M. Astner, T. Pilsak, H. Bruns, J. ter Haseborg, H. Singer
{"title":"MoM-based analysis of the immunity of marine equipment in a control cabinet of cruise and container vessels against 2.4-GHz WLAN application","authors":"M. Astner, T. Pilsak, H. Bruns, J. ter Haseborg, H. Singer","doi":"10.1109/EMCEUROPE.2008.4786918","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2008.4786918","url":null,"abstract":"In this contribution a typical control panel is investigated. The structure is assembled on bridges of modern ships. Numerical results are presented for the excitation by means of a WLAN antenna. The applied technique was the method of moments based on a combination of the adaptive-cross approximation and singular value decomposition (ACA/SVD) solver to deal with the exhaustive computational requirements due to the large extension of the panel in terms of wavelength.","PeriodicalId":133902,"journal":{"name":"2008 International Symposium on Electromagnetic Compatibility - EMC Europe","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127262801","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"High-frequency experimental characterization of impedance bonds used in railway systems","authors":"E. Fedeli, S. Pignari, G. Spadacini","doi":"10.1109/EMCEUROPE.2008.4786829","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2008.4786829","url":null,"abstract":"The development of EMC models of complex railway systems requires accurate characterization of all the units integrated in the railway environment. In line with this aim, in this paper two methods are proposed for the characterization of impedance bonds (IBs) up to 100 MHz. The first method makes use of a signal generator and an oscilloscope for the measurement of open-circuit impedances, whereas the second foresees the measurement of scattering parameters via a vector network analyzer. This experimental characterization of IBs proves to be useful for multiconductor-transmission-line (MTL) modeling of the railway infrastructure, aimed at analyzing its impact on the electromagnetic emissions radiated to the outside world.","PeriodicalId":133902,"journal":{"name":"2008 International Symposium on Electromagnetic Compatibility - EMC Europe","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127289008","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Modeling the skin effect in the time domain for the simulation of circuit interconnects","authors":"M. Magdowski, S. Kochetov, M. Leone","doi":"10.1109/EMCEUROPE.2008.4786892","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2008.4786892","url":null,"abstract":"The skin effect is characterized by a reduction of a conductor's effective cross-sectional area and is of great importance for the losses in electrical interconnection systems. Many well-known solutions exist for its modeling in the frequency domain. Based on the method of full spectrum convolution macromodeling a new skin-effect model is developed for an efficient numerical time-domain analysis. The integration of this model into the transmission line model and into the PEEC model is studied in two examples. Thereby the influence of skin effect on the simulation of interconnection systems with transient current and voltage responses is investigated.","PeriodicalId":133902,"journal":{"name":"2008 International Symposium on Electromagnetic Compatibility - EMC Europe","volume":"83 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125412841","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Interpolation technique in magnetic near field scanning","authors":"C. Labarre, F. Costa","doi":"10.1109/EMCEUROPE.2008.4786887","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2008.4786887","url":null,"abstract":"In this paper, we perform magnetic near field measurements with a test bench. The probe used is sufficiently large to keep a good sensitivity. The measurement step equal to the probe radius lets to have a reasonable measurement time. The spatial step is shortened by a data post-processing technique derive from image restoration domain.","PeriodicalId":133902,"journal":{"name":"2008 International Symposium on Electromagnetic Compatibility - EMC Europe","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116828079","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Semiconductor macromodeling for power electronic applications","authors":"S. Thamm, M. Leone","doi":"10.1109/EMCEUROPE.2008.4786830","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2008.4786830","url":null,"abstract":"The macromodeling technique of electronic devices allows the reduction of the complexity of simulation models with adequate accuracy. A modeling approach suitable to describe the functional and the EMC-relevant behavior of power electronics devices is presented and tested on a diode. The static and the dynamic behavior can be modeled very exactly through the superposition of several Gaussian radial basis functions. The coupling of a transient simulation and parameter optimization allows an efficient parameterization. The resulting SPICE-compatible circuit description of the macromodel ensures the integration in different simulation environments. The suggested macromodeling technique is demonstrated for typical converter applications. Validation is carried out by comparison with reference simulations using a standard SPICE library diode model.","PeriodicalId":133902,"journal":{"name":"2008 International Symposium on Electromagnetic Compatibility - EMC Europe","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126849873","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Band-limitation effect on statistical properties of class-A interference","authors":"Y. Matsumoto, K. Gotoh, K. Wiklundh","doi":"10.1109/EMCEUROPE.2008.4786795","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2008.4786795","url":null,"abstract":"The effect of band limitation on the statistical properties of Middleton's class A noise model is investigated. It is found that a uniformly weighted sum of statistically independent and identically distributed class A random variables becomes a new class A random variable with reduced impulsiveness. It is also found that bandlimited noise becomes class A noise if the impulse response of the filter has a rectangular envelope waveform. Since matched filters employed by DS-SS (direct sequence spread spectrum) or OFDM (orthogonal frequency division multiplex) systems usually satisfy the above condition, the results can be widely applied to the evaluation of the error probability of signal detection in such communication systems subjected to class A interference.","PeriodicalId":133902,"journal":{"name":"2008 International Symposium on Electromagnetic Compatibility - EMC Europe","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130520303","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
K. Araki, F. Xiao, Y. Kami, H. Bishnoi, J. Drewniak
{"title":"Modeling interference coupling between two orthogonal strip lines on adjacent layers","authors":"K. Araki, F. Xiao, Y. Kami, H. Bishnoi, J. Drewniak","doi":"10.1109/EMCEUROPE.2008.4786849","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2008.4786849","url":null,"abstract":"In multi-layer circuit boards of modern electronic equipment, signal lines and power distribution traces can be set orthogonally and sandwiched between two reference layers. To evaluate interference between such a intersecting strip line geometry, a lumped mutual capacitance model is proposed. Determining the scalar potential due to an assumed line charge at the intersection of the orthogonal traces leads to the distributed mutual capacitance between two lines. The results show that for typical printed circuit board geometries, the mutual capacitance can be approximated as a lumped element at the intersection of the two orthogonal strip line geometries. The proposed model is verified by comparing experimental and the computed results.","PeriodicalId":133902,"journal":{"name":"2008 International Symposium on Electromagnetic Compatibility - EMC Europe","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131651291","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"IC models accounting for effects of EM noise","authors":"I. Stievano, F. Canavero, Enrico Vialardi","doi":"10.1109/EMCEUROPE.2008.4786848","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2008.4786848","url":null,"abstract":"This paper addresses the generation of enhanced models of digital ICs. The proposed models accurately represent the effects of the fluctuations of the device port signals induced by EM disturbances coupling to the system interconnect. The models can be easily estimated from the device port transient responses and can be effectively implemented in any commercial tool as SPICE subcircuits. Model accuracy is assessed by comparing measurements carried out on a test board and simulations. The effects of both continuous wave sinusoidal and pulsed disturbances are discussed.","PeriodicalId":133902,"journal":{"name":"2008 International Symposium on Electromagnetic Compatibility - EMC Europe","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130071665","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Introduction to EMC simulations of analog ICs","authors":"P. Baros, P. Horský, P. Kamenický","doi":"10.1109/EMCEUROPE.2008.4786902","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2008.4786902","url":null,"abstract":"Electromagnetic compatibility is an important performance meter of any modern IC design. This paper describes methods on how to simulate and evaluate the IC's electromagnetic susceptibility and electromagnetic emissions performance at the IC level in a SPICE simulator. It is intended as a short tutorial to the IC EMC simulations mainly for mixed signal ASICs.","PeriodicalId":133902,"journal":{"name":"2008 International Symposium on Electromagnetic Compatibility - EMC Europe","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130073814","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Determination of mode conversion on differential lines","authors":"J. H. Hagmann, S. Dickmann","doi":"10.1109/EMCEUROPE.2008.4786825","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2008.4786825","url":null,"abstract":"This paper describes the problems of mode conversion on differential lines. For the determination of mode conversion between the common mode and the differential mode two possibilities are suggested. The first method is the use of modal impedance matrices Zmacrm to analyse the conversion related to current and voltage. The second method uses the S-parameters to calculate the mixed mode parameters to determine the conversion of modal power waves. Both views on the conversion of modes will be combined to alter the view on the problem.","PeriodicalId":133902,"journal":{"name":"2008 International Symposium on Electromagnetic Compatibility - EMC Europe","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114138047","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}