Electronics Science Technology and Application最新文献

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Junction Temperature Consistency Analysis of MMC Submodule MMC子模块结温一致性分析
Electronics Science Technology and Application Pub Date : 2021-04-26 DOI: 10.18686/ESTA.V8I1.175
Zhuo Chen, Yumei Guo, Xiang-dong Wang
{"title":"Junction Temperature Consistency Analysis of MMC Submodule","authors":"Zhuo Chen, Yumei Guo, Xiang-dong Wang","doi":"10.18686/ESTA.V8I1.175","DOIUrl":"https://doi.org/10.18686/ESTA.V8I1.175","url":null,"abstract":"<p> Although modular multilevel converter<span style=\"font-family: 宋体;\">(</span><span style=\"font-family: 'Times New Roman';\">MMC</span><span style=\"font-family: 宋体;\">)</span><span style=\"font-family: 'Times New Roman';\">is widely used in the field of DC power transmission due to its</span></p><p>excellent topology performance, the natural DC bias characteristics cause thermal imbalance of internal devices. Too high temperature at the junction of power devices is one of the major causes of damage. Therefore, it is necessary to investigate the factors that affect the device junction temperature. Combining with the thermal resistance model, the junction temperature under two typical modulation strategies <span style=\"font-family: 'Times New Roman';\">is compared, </span>and the power loss and junction temperature are calculated.</p>","PeriodicalId":106850,"journal":{"name":"Electronics Science Technology and Application","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128525238","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effect of Sensor Location of Smart Composite Plate System on Feedback Control Performance 智能复合板系统传感器位置对反馈控制性能的影响
Electronics Science Technology and Application Pub Date : 2019-01-18 DOI: 10.18686/ESTA.V6I1.64
E. Abdullah, P. Gaikwad, D. Majid, A. Rafie
{"title":"Effect of Sensor Location of Smart Composite Plate System on Feedback Control Performance","authors":"E. Abdullah, P. Gaikwad, D. Majid, A. Rafie","doi":"10.18686/ESTA.V6I1.64","DOIUrl":"https://doi.org/10.18686/ESTA.V6I1.64","url":null,"abstract":"The present study is proposing a deflection control of a fiberglass composite plate system using shape memory alloy (SMA) actuators. The aim of this study is to determine the optimal placement of sensor for the feedback smart composite plate system. Strain measurement on the composite plate was chosen as the input variable for the feedback system. The change in strain on the composite plate was different at all locations on the plate during deflection. Thus, six strain gauges were placed at three positions i.e. tip, mid and root of the plate, at angle 0° and 45° in order to measure the change in strain at these locations and determine which is the best location to produce accurate control of the plate. The performance of the plate using these input variables were compared and analyzed by conducting experiments which required the plate to be deflected using the control system. In order to evaluate the performance of the controller under varying conditions, disturbances were also added to the experiments. The disturbances introduced were similar to those faced by aircraft during flight that is wind flow at varying velocities conducted in the wind tunnel. From the experimental results, it was found that the tip of the plate had the highest change in strain value and the control using input from the strain gauge located there produced the best performance as compared to input from strain gauges located at mid and root of the plate. However, in the presence of airflow, it was found that the best control performance was using feedback from the strain gauge located in the middle of the plate.","PeriodicalId":106850,"journal":{"name":"Electronics Science Technology and Application","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-01-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126170737","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Non-Graded Base Si/Ge Heterojunction Transistor 非梯度基极Si/Ge异质结晶体管
Electronics Science Technology and Application Pub Date : 2019-01-16 DOI: 10.18686/ESTA.V6I1.70
Sam Mil'shtein, Harsha Purushothama Dombala, Oliver A Kia, M. Zinaddinov
{"title":"Non-Graded Base Si/Ge Heterojunction Transistor","authors":"Sam Mil'shtein, Harsha Purushothama Dombala, Oliver A Kia, M. Zinaddinov","doi":"10.18686/ESTA.V6I1.70","DOIUrl":"https://doi.org/10.18686/ESTA.V6I1.70","url":null,"abstract":"Innovation of Heterojunction Bipolar Transistor (HBT) technology is a major game changer in wireless communication, power amplifiers and other major fields of electronics. HBTs play a vital role in extending the advantages of silicon bipolar transistors to significantly higher levels. Research on HBT is focused on reducing cost and improving reliability.  These transistors have a wide range of applications namely, digital-to-analog converters, logarithmic amplifiers, RF chip sets for CDMA wireless communication systems, and power amplifiers for cellular communications. Our study focuses on utilizing the high mobility of pure Ge instead of often-used graded Ge base. Non-grtaded Ge base enhanses carrier transport which in turn increases the gain and cut-off frequency of the HBT. We have developed a high frequency, high current gain, high power gain and less noisy heterojunction bipolar transistor operating above 100GHz frequency. Lattice mismatch at emitter and collector junctions is compensated by inserting SiGe buffer layers. ATLAS TCAD - SILVACO software is used for modelling of this novel device.","PeriodicalId":106850,"journal":{"name":"Electronics Science Technology and Application","volume":"78 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-01-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132978333","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Artificial Intelligence in the Computer-Age Threatens Human Beings and Working Conditions at Workplaces 计算机时代的人工智能威胁着人类和工作场所的工作条件
Electronics Science Technology and Application Pub Date : 2018-09-06 DOI: 10.18686/ESTA.V5I3.76
Phothong Saithibvongsa, J. Yu
{"title":"Artificial Intelligence in the Computer-Age Threatens Human Beings and Working Conditions at Workplaces","authors":"Phothong Saithibvongsa, J. Yu","doi":"10.18686/ESTA.V5I3.76","DOIUrl":"https://doi.org/10.18686/ESTA.V5I3.76","url":null,"abstract":"Due to the fact that there is a huge technological progress and automation trend in the working world in this 21st century, Artificial Intelligence (AI) is not only considered as a new innovative product of technological advancement for humankind but it also perceived as a new serious threat for workers during new industrial revolution in the computer-age. The main purpose of this article is to study on the effects of AI on working conditions, environments and skills at workplaces. Because of this study is considered as an exploratory research or qualitative research, data is collected by interviewing some workers in industrial sectors in South Korea and interview videos which provide some critical opinions on Industrial Revolutions, robotic trend and AI. And then the arguments are discussed and supported by the results of other academic studies. As the result of the mentioned process, it is possible to say that AI has a great influence on employment condition in the computer-age and this study can identify four significant effects on working place. One of those effects is that AI directly and indirectly hinders human-being relations in the workplace. Another effect is to destroy our working knowledge and skills which are needed for a job in the traditional working world. Additionally, AI gradually demolishes workplace engagement and organizational identity. Apart from these unexpected effects, AI is commonly perceived as a main cause leading to such a serious unemployment growth in our society. In order to cope with these new challenges which might be caused by AI and rapidly technological development at workplaces, some significant solutions are introduced including AI is created for increasing the capacity of workers rather than replacing human workers, putting obligations and responsibilities on AI which is intentionally created and used to replace human workers and law enforcement on the areas which should be fully support for developing Artificial Intelligences and which sectors cannot be allowed to be dominated by AI is necessary. The article conclusion, limitations and suggestions for the future research will be discussed in the next parts respectively.","PeriodicalId":106850,"journal":{"name":"Electronics Science Technology and Application","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-09-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129410074","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Understanding the mHealth implementation and adoption impact: a FVM perspective 了解移动医疗的实施和采用的影响:从FVM的角度
Electronics Science Technology and Application Pub Date : 2018-08-14 DOI: 10.18686/ESTA.V5I3.65
N. Wickramasinghe
{"title":"Understanding the mHealth implementation and adoption impact: a FVM perspective","authors":"N. Wickramasinghe","doi":"10.18686/ESTA.V5I3.65","DOIUrl":"https://doi.org/10.18686/ESTA.V5I3.65","url":null,"abstract":"Successful adoption and implementation of Mobile Health applications (mHealth) has been the subject of extensive research as can be evidenced by the large body of research literature on this topic. However, the fit and viability perspective issues have been less widely studied, perhaps because of the difficulty and complexity of healthcare services and delivery factors and their studies. In today’s global business environment this remains a key issue and critical success factor. Hence, this paper explains how challenging the mHealth application implementation success is for organizations government and patients. Furthermore, it is also very important to assess a fit and viability of mHealth application implementations in diverse environment. By drawing upon multiple streams of theory building, a framework, from the Fit-Viability Model (FVM) perspective, is developed. The framework provides important and valuable guiding principles for the decisions on adoption and deployment of mHealth applications. Grounded on the fit-viability framework, the paper advocates the use of a multi-case study approach to examine the success or failure of mHealth applications adoption and implementation. Managers and researchers can use the developed framework to identify the fit and viability of mHealth applications implementations to increase the possibility of success. ","PeriodicalId":106850,"journal":{"name":"Electronics Science Technology and Application","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-08-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133856060","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
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