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[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium最新文献

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Development of fine pitch and high lead count ceramic QFP 小间距高导联陶瓷QFP的研制
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279772
Y. Nakatsuka, Y. Tamura, T. Okabayashi, H. Fujii, M. Yokochi
{"title":"Development of fine pitch and high lead count ceramic QFP","authors":"Y. Nakatsuka, Y. Tamura, T. Okabayashi, H. Fujii, M. Yokochi","doi":"10.1109/IEMT.1991.279772","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279772","url":null,"abstract":"A compact ceramic quad flat package (C-QFP) for use in logic LSI devices with fine pitch and high lead counts has been developed. The ceramic base outer size of the new C-QFP with 356 inner leads and 288 outer leads is 27 mm by 30 mm. The pitch of the inner and outer lead is 0.15 and 0.38 mm, respectively. The new C-QFP is composed of a fine pitch thin film wiring layer on a ceramic base interconnected to the outer leads by a single point bonding system. A novel process was developed for assembly of the new C-QFP.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117030944","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A tin based TAB assembly process 一种锡基TAB组装工艺
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279740
D. Field
{"title":"A tin based TAB assembly process","authors":"D. Field","doi":"10.1109/IEMT.1991.279740","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279740","url":null,"abstract":"The feasibility of using a TinCap TAB (tape automated bonding) ILB (inner lead bond) structure to provide a strong ILB connection has been demonstrated. The project investigated placing a pad of tin on top of a gold TAB bump as part of the wafer fabrication process. The tin is then used to form a reflowed ILB joint with a gold-plated tape lead. This gold/tin bond should provide a strong joint while avoiding some of the problems associated with tin-plated TAB tape. This TAB bond is referred to as the TinCap ILB structure. The process development work included modifications to the current TAB photoresist imaging process, development of a tin plating capability, and formulation of a suitable etch chemistry for a tin/gold bump. An inner lead bonding process was developed through evaluating and testing of two separate bonding systems. A substantial reliability evaluation involving over 200 live devices was carried out to determine the suitability of this interconnect for future products.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115120842","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
LEAPFROG-a manufacturing and EHS partnership leapfrog -制造和EHS合作伙伴关系
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279800
J. R. Jewett
{"title":"LEAPFROG-a manufacturing and EHS partnership","authors":"J. R. Jewett","doi":"10.1109/IEMT.1991.279800","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279800","url":null,"abstract":"LEAPFROG is the title of a program at Intel Corporation which addresses concerns about hazardous chemicals in semiconductor manufacturing processes by dealing with them at the emerging technology stage. One aspect of the program is to incorporate environmental, health, and safety (EHS) design parameters into each new technology development plan. The goal is for each resulting process to have minimal EHS risk due to chemical use. Another aspect of LEAPFROG targets specific hazardous chemicals in existing processes, and endeavors to mitigate these problems through development of process alternatives. The author discusses the program structure, implementation, and some resulting experiences from an environmental perspective.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"305 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115243244","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Leverages and bottlenecks of MCMs mcm的优势和瓶颈
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279788
E.J. Rymaszewski
{"title":"Leverages and bottlenecks of MCMs","authors":"E.J. Rymaszewski","doi":"10.1109/IEMT.1991.279788","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279788","url":null,"abstract":"Summary form only given. The authors discuss the fundamental issues confronting designers and manufacturers of the multichip modules (MCMs). All of them ultimately determine the product cost, be it the in-process and final test yields, the engineering effort in design and manufacturing support, or the MCM quality and reliability. Challenges are compounded in a situation where MCMs are assembled with chips and/or substrates obtained from an outside supplier. Issues range from the design groundrules to the lack of (comprehensive) standards, to the question of responsibility for assurance of quality and reliability, to the profit margins potentially reduced by shipping unpackaged chips. The initial driving force for MCMs has been the improved performance over the SCMs facilitated by the reduced interchip wiring delays. In this decade, all high end mainframes employ MCMs capable of carrying as many as 144 chips and handling up to 4.5 kW. Another driving force is the volume and weight reduction, and the reliability enhancement achievable with silicon-on-silicon MCMs. The growing pinout demand of all but the memory chips pushes the SCM packaging costs beyond those deemed possible with the MCMs.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126578773","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Concurrent engineering realization through multichip module vehicles: technology and CAD tool requirements 通过多芯片模块车辆实现并行工程:技术和CAD工具要求
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279812
K. Wyatt
{"title":"Concurrent engineering realization through multichip module vehicles: technology and CAD tool requirements","authors":"K. Wyatt","doi":"10.1109/IEMT.1991.279812","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279812","url":null,"abstract":"It is noted that multichip module (MCM) product developments provide a natural and essential basis for motivating technology and CAD (computer aided design) tool requirements. These requirements are reviewed with reference to three different minimum levels of maturity required for MCM design tools which are to be used, respectively, for near-term, intermediate-term, and long-term system impact. MCM tool status is then examined in connection with Mentor Graphics. It is pointed out that Mentor's commitment to strategic new project support has produced a relationship in which Mentor continually upgrades tools and introduces new ones in actual new product development contexts.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122228458","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effects of RCA claning upon breakdown voltages of thin gate oxides RCA清洗对薄栅氧化物击穿电压的影响
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279818
C. C. Johnson, K. Kurtz, J. Prince
{"title":"Effects of RCA claning upon breakdown voltages of thin gate oxides","authors":"C. C. Johnson, K. Kurtz, J. Prince","doi":"10.1109/IEMT.1991.279818","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279818","url":null,"abstract":"The authors investigated the effects of pre and post-oxidation RCA cleaning on thin oxides using breakdown voltages at current densities of 100 mu A/cm/sup 2/ and 100 mA/cm/sup 2/. The RCA clean consisted of SC1 (NH/sub 4/OH in water and H/sub 2/O/sub 2/), a dilute HF dip and SC2 (HCl in water and H/sub 2/O/sub 2/). Three experiments were performed to test the effect of each step of the pre- and post-oxidation cleans, the effect of the order in which the steps of the clean were performed, and the effect of the age of the solutions. HF was found to decrease oxide thickness without increasing the number of fails. In the post-oxidation clean, SC2 increased the number of failing oxides, but this effect was alleviated if SC1 was performed beforehand. This and other data led to the conclusion that SC2 was selectively etching the oxide. In addition, an experiment dealing with holding time of the solutions (0-12 h) was performed, but the results were not conclusive.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130414133","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Elimination of Freon and methylchloroform from the manufacturing process for hybrid microelectronic circuits 混合微电子电路制造过程中氟利昂和甲基氯仿的消除
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279797
A. Simon, K. Hines, S. Caswell, H. Rettger
{"title":"Elimination of Freon and methylchloroform from the manufacturing process for hybrid microelectronic circuits","authors":"A. Simon, K. Hines, S. Caswell, H. Rettger","doi":"10.1109/IEMT.1991.279797","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279797","url":null,"abstract":"Recognizing the harmful effects of Freon and methylchloroform solvents on the environment, Westinghouse embarked on an extensive elimination/reduction program in connection with the manufacturing of hybrid microelectronic circuits. Experiments were performed in the following five key areas: thick film substrate fabrication, component attachment, substrate mounting, wirebonding, and package sealing. In each area, it was possible to eliminate or to find a suitable alternative to Freon and methylchloroform. The following recommendations are made: (1) Rosstech 119ME should be used for wet and dry thick film paste removal; (2) PF degreaser, acetone, and isopropyl alcohol should be used for removal of leak test grease: and (3) isopropyl alcohol and/or plasma cleaning should be used for all other cleaning operations.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133352730","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Measuring progress in toxic use and waste minimization 衡量有毒使用和减少废物方面的进展
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279796
J. Ahearn, S. Greene
{"title":"Measuring progress in toxic use and waste minimization","authors":"J. Ahearn, S. Greene","doi":"10.1109/IEMT.1991.279796","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279796","url":null,"abstract":"Polaroid's toxic use and waste reduction (TUWR) program is discussed. The goals of the program are to minimize the use of certain toxic materials, and to maximize the recycling of wastes that are generated. In the design of new processes and products. the contribution to corporate waste performance is evaluated as a factor of importance equal to cost and quality. Particular attention is given to the environmental accounting and reporting system, developed as a centralized database to support and measure progress achieved by TUWR. Freon 113 reduction is considered as an example.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131792750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
TAB multichip modules: a case study TAB多芯片模块:案例研究
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279739
A. Hawley, R. Gayle
{"title":"TAB multichip modules: a case study","authors":"A. Hawley, R. Gayle","doi":"10.1109/IEMT.1991.279739","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279739","url":null,"abstract":"A case history of the design, development, and production of a commercial, high-performance multichip module at NCR Corporation is presented. Included is a brief description of NCR's strategy followed by design and manufacturing considerations encountered in the development of a tape automated bonded (TAB) module for volume production. These considerations include everything from developing sources for the components, to design for manufacturability requirements.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134265052","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Automated assembly of new 3D molded interconnection devices 新型3D模制互连装置的自动化组装
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279805
K. Feldmann, J. Franke
{"title":"Automated assembly of new 3D molded interconnection devices","authors":"K. Feldmann, J. Franke","doi":"10.1109/IEMT.1991.279805","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279805","url":null,"abstract":"It is pointed out that the assembly of electronic devices is determined by separate construction of flat printed circuit boards with discrete components and insertion in a mechanical unit. New opportunities of integrating housing and circuitry by means of molded interconnects result in new challenges of the insertion technique. Thus, future application-specific industrial robots have to insert components into a housing with three-dimensional circuitry. This also requires new concepts for adhering and soldering. Furthermore, new interconnection technologies have to be included in circuitry structure. The integration of chip on board and multichip techniques require extended insertion systems. The development and testing of these assembly concepts are described.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"110 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131891573","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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