Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium最新文献

Design of circular beat spreaders on semi-infinite heat sinks in microelectronics device applications 微电子器件中半无限散热片的圆形散热片设计

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1997-01-28 DOI: 10.1109/STHERM.1997.566801

P. Hui, H. Tan, Y. lye

引用次数: 5

Experimental Methods in Air Cooling of Electronics 电子产品空气冷却的实验方法

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1997-01-28 DOI: 10.1109/STHERM.1997.566776

R. Moffat, A. Ortega

{"title":"Experimental Methods in Air Cooling of Electronics","authors":"R. Moffat, A. Ortega","doi":"10.1109/STHERM.1997.566776","DOIUrl":"https://doi.org/10.1109/STHERM.1997.566776","url":null,"abstract":"This short course deals mainly with aircooling situations and has three main parts: (1) Error and uncertainty analysis, (2) Experimental methods, and (3) Heat transfer measurements and Thermal characterization of electronic components. The first part introduces the Sources and Signatures of Error and Uncertainty Analysis as a tool for Planning and Executing experiments. The Experimental Methods part covers techniques of temperature, pressure, flow, and heat flux measurements as well as some elements of flow visualization. Thermocouples, thermistors, resistance detectors, and optical techniques (liquid crystal and infrared) are covered. Special attention is given to the environmental errors present in gas temperature, surface temperature, and solid temperature measurements. Several techniques are discussed for measuring heat transfer rates and heat transfer coefficients including energy balance methods, analogue methods, and heat flux transducers. The heat transfer part will summarize what we know about heat transfer in air cooling of electronics from more than fifteen years of research at Stanford University and the University of Arizona. We will particularly emphasize the interpretation and use of the heat transfer data in the literature and its bearing on thermal characterization of electronic components. We will discuss and interpret the sources of errors inherent in the measurement and use of junction to ambient and junction to case thermal resistance. Forced convection, free convection, and mixed convection situations will be discussed, aiming at the solution to the general problem of cooling of components on circuit cards.","PeriodicalId":126120,"journal":{"name":"Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114426649","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Characterization of longitudinal fin heat sink thermal performance and flow bypass effects through CFD methods 基于CFD方法的纵向翅片散热器热性能及旁路效应表征

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1997-01-28 DOI: 10.1109/STHERM.1997.566793

A.V. Barrett, I. Obinelo

引用次数: 22

Thermally constrained placement of smart-power IC's and multi-chip modules 智能功率集成电路和多芯片模块的热约束放置

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1997-01-28 DOI: 10.1109/STHERM.1997.566787

K. Lampaert, G. Gielen, W. Sansen

{"title":"Thermally constrained placement of smart-power IC's and multi-chip modules","authors":"K. Lampaert, G. Gielen, W. Sansen","doi":"10.1109/STHERM.1997.566787","DOIUrl":"https://doi.org/10.1109/STHERM.1997.566787","url":null,"abstract":"This paper presents an algorithm for thermally constrained placement of integrated circuits and multichip modules. The thermal profile of power dissipating components is calculated in advance using an analytical multi-layer thermal model. The result is stored per component in a thermal matrix and used to compute temperature distributions during placement optimization. Simulated annealing is used as the basic placement algorithm. During each iteration of the placement optimization algorithm, the temperature distribution of the placement is calculated by superposition of the thermal profiles of the individual power dissipating components. This can be done very fast since the thermal profiles are calculated in advance and stored in matrices. Performance degradations introduced by temperature gradients can be computed using the local component temperatures and predetermined sensitivity information. The placement cost-function is designed to keep thermal performance degradation within the circuit specifications and to limit component temperatures within safe operating regions. The effectiveness and efficiency of the algorithm is demonstrated with industrial examples.","PeriodicalId":126120,"journal":{"name":"Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132824822","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Pressure drop and heat transfer in an isothermal channel with impinging flow 具有冲击流的等温通道中的压降和传热

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1997-01-28 DOI: 10.1109/STHERM.1997.566800

C. Biber

引用次数: 40

Hinged heat pipes for cooling notebook PCs 用于冷却笔记本电脑的铰链热管

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1997-01-28 DOI: 10.1109/STHERM.1997.566784

M. Mochizuki, Y. Saito, K. Goto, T. Nguyen, Phong Ho, M. Malcolm, M. Morando

引用次数: 11

Thermal characterization of electronic parts with compact models: interpretation, application, and the need for a paradigm shift 电子零件的热特性与紧凑的模型:解释，应用，和需要一个范式转变

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1997-01-28 DOI: 10.1109/STHERM.1997.566781

C. Lasance

{"title":"Thermal characterization of electronic parts with compact models: interpretation, application, and the need for a paradigm shift","authors":"C. Lasance","doi":"10.1109/STHERM.1997.566781","DOIUrl":"https://doi.org/10.1109/STHERM.1997.566781","url":null,"abstract":"In recent years, renewed interest in the thermal characterization of electronic parts has been driven by the need for more accurate thermal analyses at board and system levels. A European consortium, partially funded by the European Community under the ESPRIT contract code-named DELPHI, has published a series of papers dealing with both numerical and experimental aspects of accurate numerical modelling and experimental validation. Their approach has spawned many discussions, amongst engineers and scientists alike, about the physical integrity of the compact models, about the accuracy required by end-users given the other unknowns at system level, and about the practical generation and implementation of the models. Another interesting area of endless discussion concerns the questionable notion of the thermal resistance as the analog of the electrical resistance. It is argued that the analogy between electrical and thermal resistances is only valid for unrealistic boundary conditions, so the terminology commonly used in the thermal characterization of electronic parts should be reconsidered. This paper hopes to set the stage for fundamental considerations about current and future ways of generating and presenting thermal data for electronic parts, which may possibly be of value for both component manufacturers and system designers.","PeriodicalId":126120,"journal":{"name":"Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium","volume":"556 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127077223","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 28

Thermal management in PowerPC microprocessor multichip modules applications PowerPC微处理器多芯片模块应用中的热管理

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1997-01-28 DOI: 10.1109/STHERM.1997.566803

T. Yuan

{"title":"Thermal management in PowerPC microprocessor multichip modules applications","authors":"T. Yuan","doi":"10.1109/STHERM.1997.566803","DOIUrl":"https://doi.org/10.1109/STHERM.1997.566803","url":null,"abstract":"Thermal management considerations of PowerPC microprocessor multichip modules are discussed in this paper. Flow bypass effects on both PowerPC 603 and PowerPC 604 MCM heat sink and module thermal performance were quantified by computational fluid dynamics and conjugate conduction analysis. In PowerPC 603 MCM application, the heat sink thermal resistance can vary as large as 80% due to such effects, while in PowerPC 604 MCM application, the variation in thermal resistance can be as large as 100%. The conjugate heat transfer features in both PowerPC 603 and PowerPC 604 MCM were examined. Results show that the percentage of module power entering into the heat sink seems quite independent of the module component thermal properties. In general, about 70% of the module heat enters into the heat sink for PowerPC 603 MCM and about 85% of the module heat enters into the heat sink for PowerPC 504 MCM. Both module thermal resistances and the percentage of chip and module power distributions are affected by those material properties. Their effects were studied to understand the MCM thermal characteristics and to define the critical design parameters for thermal performance optimization.","PeriodicalId":126120,"journal":{"name":"Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125220793","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

An experimental study of forced convection heat transfer from in-line pin fin arrays 直列针翅阵列强制对流换热的实验研究

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1997-01-28 DOI: 10.1109/STHERM.1997.566792

V. Maudgal, J. Sunderland

引用次数: 8

Thermal testing methods to increase system reliability 热测试方法提高系统可靠性

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1997-01-28 DOI: 10.1109/STHERM.1997.566798

V. Székely, M. Rencz, B. Courtois

引用次数: 18