Special Issue on Hot Interconnects 30

IF 2.8 3区计算机科学 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE

IEEE Micro Pub Date : 2024-04-05 DOI:10.1109/mm.2024.3373338

Scott Levy, Whit Schonbein

引用次数: 0

Abstract

The IEEE Hot Interconnects Symposium celebrated its 30th year in 2023 with an exceptional series of presentations from industry and academia on the design, implementation, and effective use of high-performance interconnects. A core role of the Symposium is to promote the dissemination of cutting-edge research in the field. To this end, the 2023 Symposium included eight peer-reviewed presentations. This special issue of IEEE Micro presents revised and expanded versions of five of the best of these contributions.

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热互连特刊 30

2023 年，IEEE 热互连研讨会迎来了它的第 30 个年头，来自业界和学术界的专家就高性能互连的设计、实施和有效利用发表了一系列精彩的演讲。研讨会的核心作用之一是促进该领域前沿研究的传播。为此，2023 年研讨会包括八场同行评审报告。本期《IEEE Micro》特刊介绍了其中五篇最佳论文的修订和扩充版本。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Micro 工程技术-计算机：软件工程

CiteScore

7.50

自引率

0.00%

发文量

164

审稿时长

>12 weeks

期刊介绍： IEEE Micro addresses users and designers of microprocessors and microprocessor systems, including managers, engineers, consultants, educators, and students involved with computers and peripherals, components and subassemblies, communications, instrumentation and control equipment, and guidance systems. Contributions should relate to the design, performance, or application of microprocessors and microcomputers. Tutorials, review papers, and discussions are also welcome. Sample topic areas include architecture, communications, data acquisition, control, hardware and software design/implementation, algorithms (including program listings), digital signal processing, microprocessor support hardware, operating systems, computer aided design, languages, application software, and development systems.