微电子器件中半无限散热片的圆形散热片设计

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium Pub Date : 1997-01-28 DOI:10.1109/STHERM.1997.566801

P. Hui, H. Tan, Y. lye

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引用次数: 5

摘要

使用严格的解析解，我们讨论了设计方面的热阻和温度均匀性的标准散热配置，包括一个圆形散热器在半无限散热器。对于散热片的优化尺寸，我们发现散热片的最小温度厚度取决于散热片和散热片的导热系数值，这与其他研究者之前发表的结果不同。此外，提出了从吊具半径b中选择吊具厚度d的新设计公式d=0.446，取代了常用规则d=b/3。我们的结果证实了从给定热源半径a中选择散热半径b的设计规则b=5a。为了便于散热片的完整设计，我们以等值线图的形式给出了归一化热阻和归一化温度均匀性的两种nomographs。

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Design of circular beat spreaders on semi-infinite heat sinks in microelectronics device applications

Using the rigorous analytical solutions, we discuss design aspects in terms of thermal resistance and temperature uniformity for the canonical heat dissipation configuration consisting of a circular heat spreader on a semi-infinite heat sink. Regarding the optimized size of the heat spreader, we have found that the minimum temperature thickness of the spreader depends on the thermal conductivity values of the spreader and the sink, in contrast to the results published previously by other researchers. In addition, a new design formula d=0.446 for the selection of spreader thickness d from the spreader radius b is proposed to replace the commonly used rule d=b/3. Our results have confirmed the design rule b=5a for the selection of the spreader radius b from a given heat source radius a. To facilitate the complete design of the heat spreaders, we present two nomographs in the form of contour plots for the normalized thermal resistance and the normalized temperature uniformity.

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来源期刊

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium

CiteScore

0.10

自引率

0.00%

发文量