Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium最新文献_第3页

Comparison of diodes and resistors for measuring chip temperature during thermal characterization of electronic packages using thermal test chips 在使用热测试芯片对电子封装进行热表征时，用于测量芯片温度的二极管和电阻的比较

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1997-01-28 DOI: 10.1109/STHERM.1997.566797

A. Claassen, H. Shaukatullah

引用次数: 28

Evaluation of isothermal and isoflux natural convection coefficient correlations for utilization in electronic package level thermal analysis 电子封装级热分析中等温和等通量自然对流系数相关性的评价

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1997-01-28 DOI: 10.1109/STHERM.1997.566779

B. Zahn, R. Stout

{"title":"Evaluation of isothermal and isoflux natural convection coefficient correlations for utilization in electronic package level thermal analysis","authors":"B. Zahn, R. Stout","doi":"10.1109/STHERM.1997.566779","DOIUrl":"https://doi.org/10.1109/STHERM.1997.566779","url":null,"abstract":"A 20-lead heatsink small outline package (20HSOP) was modeled on both an FR4 and aluminum printed circuit board using a solid model finite element simulation tool. Three different correlations (isothermal, single surface isoflux, and dual surface isoflux) were utilized to define the surface convection coefficients of both the package and printed circuit board in a natural convection cooled environment. Solid model temperature results were compared to physical measurements in order to evaluate the usefulness of the individual convection coefficient correlations for package level thermal analysis. Both the experimental and solid model simulation results were also compared to those obtained from an identical computational fluid dynamics (CFD) model of the 20HSOP package. The isothermal convection coefficient correlations provided the most accurate solid model simulation results (within 12%) when using the FR4 thermal characterization test board. The isoflux dual surface convection coefficient correlations provided the most accurate solid model simulation results (within 13%) when using the aluminum thermal characterization test board. Solid model solutions closely matched, and in some cases exceeded, the accuracy of the CFD model. The significance of these results to package level thermal analysis is discussed.","PeriodicalId":126120,"journal":{"name":"Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129057750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 47

Thermal analysis of a chip on board (COB) 板上芯片(COB)的热分析

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1997-01-28 DOI: 10.1109/STHERM.1997.566788

J. De Moerloose, W. Temmerman

引用次数: 4

Issues in validating package compact thermal models for natural convection cooled electronic systems 自然对流冷却电子系统封装紧凑热模型验证中的问题

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1997-01-28 DOI: 10.1109/STHERM.1997.566778

V. Adams, D. Blackburn, Y. Joshi, D. Berning

引用次数: 37

Final report to SEMITHERM XIII on the European-funded project DELPHI-the development of libraries and physical models for an integrated design environment 关于欧洲资助项目delphi的最终报告-集成设计环境的库和物理模型的开发

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1997-01-28 DOI: 10.1109/STHERM.1997.566785

H. Rosten, J. Parry, C. Lasance, H. Vinke, W. Temmerman, W. Nelemans, Y. Assouad, T. Gautier, O. Slattery, C. Cahill, M. O'Flattery, C. Lacaze, P. Zemlianoy

引用次数: 41

Thermal characterization of chip packages-evolutionary development of compact models 芯片封装的热特性-紧凑模型的进化发展

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1997-01-28 DOI: 10.1109/STHERM.1997.566796

A. Bar-Cohen, W. Krueger

引用次数: 58

Multiobjective optimization of component placement on planar printed wiring boards 平面印刷线路板上元件布置的多目标优化

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1996-05-29 DOI: 10.1109/STHERM.1997.566786

N. Queipo, G.F. Gil

{"title":"Multiobjective optimization of component placement on planar printed wiring boards","authors":"N. Queipo, G.F. Gil","doi":"10.1109/STHERM.1997.566786","DOIUrl":"https://doi.org/10.1109/STHERM.1997.566786","url":null,"abstract":"This paper presents a solution methodology for the optimal placement of convectively and conductively air-cooled electronic components on planar printed wiring boards considering thermal and electrical/cost design objectives. The methodology combines the use of a heat transfer solver for the prediction of the temperature distribution among the electronic components and a genetic algorithm for the adaptive search of optimal or near optimal solutions and a multiobjective optimization strategy (Pareto optimization and Multiattribute utility analysis). After proper validation of the elements of the solution methodology (heat transfer solver/genetic algorithm) in isolation, the methodology under consideration is tested using a placement problem (case study) that considers as optimization criteria the minimization of an estimate of the failure rate of the system of components due to thermal overheating (via an Arrhenius relation) and the minimization of the total wiring length (given some interconnectivity requirements). Results corresponding to the case study are presented and discussed for both Pareto optimization and Multiattribute utility analysis.","PeriodicalId":126120,"journal":{"name":"Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134490937","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4