Composites Communications最新文献_第2页

High-performance cobalt-embedded SiC nanofiber fabric for microwave dissipation 用于微波消散的高性能嵌钴碳化硅纳米纤维织物

IF 6.5 2区材料科学

Composites Communications Pub Date : 2024-10-21 DOI: 10.1016/j.coco.2024.102131

引用次数: 0

Flexible and antistatic carbon fiber/silicone rubber composite coating with improved thermal stability, mechanical and wave-transmission properties 柔性抗静电碳纤维/硅橡胶复合涂层，具有更好的热稳定性、机械性能和透波性能

IF 6.5 2区材料科学

Composites Communications Pub Date : 2024-10-20 DOI: 10.1016/j.coco.2024.102130

{"title":"Flexible and antistatic carbon fiber/silicone rubber composite coating with improved thermal stability, mechanical and wave-transmission properties","authors":"","doi":"10.1016/j.coco.2024.102130","DOIUrl":"10.1016/j.coco.2024.102130","url":null,"abstract":"<div><div>The properties of the interface have a significant impact on the application of silicone rubber (SR) composite coating fillers with carbon fiber (CF). The one-step growth of silica nanoparticles on the fiber surface was investigated in terms of the mechanical, electrical, and thermal properties of the CF/SR composite coatings. The results showed that the tensile strength and elongation of the composite with modified fibers were 7.13 ± 0.44 MPa and 690.40 ± 37.04 %, which were 20.44 % and 23.22 % higher than those with unmodified CFs, respectively. The improvement in interfacial adhesion by silica modification effectively disperses stress and avoids stress concentration. Additionally, the introduction of the low-dielectric material SiO<sub>2</sub> and the reduction of the interfacial polarization enhanced the wave-transmission properties and weakened the electromagnetic wave-shielding properties of the composites. Meanwhile, the silica modification maintained the antistatic properties of the coatings at room and high temperatures, as well as before and after bending. The weight loss of the composites with modified fibers was lower than that of the composites with unmodified fibers, while the thermal conductivity was higher because of the stable structure of the Si-O-Si bonds and interfacial adhesion. This work provides a simple way to enhance the thermal resistance, thermal conductivity, mechanical and wave-transmission properties, and preserve the antistatic properties as well as the flexibility of CF/SR composite coatings.</div></div>","PeriodicalId":10533,"journal":{"name":"Composites Communications","volume":null,"pages":null},"PeriodicalIF":6.5,"publicationDate":"2024-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142532299","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Mechanically strong, transparent polyimide composite thin films with a low dielectric constant 具有低介电常数的机械强度透明聚酰亚胺复合薄膜

IF 6.5 2区材料科学

Composites Communications Pub Date : 2024-10-19 DOI: 10.1016/j.coco.2024.102129

引用次数: 0

Fabrication of ultra-high strength MWCNTs/CI /PI rigid composite foam with excellent microwave absorption performance by pressure foaming method 利用压力发泡法制造具有优异微波吸收性能的超高强度 MWCNTs/CI /PI 硬质复合泡沫

IF 6.5 2区材料科学

Composites Communications Pub Date : 2024-10-18 DOI: 10.1016/j.coco.2024.102117

{"title":"Fabrication of ultra-high strength MWCNTs/CI /PI rigid composite foam with excellent microwave absorption performance by pressure foaming method","authors":"","doi":"10.1016/j.coco.2024.102117","DOIUrl":"10.1016/j.coco.2024.102117","url":null,"abstract":"<div><div>Polyimide (PI) foam exhibits excellent high-temperature resistance and outstanding physical and chemical stability, making it an ideal matrix for absorbing materials. However, the growing demand for absorbing materials that can serve as load-bearing components has revealed that existing polyimide composite foams often fall short of practical application requirements due to their low mechanical properties. The study employed a simple foaming method using isocyanate-based polyimide as the foam base under a 0.2 MPa atm. Multi-walled carbon nanotubes (MWCNTs) and carbonyl iron (CI) powder were added sequentially to the precursor solution. Under the filling parameters of 2.0 % MWCNTs and 10 % CI powder, the compressive strength of polyimide composite foam reaches 16.2 MPa and exhibits excellent microwave absorption properties, with a minimum reflection loss (RL<sub>min</sub>) of −62.51 dB and an effective absorption bandwidth (EAB) of 7.86 GHz. Additionally, the prepared composite foam has potential infrared stealth capability. This work offers new insights for rapid and low-cost manufacturing of high-strength absorbing foam.</div></div>","PeriodicalId":10533,"journal":{"name":"Composites Communications","volume":null,"pages":null},"PeriodicalIF":6.5,"publicationDate":"2024-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142532301","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Characterize the high-temperature steady-state rheological behavior and Arrhenius activation of PEEK via strain rate jump tensile tests 通过应变速率跃迁拉伸试验确定 PEEK 的高温稳态流变行为和阿伦尼乌斯活化特性

IF 6.5 2区材料科学

Composites Communications Pub Date : 2024-10-16 DOI: 10.1016/j.coco.2024.102127

{"title":"Characterize the high-temperature steady-state rheological behavior and Arrhenius activation of PEEK via strain rate jump tensile tests","authors":"","doi":"10.1016/j.coco.2024.102127","DOIUrl":"10.1016/j.coco.2024.102127","url":null,"abstract":"<div><div>Polyetheretherketone (PEEK) is a high-performance thermoplastic polymer with diverse industrial applications, such as aerospace, automotive, electronics, and medical devices. However, systematic research on its high-temperature rheological characteristics is inadequate. In this study, strain rate jump tensile tests were introduced to examine the steady-state rheology phenomena and strain rate sensitivity of PEEK at four different temperatures and nine different strain rates. Theoretical analysis based on the free volume theory and the Arrhenius law was also carried out to further analyze the transition of PEEK from Newtonian flow to non-Newtonian flow. Results indicate that PEEK materials exhibit a transition from Newtonian flow to non-Newtonian flow similar to metal materials at high temperatures. The transition point from Newtonian flow to non-Newtonian flow is marked by the emergence of steady-state rheology and its characteristic stress. Theoretical analysis demonstrates that the transition of PEEK is in accordance with the Arrhenius low. Moreover, its apparent activation energy (1.42 eV) is significantly lower than that of metal materials (5.28 eV), indicating a lower energy barrier and an easier transition. The strain rate sensitivity index correlates negatively with rising temperatures, especially at lower rates. This study enhances understanding of PEEK's rheological characteristics at high temperatures, aiding the development and application of high-performance thermoplastic materials.</div></div>","PeriodicalId":10533,"journal":{"name":"Composites Communications","volume":null,"pages":null},"PeriodicalIF":6.5,"publicationDate":"2024-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142532303","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Robust and washable silk fiber-based electrochemical biosensor for high-performance sensing of hydrogen peroxide 坚固耐用、可清洗的丝纤维电化学生物传感器，用于高性能检测过氧化氢

IF 6.5 2区材料科学

Composites Communications Pub Date : 2024-10-15 DOI: 10.1016/j.coco.2024.102122

{"title":"Robust and washable silk fiber-based electrochemical biosensor for high-performance sensing of hydrogen peroxide","authors":"","doi":"10.1016/j.coco.2024.102122","DOIUrl":"10.1016/j.coco.2024.102122","url":null,"abstract":"<div><div>Wearable electronics, especially fiber-based biosensors, show promise in large-scale production and reusability compared with conventional wafer-based electronics. However, it is challenging to use wearable electronics, with less intensity and non-wash ability, to produce fiber-based biosensors for textiles. Here, a robust and washable <em>Prussian blue</em> (PB)-functionalized silk fiber (PB-SF) flexible electrode is reported. Modified cyanotype is successfully employed to immobilize PB nanoparticles (∼18.32 nm) onto silk fibers for hydrogen peroxide (H<sub>2</sub>O<sub>2</sub>) detection. The intrinsic mechanical properties of silk fibers are well maintained with slight increases in stress (∼10 %) and strain (∼16 %). Furthermore, the PB-SF electrode displays good electrochemical H<sub>2</sub>O<sub>2</sub> sensing performance with a sensitivity of 716.54 μA/mM·cm<sup>2</sup>, a linear range of 0.01–0.6 mM and a low detection limit of 10 μM (S/N = 3). Notably, the hybrid PB-SF electrode adapts to mechanical deformations with a series of angles and the electrical signals are not compromised obviously even after 100 home laundry washing cycles. PB modified silk fibers is simple, easy-operating and cost-effective electrode that is suitable for large-scale production as it can be integrated into e-textiles through typical textile processing methods.</div></div>","PeriodicalId":10533,"journal":{"name":"Composites Communications","volume":null,"pages":null},"PeriodicalIF":6.5,"publicationDate":"2024-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142532305","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A computational study of the effects of graphene additions on electrical properties of polycrystalline copper 添加石墨烯对多晶铜电性能影响的计算研究

IF 6.5 2区材料科学

Composites Communications Pub Date : 2024-10-15 DOI: 10.1016/j.coco.2024.102124

{"title":"A computational study of the effects of graphene additions on electrical properties of polycrystalline copper","authors":"","doi":"10.1016/j.coco.2024.102124","DOIUrl":"10.1016/j.coco.2024.102124","url":null,"abstract":"<div><div>The addition of graphene has recently shown promise as a route for the significant improvement of the bulk electrical properties of metallic materials. We explore the effects these additions have on the net electrical conductivity of fabricated copper-graphene (Cu-Gr) nanocomposites as a function of grain structure and grain boundary properties. Synthetic 3D microstructures were generated to represent polycrystalline copper with different average grain diameters and twinned grain boundary fractions. Then, the Poisson equation of electrical transport was solved using a finite difference method in order to predict the net electrical conductivity of each microstructure. In this context, the potential effect of graphene on the conductivity of the composite was evaluated as a function of the number of affected grain boundaries. The results of these calculations indicate that 1.) as supported by literature, net electrical conductivity decreases with decreasing grain size, 2.) the presence of twinned grain boundaries results in smaller loss of conductivity than would otherwise be expected, and 3.) the presence of graphene on the grain boundaries can be expected to lead to improvements in net electrical conductivity. However, we also find that 4.) when the Cu grain structure becomes sufficiently refined, the addition of graphene could conceivably result in significant improvements in electrical conductivity over and above coarse-grained Cu. It is estimated from our calculations that, assuming microstructures with average grain sizes between 100 nm and 100 μm and graphene conductivity 1000 to 10,000 that of a typical Cu grain boundary, an improvement in electrical conductivity of approximately 17 % over that of bulk Cu may be attainable. Therefore, by performing this study we suggest a possible route for the improvement of Cu electrical properties through the addition of graphene.</div></div>","PeriodicalId":10533,"journal":{"name":"Composites Communications","volume":null,"pages":null},"PeriodicalIF":6.5,"publicationDate":"2024-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142532306","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thermosetting boron-nitride-filled polybutadiene composites with enhanced thermal conductivity and good dielectric properties 热固性氮化硼填充聚丁二烯复合材料具有更强的导热性和良好的介电性能

IF 6.5 2区材料科学

Composites Communications Pub Date : 2024-10-15 DOI: 10.1016/j.coco.2024.102128

{"title":"Thermosetting boron-nitride-filled polybutadiene composites with enhanced thermal conductivity and good dielectric properties","authors":"","doi":"10.1016/j.coco.2024.102128","DOIUrl":"10.1016/j.coco.2024.102128","url":null,"abstract":"<div><div>Low dielectric materials with high heat dissipation, low dielectric constant (<em>D</em><sub>k</sub>), and dielectric loss (<em>D</em><sub>f</sub>) are urgently needed to address the issues of signal cross-talk and heat accumulation arising from the rapid development of modern communication technology and the integration of microelectronics. Polyolefins, as hydrocarbon polymers, have shown significant potential due to their excellent low dielectric properties. However, their low polarity and flexible structures limit their thermal conductivity and thermomechanical properties. In this study, we developed a method to prepare thermosetting polybutadiene composites with enhanced thermal conductivity and good dielectric performance by modifying hexagonal boron nitride (h-BN) and hydroxyl-terminated polybutadiene (HTPB) with thermally cross-linkable benzocyclobutene (BCB) groups. The properties of the resulting composites were tailored by varying the filler content. With 30 wt% of the BCB-modified filler, the composite (HB-30) displayed excellent dielectric properties (<em>D</em><sub>k</sub> = 2.70; <em>D</em><sub>f</sub> = 1.67 × 10<sup>−3</sup> @10 GHz). Meanwhile, it exhibited a thermal conductivity of 0.615 W/mK at 35 °C, which was 7.1 times that of pristine HTPB. It also showed significantly enhanced mechanical properties and thermal stability with a storage modulus of 2.7 GPa and a glass transition temperature (<em>T</em><sub>g</sub>) of 208.5 °C. This method proved effective for preparing polymer composites with enhanced thermal conductivity, heat resistance, mechanical properties and good dielectric properties, making them suitable for high-frequency communication applications.</div></div>","PeriodicalId":10533,"journal":{"name":"Composites Communications","volume":null,"pages":null},"PeriodicalIF":6.5,"publicationDate":"2024-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142532304","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

An ultra-low density and mechanically robust ANFs/MXene/UiO-66-NH2 aerogel for enhancing thermal conductivity and tribological properties of epoxy resins 一种超低密度、机械坚固的 ANFs/MXene/UiO-66-NH2 气凝胶，用于增强环氧树脂的导热性和摩擦学性能

IF 6.5 2区材料科学

Composites Communications Pub Date : 2024-10-12 DOI: 10.1016/j.coco.2024.102123

引用次数: 0

Reactive extrusion for efficient preparation of high temperature resistant PA6T/66/BN composites with great thermal management and mechanical properties 反应挤压法高效制备具有良好热管理和机械性能的耐高温 PA6T/66/BN 复合材料

IF 6.5 2区材料科学

Composites Communications Pub Date : 2024-10-10 DOI: 10.1016/j.coco.2024.102121

{"title":"Reactive extrusion for efficient preparation of high temperature resistant PA6T/66/BN composites with great thermal management and mechanical properties","authors":"","doi":"10.1016/j.coco.2024.102121","DOIUrl":"10.1016/j.coco.2024.102121","url":null,"abstract":"<div><div>High temperature resistant polymer-based composite with high thermal conductivity and great mechanical properties are highly demanded in the field of electronic devices for simultaneously meeting surface mounting process and high-power operation. The key to achieving this goal is to balance the contradiction between the high melt viscosity of high-temperature resistant polymers and the dispersibility of fillers. In this work, the high-performance polyamide 6T/66/hexagonal boron nitride (PA6T/66/BN) composites were fabricated successfully via the method combining prepolymerization and reactive extrusion. Results demonstrated that this method not only significantly improves the preparation efficiency of high temperature resistant polyamide and its composites, but also enables the prepared composites to reach 3.6 W/(m⋅K), over 299 °C and 67.8 MPa in thermal conductivity, melting point and tensile strength respectively. Furthermore, the prepared composite exhibits excellent thermal management effects on LED and CPU. Therefore, the results of this work are of great significance for the efficient preparation and wide application of high-temperature resistant polymer based thermally conductive composites.</div></div>","PeriodicalId":10533,"journal":{"name":"Composites Communications","volume":null,"pages":null},"PeriodicalIF":6.5,"publicationDate":"2024-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142432796","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0