of scale and lower utilization.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132853369","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Strategic inventory control for stable production [semiconductor wafer manufacture] 稳定生产的策略性库存控制[半导体晶圆制造]
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664480
M. Nishimura
{"title":"Strategic inventory control for stable production [semiconductor wafer manufacture]","authors":"M. Nishimura","doi":"10.1109/ISSM.1997.664480","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664480","url":null,"abstract":"Our ASIC factory runs many different types of devices with small lot sizes, so there is a critical need to efficiently control the use of many different types of reticle sets. Under these conditions, we were barely able to control the level of inventory and still achieve low cycle time. Our purposal, therefore, was to shorten cycle time, maintain overall capacity and control inventories by: decreasing non-value added operations/inventories; establishing stable production by using specific throughput and inventory (WIP) targets; and achieving better machine utilization. This paper mainly explains how to control inventories to achieve stable production.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"105 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121207278","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Process simplification as a continuous improvement methodology 过程简化是一种持续改进的方法
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664646
C. Seams
{"title":"Process simplification as a continuous improvement methodology","authors":"C. Seams","doi":"10.1109/ISSM.1997.664646","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664646","url":null,"abstract":"Integrated circuit process technologies are introduced into manufacturing at a stage where inefficiencies are still present. Continuous effort focused at removing non-value added steps in the process now can reap large rewards. A multi-year process simplification effort spanning generations of process technologies has paid large dividends in the cost and cycle time of manufacturing. Cypress manages the program to achieve an entitlement of 25% step reduction during manufacturing. The methods by which the simplification effort takes place are instrumental in guiding and sustaining the program such that simplification progress is quicker with each generation of technology.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"112 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124848268","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Philips Semiconductors (Albuquerque site) internal water reuse system 飞利浦半导体(阿尔伯克基基地)内部水再利用系统
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664517
L. Chavez
{"title":"Philips Semiconductors (Albuquerque site) internal water reuse system","authors":"L. Chavez","doi":"10.1109/ISSM.1997.664517","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664517","url":null,"abstract":"In 1994 the City of Albuquerque realized that the management of its municipal water supply was becoming a critical issue. The City commissioned studies to determine the best course of action to create a sustainable water supply through the year 2060. To meet this challenge, the City began developing the Albuquerque Water Resources Management Strategy, with a goal to reduce residential and industrial water use by 30 percent by the year 2004. In response to the City's water issues, Philips Semiconductors-Albuquerque began a pro-active plan to reduce water use at their Albuquerque semiconductor facility.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122225318","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Maintenance-free, high efficiency treatment system for acidic gases 免维护，高效的酸性气体处理系统
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664622
T. Fukumoto, N. Yamazaki, M. Tada, H. Ogino
{"title":"Maintenance-free, high efficiency treatment system for acidic gases","authors":"T. Fukumoto, N. Yamazaki, M. Tada, H. Ogino","doi":"10.1109/ISSM.1997.664622","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664622","url":null,"abstract":"We developed a highly removal efficient wet scrubbing system for removing various acidic gases in waste gas emitted by the semiconductor and other chemical industries. Especially significant are our system's high removal efficiency (>99%) and long-term maintenance free operation.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"302 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123200196","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Models for estimating wear particles in preliminary design of semiconductor equipment 半导体设备初步设计中磨损颗粒的估计模型
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664620
R. Srinivasan
{"title":"Models for estimating wear particles in preliminary design of semiconductor equipment","authors":"R. Srinivasan","doi":"10.1109/ISSM.1997.664620","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664620","url":null,"abstract":"There is a well recognized need for particle control and reduction, as semiconductor manufacturing is challenged by stringent device requirements. Process equipment is a significant contributor of particles. This paper focuses on the preliminary design of semiconductor equipment and illustrates the use of tribological models to understand particle generation by wear and hence make design choices to reduce the same. Two examples are provided to illustrate the usefulness of such models.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123615041","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A site wide risk assessment at Intel Corporation in New Mexico 新墨西哥州英特尔公司现场风险评估
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664519
J. Casciano
{"title":"A site wide risk assessment at Intel Corporation in New Mexico","authors":"J. Casciano","doi":"10.1109/ISSM.1997.664519","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664519","url":null,"abstract":"Intel New Mexico has received intense public scrutiny since the construction of Fab 11, RR4, RR5, and the supporting Central Utilities buildings. Community concerns about routine emissions of chemicals, and the potential accidental release had been raised individually and in public forums. While Intel has historically incorporated risk assessment and risk management into facility and process design and installation, no analysis existed of the combined risk from the entire facility. A site-wide assessment conducted by an independent third party evaluator, Radian International Incorporated and used inspections, interviews and record checking to evaluate the facility for risk potential based on Environmental Protection Agency and Occupational Safety and Health Administration regulations and guidance. Toxicological review was also done for all manufacturing chemicals. Dispersion and uptake modeling was performed to evaluate risk to surrounding populations. The risk assessment has been used as a communication tool with neighborhood groups, industry counterparts, and regulatory agencies. A summary of key learning, costs and benefits will be presented in the paper. Results from the assessment showed risks to the community to be well within all acceptable risk criteria.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132019388","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Managing repairable and consumable factory parts: Fab 9's materials management system 管理工厂的可修理和易耗件:Fab 9的材料管理系统
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664611
D. E. Love
{"title":"Managing repairable and consumable factory parts: Fab 9's materials management system","authors":"D. E. Love","doi":"10.1109/ISSM.1997.664611","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664611","url":null,"abstract":"This paper describes a system developed and implemented by Intel's Fab 9 to reduce the risk of chemical exposures from, and increase the accountability of, repairable and consumable factory parts. In Q4 1995, a system was developed and implemented that managed the flow of repairable and consumable parts leaving the factory: the materials management system (MMS). The components that make up the MMS are a system owner, a factory wide specification, functional area preventative maintenance specifications, a monitoring system for parts leaving the factory and a comprehensive training program. The implementation of the MMS has ensured a high level of safety for all personnel handling factory parts, meeting Intel's value that \"Safety Is Number One\" in the work place. The MMS has saved Intel's Fab 9 hundreds of thousands of dollars. The system was developed and implemented using existing factory and site resources. Intel's Fab 9 Materials Management System is now the New Mexico Site standard.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127571317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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