电力电子多层导电渗透材料的电磁兼容屏蔽

S. Schuh, M. Albach
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引用次数: 0

摘要

将无源元件集成到印刷电路板中的多层技术是减小经典电路体积的一个有趣的项目。在多层结构中使用导电渗透材料层,同一层既可以屏蔽杂散场,又可以作为集成电感元件的核心。本文对多层结构中靠近感应元件的导电层的屏蔽效应进行了分析研究,并通过测量加以验证。对平面元件的自感值的另一个视图完成了结果
本文章由计算机程序翻译,如有差异,请以英文原文为准。
EMC shielding in power electronics multilayers with conductive permeable material
The multilayer technology where passive components are integrated in printed circuit boards is one of the interesting projects to obtain a volume reduction of classical circuits. Using layers of conductive permeable materials in the multilayer architecture the same layer is performing both the EMC-shielding of stray fields and works as the core for the integrated inductive components. In this paper the screening effect of a permeable conductive layer close to an inductive component inside of a multilayer structure is investigated analytically and verified by measurements. An additional view on the self inductance value of the planar component completes the results
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