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The First Direct Mesh-to-Mesh Photonic Fabric 首个网对网直接光子织物
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-04-19 DOI: 10.1109/mm.2024.3387828
Jason Howard, Joshua B. Fryman, Shamsul Abedin
{"title":"The First Direct Mesh-to-Mesh Photonic Fabric","authors":"Jason Howard, Joshua B. Fryman, Shamsul Abedin","doi":"10.1109/mm.2024.3387828","DOIUrl":"https://doi.org/10.1109/mm.2024.3387828","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"50 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140629085","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Annals of the History of Computing 电气和电子工程师学会计算机史年鉴
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-04-09 DOI: 10.1109/mm.2024.3375130
{"title":"IEEE Annals of the History of Computing","authors":"","doi":"10.1109/mm.2024.3375130","DOIUrl":"https://doi.org/10.1109/mm.2024.3375130","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"60 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-04-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140585719","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Inside the Cerebras Wafer-Scale Cluster 走进 Cerebras 晶圆级集群
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-04-09 DOI: 10.1109/mm.2024.3386628
Sean Lie
{"title":"Inside the Cerebras Wafer-Scale Cluster","authors":"Sean Lie","doi":"10.1109/mm.2024.3386628","DOIUrl":"https://doi.org/10.1109/mm.2024.3386628","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"180 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-04-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140585436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Computer Society - Call for Papers IEEE 计算机协会 - 征稿启事
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-04-09 DOI: 10.1109/mm.2024.3375087
{"title":"IEEE Computer Society - Call for Papers","authors":"","doi":"10.1109/mm.2024.3375087","DOIUrl":"https://doi.org/10.1109/mm.2024.3375087","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"51 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-04-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140585653","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Computer Society D&I Fund 电气和电子工程师学会计算机协会 D&I 基金
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-04-09 DOI: 10.1109/mm.2024.3373112
{"title":"IEEE Computer Society D&I Fund","authors":"","doi":"10.1109/mm.2024.3373112","DOIUrl":"https://doi.org/10.1109/mm.2024.3373112","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"2016 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-04-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140585447","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Computer Society Volunteer Service Awards 电气和电子工程师学会计算机协会志愿者服务奖
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-04-05 DOI: 10.1109/mm.2024.3375093
{"title":"IEEE Computer Society Volunteer Service Awards","authors":"","doi":"10.1109/mm.2024.3375093","DOIUrl":"https://doi.org/10.1109/mm.2024.3375093","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"103 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140585437","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Special Issue on Hot Interconnects 30 热互连特刊 30
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-04-05 DOI: 10.1109/mm.2024.3373338
Scott Levy, Whit Schonbein
{"title":"Special Issue on Hot Interconnects 30","authors":"Scott Levy, Whit Schonbein","doi":"10.1109/mm.2024.3373338","DOIUrl":"https://doi.org/10.1109/mm.2024.3373338","url":null,"abstract":"The IEEE Hot Interconnects Symposium celebrated its 30th year in 2023 with an exceptional series of presentations from industry and academia on the design, implementation, and effective use of high-performance interconnects. A core role of the Symposium is to promote the dissemination of cutting-edge research in the field. To this end, the 2023 Symposium included eight peer-reviewed presentations. This special issue of IEEE Micro presents revised and expanded versions of five of the best of these contributions.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"32 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140585619","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Party Like It’s 1999? 像 1999 年一样狂欢?
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-04-05 DOI: 10.1109/mm.2024.3372349
Shane Greenstein
{"title":"Party Like It’s 1999?","authors":"Shane Greenstein","doi":"10.1109/mm.2024.3372349","DOIUrl":"https://doi.org/10.1109/mm.2024.3372349","url":null,"abstract":"Generative AI has created a gold rush today, but that rush has not yet grown into either a productivity boom or a financial bubble. There are good reasons to think this rush could become either one. Some productivity gains seems likely, but the emergence of a financial bubble is more difficult to predict. Do today's conditions resemble those that created a bubble in the late 1990s? We consider a few crucial similarities and differences between the dot-com boom and telecom bubble of the late 1990s and the recent experience with generative AI","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"15 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140585510","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Computer Society Career Center 电气和电子工程师学会计算机协会职业中心
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-04-05 DOI: 10.1109/mm.2024.3373118
{"title":"IEEE Computer Society Career Center","authors":"","doi":"10.1109/mm.2024.3373118","DOIUrl":"https://doi.org/10.1109/mm.2024.3373118","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"47 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140585438","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IT Professional 信息技术专业人员
IF 3.6 3区 计算机科学
IEEE Micro Pub Date : 2024-04-05 DOI: 10.1109/mm.2024.3375135
{"title":"IT Professional","authors":"","doi":"10.1109/mm.2024.3375135","DOIUrl":"https://doi.org/10.1109/mm.2024.3375135","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"56 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140585434","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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