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2006 17th International Zurich Symposium on Electromagnetic Compatibility最新文献

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Impedance bond mitigation of inductive interference to railway wayside signal systems 铁路道旁信号系统感应干扰的阻抗键消减
2006 17th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2006-05-15 DOI: 10.1109/EMCZUR.2006.214892
R. Perala
{"title":"Impedance bond mitigation of inductive interference to railway wayside signal systems","authors":"R. Perala","doi":"10.1109/EMCZUR.2006.214892","DOIUrl":"https://doi.org/10.1109/EMCZUR.2006.214892","url":null,"abstract":"High voltage transmission lines and low voltage distribution lines often share a corridor with railroads. The load currents in these lines radiate an electric field that induces voltages and currents in the rails, which are connected by cables to the signal system electronics. These voltages and currents can exceed 100 V and 100 A and seriously affect the signal systems. The objective of this paper is to describe the induction process and the application of an impedance bond mitigation technique with both analytical and experimental results. Application of this method to a 25 km long diesel freight railroad corridor is discussed","PeriodicalId":130489,"journal":{"name":"2006 17th International Zurich Symposium on Electromagnetic Compatibility","volume":"170 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130710721","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Shielding performance of a metallic rack used for telecommunication equipments: FIT modeling and measurements 电信设备用金属机架的屏蔽性能:FIT建模和测量
2006 17th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2006-05-15 DOI: 10.1109/EMCZUR.2006.215012
A. Scogna
{"title":"Shielding performance of a metallic rack used for telecommunication equipments: FIT modeling and measurements","authors":"A. Scogna","doi":"10.1109/EMCZUR.2006.215012","DOIUrl":"https://doi.org/10.1109/EMCZUR.2006.215012","url":null,"abstract":"The ever growing increase in speed of digital signals has made more difficult the achievement of conformity about limits emissions. It often happens that to verify the requirements of standards on these emissions the use of a metallic enclosure is necessary: in this way the power radiated by the system is reduced. The effect on radiated emission due to the presence of a slot on the frontal part of a metallic rack used for telecommunication equipment is studied both by dedicated experiments and by simulations. An internal source represented by a loaded monopole antenna is used to investigate the shielding behavior of the rack. A simplified model of the antenna source is presented and a good agreement over a frequency range up to 1 GHz is achieved between measured results and simulated results","PeriodicalId":130489,"journal":{"name":"2006 17th International Zurich Symposium on Electromagnetic Compatibility","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114844232","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Breakdown predictions of microstrip interconnects and coplanar waveguide-built devices in the presence of HP-EMPs 在HP-EMPs存在下微带互连和共面波导器件的击穿预测
2006 17th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2006-05-15 DOI: 10.1109/EMCZUR.2006.214967
Wen-YanYin, X. Dong, Junfa Mao, Le-Wei Li
{"title":"Breakdown predictions of microstrip interconnects and coplanar waveguide-built devices in the presence of HP-EMPs","authors":"Wen-YanYin, X. Dong, Junfa Mao, Le-Wei Li","doi":"10.1109/EMCZUR.2006.214967","DOIUrl":"https://doi.org/10.1109/EMCZUR.2006.214967","url":null,"abstract":"Electrical breakdown of microstrip interconnects and coplanar waveguide-built devices in the presence of high-power electromagnetic pulses (HP-EMP) is addressed in this paper, and some effective methodologies are outlined and proposed for fast predicting maximum current carrying density of bonding wire, electric field breakdown strength of thin film capacitors, average and peak power handling capabilities of conventional and thin film microstrip and coplanar waveguides. An efficient FDTD procedure is also presented for characterizing electric breakdown strength of the substrate dielectrics based on their high-field conduction models","PeriodicalId":130489,"journal":{"name":"2006 17th International Zurich Symposium on Electromagnetic Compatibility","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123946097","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Susceptibility of sensor networks to intentional electromagnetic interference 传感器网络对有意电磁干扰的敏感性
2006 17th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2006-05-15 DOI: 10.1109/EMCZUR.2006.214897
J. Delsing, J. Ekman, J. Johansson, S. Sundberg, M. Backstrom, T. Nilsson
{"title":"Susceptibility of sensor networks to intentional electromagnetic interference","authors":"J. Delsing, J. Ekman, J. Johansson, S. Sundberg, M. Backstrom, T. Nilsson","doi":"10.1109/EMCZUR.2006.214897","DOIUrl":"https://doi.org/10.1109/EMCZUR.2006.214897","url":null,"abstract":"It is reasonable to think that sensor networks might be part of society critical systems in the future. Therefor this paper discusses and shows the vulnerabilities of sensor networks to intentional electromagnetic interference (IEMI). Principle ways of sensor network IEMI is addressed and followed by a discussion on schemes for protection. Experimental results for both in-band and exband interference from low- and high- level sources is reported. It is obvious that more emphasis has to be put on sensor networks susceptibility to IEMI, and in particular more experimental data is needed","PeriodicalId":130489,"journal":{"name":"2006 17th International Zurich Symposium on Electromagnetic Compatibility","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115086099","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 20
Numerical analysis of scattering from a general bi-isotropic cylindrical shell with an interior metal coating 内金属涂层双各向同性圆柱壳散射的数值分析
2006 17th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2006-05-15 DOI: 10.1109/EMCZUR.2006.214868
C.-I.G. Hsu, Cheng-Nan Chiu, C. Wu, Yu‐Cheng Kang
{"title":"Numerical analysis of scattering from a general bi-isotropic cylindrical shell with an interior metal coating","authors":"C.-I.G. Hsu, Cheng-Nan Chiu, C. Wu, Yu‐Cheng Kang","doi":"10.1109/EMCZUR.2006.214868","DOIUrl":"https://doi.org/10.1109/EMCZUR.2006.214868","url":null,"abstract":"This paper investigates the frequency-selective scattering properties of a general bi-isotropic cylindrical shell with an interior metal coating. Either a nonreciprocally Tellegen medium or a reciprocally chiral one is considered as the general bi-isotropic cylindrical shell. To address this scattering problem, a state-equation based theoretical model is developed. A finite-difference algorithm is employed for solving this model. On the basis of this model, the numerical results of monostatic and bistatic echo widths obtained are used to discuss frequency-selective properties in both the TM and TE cases","PeriodicalId":130489,"journal":{"name":"2006 17th International Zurich Symposium on Electromagnetic Compatibility","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122994148","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
EMC shielding in power electronics multilayers with conductive permeable material 电力电子多层导电渗透材料的电磁兼容屏蔽
2006 17th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2006-05-15 DOI: 10.1109/EMCZUR.2006.214947
S. Schuh, M. Albach
{"title":"EMC shielding in power electronics multilayers with conductive permeable material","authors":"S. Schuh, M. Albach","doi":"10.1109/EMCZUR.2006.214947","DOIUrl":"https://doi.org/10.1109/EMCZUR.2006.214947","url":null,"abstract":"The multilayer technology where passive components are integrated in printed circuit boards is one of the interesting projects to obtain a volume reduction of classical circuits. Using layers of conductive permeable materials in the multilayer architecture the same layer is performing both the EMC-shielding of stray fields and works as the core for the integrated inductive components. In this paper the screening effect of a permeable conductive layer close to an inductive component inside of a multilayer structure is investigated analytically and verified by measurements. An additional view on the self inductance value of the planar component completes the results","PeriodicalId":130489,"journal":{"name":"2006 17th International Zurich Symposium on Electromagnetic Compatibility","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125090266","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Teaching near field coupling with PCB layout 近场耦合与PCB布局教学
2006 17th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2006-05-15 DOI: 10.1109/EMCZUR.2006.214995
W.-J.T. Foo, J. Chee
{"title":"Teaching near field coupling with PCB layout","authors":"W.-J.T. Foo, J. Chee","doi":"10.1109/EMCZUR.2006.214995","DOIUrl":"https://doi.org/10.1109/EMCZUR.2006.214995","url":null,"abstract":"A novel EMC laboratory experiment to illustrate the effects of near field coupling is presented. Using two separate printed circuit boards (PCB), one being the emitter PCB with a digital oscillator circuit driving current in a loop, and the other being a receptor PCB having passive loop of identical size. An LED on board the receptor PCB gives visual feedback on the intensity of the coupling. The experiment helps to illustrates the effect of implementing several design rules. The effects are analysed using equivalent circuits to explain coupling. Lessons learnt from this experiment can be readily applicable to multi-layer PCB design","PeriodicalId":130489,"journal":{"name":"2006 17th International Zurich Symposium on Electromagnetic Compatibility","volume":"944 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123297615","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EMI analysis of TFT-LCD driver IC TFT-LCD驱动IC的电磁干扰分析
2006 17th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2006-05-15 DOI: 10.1109/EMCZUR.2006.215007
Sung-Pil Choi, Jae-Wook Kwon, Kye-Eon Chang, Jin Tae Kim, Mingfu Han
{"title":"EMI analysis of TFT-LCD driver IC","authors":"Sung-Pil Choi, Jae-Wook Kwon, Kye-Eon Chang, Jin Tae Kim, Mingfu Han","doi":"10.1109/EMCZUR.2006.215007","DOIUrl":"https://doi.org/10.1109/EMCZUR.2006.215007","url":null,"abstract":"In this paper, design for EMC of LCD driver IC is proposed. By the analysis with package parasitic parameters and EMC test pattern, local power/ground noise in LCD driver IC simulated. As a result of analysis, design for lower peak of EMI spectrum and design for lower mean level of that is proposed at the same time. In addition, decoupling cap with CMOS process can decrease EMI spectrum without any further mask. The analysis of the proposed design shows that LCD driver IC can be alternatives for TFT-LCD EMC solution. It is because LCD driver IC is nearly irrelevant to LCD module whereas source PCB should be redesigned separately according to the size and resolution of LCD panel. The experimental result shows that the proposed design methodology for LCD driver IC can successfully decrease EMI spectrum of LCD module","PeriodicalId":130489,"journal":{"name":"2006 17th International Zurich Symposium on Electromagnetic Compatibility","volume":"137 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128742680","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Optimization of a reflectarray antenna via hybrid evolutionary algorithms 基于混合进化算法的反射天线优化
2006 17th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2006-05-15 DOI: 10.1109/EMCZUR.2006.214918
F. Grimaccia, M. Mussetta, P. Pirinoli, R. Zich
{"title":"Optimization of a reflectarray antenna via hybrid evolutionary algorithms","authors":"F. Grimaccia, M. Mussetta, P. Pirinoli, R. Zich","doi":"10.1109/EMCZUR.2006.214918","DOIUrl":"https://doi.org/10.1109/EMCZUR.2006.214918","url":null,"abstract":"In this paper a new effective optimization algorithm called genetical swarm optimization (GSO) will be presented. It has been developed in order to combine in the most effective way the properties of two of the most popular evolutionary optimization approaches now in use for the optimization of electromagnetic structures, the particle swarm optimization (PSO) and genetic algorithms (GA). This algorithm is essentially a population-based heuristic search technique, which can be used to solve combinatorial optimization problems, modeled on the concepts of natural selection and evolution (GA) but also based on cultural and social rules derived from the analysis of the swarm intelligence and from the interaction among particles (PSO). The algorithm is tested here with respect to the other optimization techniques dealing with the optimal design of an elliptical reflectarray antenna with printed elements and an off-set feed","PeriodicalId":130489,"journal":{"name":"2006 17th International Zurich Symposium on Electromagnetic Compatibility","volume":"64 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125945276","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Computation of power line tower lightning surge impedance using the electromagnetic field method 用电磁场法计算电力线塔雷电浪涌阻抗
2006 17th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2006-05-15 DOI: 10.1109/EMCZUR.2006.214885
Changzheng Gao, Lin Li, Bing Li, Zhibin Zhao
{"title":"Computation of power line tower lightning surge impedance using the electromagnetic field method","authors":"Changzheng Gao, Lin Li, Bing Li, Zhibin Zhao","doi":"10.1109/EMCZUR.2006.214885","DOIUrl":"https://doi.org/10.1109/EMCZUR.2006.214885","url":null,"abstract":"The power line tower lightning surge impedance is computed using an electromagnetic field approach. After comparing the results computed by our method and those tested with both a vertical conductor and reduced scale 4-poles model of tower, the method we used is proved to be right and more practical as the soil and the grounding system of the tower can be considered in the method. Using this method, the lightning surge impedance of the full scale UHV tower with grounding system is analyzed and the results show that the lightning surge impedance of a tower on the perfect ground has a little difference with those of an actual tower considering both its grounding system and soil resistivity, and when the soil resistivity is changed, the surge impedance changes slightly. Furthermore, a circuit model of the tower is obtained by vector fitting method based on the results we computed. Using the circuit model, the lightning surge performance of a power transmission line can be analyzed more accurately by EMTP or other methods","PeriodicalId":130489,"journal":{"name":"2006 17th International Zurich Symposium on Electromagnetic Compatibility","volume":"1221 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125180121","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
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