2013 3rd IEEE CPMT Symposium Japan最新文献

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Improvement of chemical resistance of positive-tone photosensitive polyimide coatings in the electroless plating process 化学镀工艺中正色调光敏聚酰亚胺涂层耐化学性的提高
2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756123
Osamu Baba, Satoshi Kamemoto, Yuki Masuda, Tomoyuki Yuba, Masao Tomikawa
{"title":"Improvement of chemical resistance of positive-tone photosensitive polyimide coatings in the electroless plating process","authors":"Osamu Baba, Satoshi Kamemoto, Yuki Masuda, Tomoyuki Yuba, Masao Tomikawa","doi":"10.1109/ICSJ.2013.6756123","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756123","url":null,"abstract":"We found that positive-tone photosensitive polyimide (posi-PSPI) shows not to be compatible for electroless Ni/Au plating process which are used for Au micro bumping. In order to meet compatibility for the process, we improved chemical resistance of positive-tone photosensitive polyimide especially for electroless plating process. Changing of polyimide polymer structure is most effective to obtain chemical resistant for the electroless plating process. The obtained PSPI are useful for saving bumping process and reliable in forming pattern.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124280870","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Polymer waveguide-coupled 14-Gb/s × 12-channel parallel-optical modules mounted on optical PCB through Sn-Ag-Cu-solder reflow 聚合物波导耦合14gb /s × 12通道并行光模块通过sn - ag - cu焊流安装在光学PCB上
2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756090
Agyl Fajar Rizky, N. Nishimura, Yoshinobu Nekado, T. Uemura, H. Nasu
{"title":"Polymer waveguide-coupled 14-Gb/s × 12-channel parallel-optical modules mounted on optical PCB through Sn-Ag-Cu-solder reflow","authors":"Agyl Fajar Rizky, N. Nishimura, Yoshinobu Nekado, T. Uemura, H. Nasu","doi":"10.1109/ICSJ.2013.6756090","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756090","url":null,"abstract":"We demonstrate a novel architecture of mounting parallel-optical modules (POMs) onto an optical printed circuit board (PCB) through Sn-Ag-Cu-solder reflow process where precisely positioned stud-pins on optical PCB and guide holes formed on POMs were mated to maintain good optical coupling. We confirmed that fabricated 14-Gb/s × 12-channel POMs achieved a good transmission performance on a test environment using evaluation boards. Then, the POM was mounted onto the optical PCB through Sn-Ag-Cu-solder reflow process actually. We report coupling loss characteristics and signal qualities at 14-Gb/s PRBS 231-1 for the optical link using POM-mounted optical PCBs.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126476423","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Modal power distribution in short reach optical communications using step-index-type multimode optical fibers 采用步进折射率型多模光纤的短距离光通信的模态功率分配
2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756101
M. Kagami, A. Kawasaki, M. Yonemura
{"title":"Modal power distribution in short reach optical communications using step-index-type multimode optical fibers","authors":"M. Kagami, A. Kawasaki, M. Yonemura","doi":"10.1109/ICSJ.2013.6756101","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756101","url":null,"abstract":"In an optical communication system using Step Index type Multi-Mode optical Fiber (SI-MMF), the propagating modal power distribution (MPD) in the fiber is strongly influenced by the transmission characteristics. In most cases the MPD launched from the optical transmitter is significantly transformed before reaching the receiver due to a number of factors, i.e. mode conversion and mode dispersion along the fiber and the various components inserted in the optical path. In order to secure the minimum received optical power and desired bandwidth at the receiver, we propose using the concept of “Total MPD management” for all interfaces in the transmission line. To implement this concept, a method of specifying requirements to the device side from the specifications on the system side is needed. Although rapid changes in MPD arise, especially in SI-MMFs, there is no universal means of quantifying this. In this paper, we define a simple quantification method for MPD which we have named the “encircled angular flux (EAF)”, and which can be used to accurately design optical systems (FFP-based). Moreover, this EAF acts as a fundamental parameter for the design, mounting and evaluation of optical components and can provide the specifications required for connecting to a network. We expect the use of “Total MPD management” and “IEC standardization” will generate interest in related institutions and suppliers worldwide.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127205051","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Ultra-wideband noise suppression of power supply noise by combining mushroom and planar type EBG structures 结合蘑菇型和平面型EBG结构对电源噪声的超宽带抑制
2013 3rd IEEE CPMT Symposium Japan Pub Date : 1900-01-01 DOI: 10.1109/ICSJ.2013.6756111
K. Ikemiya, Mayumi Sakai, T. Sudo
{"title":"Ultra-wideband noise suppression of power supply noise by combining mushroom and planar type EBG structures","authors":"K. Ikemiya, Mayumi Sakai, T. Sudo","doi":"10.1109/ICSJ.2013.6756111","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756111","url":null,"abstract":"Power supply noise spectra generated by CMOS digital circuits has been shifting to the higher frequency range, as the clock frequency of CMOS digital circuit is becoming faster year by year. Therefore, a new electromagnetic band gap (EBG) structure is strongly required to prevent the wide frequency noise from DC to high frequency components so as to apply to any operating frequencies of CMOS digital circuits and RF circuits. In this paper, a new EBG structure with ultra-wide stop band has been proposed by combining two kinds of EBG structures, i.e., the mushroom type and the planar type EBG structures in a printed circuits board (PCB). This EBG structure consisted of 4 conductive layers. By placing two power supply layers and two ground planes alternatively, two mushroom type EBG structures were constituted vertically in the 4 conductive layers. The unit cells with the same potential were connected each other using via holes. In addition, the top conductive layer provided the planar EBG structure with longer bridge line than the conventional EBG structure. The new EBG structure has been found to have a ultra-wide stop band property by measurement and simulation.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"121 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131289415","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide 板水平跌落可靠性试验的有限元分析及聚酰亚胺的应力缓冲效应分析
2013 3rd IEEE CPMT Symposium Japan Pub Date : 1900-01-01 DOI: 10.1109/ICSJ.2013.6756126
Mitsuru Fujita, Nobuhiro Anzai, K. Sakamaki, Y. Kariya
{"title":"A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide","authors":"Mitsuru Fujita, Nobuhiro Anzai, K. Sakamaki, Y. Kariya","doi":"10.1109/ICSJ.2013.6756126","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756126","url":null,"abstract":"Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"47 12","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120852532","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating 采用刮刀涂层形成的柔性银纳米颗粒层包覆铜凸起的新型键合方法
2013 3rd IEEE CPMT Symposium Japan Pub Date : 1900-01-01 DOI: 10.1109/ICSJ.2013.6756116
Weixin Fu, J. Mizuno, S. Shoji, T. Kasahara, A. Okada, Shugo Ishizuka
{"title":"Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating","authors":"Weixin Fu, J. Mizuno, S. Shoji, T. Kasahara, A. Okada, Shugo Ishizuka","doi":"10.1109/ICSJ.2013.6756116","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756116","url":null,"abstract":"A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"34 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124257981","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Symposium committee 会议委员会
2013 3rd IEEE CPMT Symposium Japan Pub Date : 1900-01-01 DOI: 10.1109/arith.2013.13
D. Matula
{"title":"Symposium committee","authors":"D. Matula","doi":"10.1109/arith.2013.13","DOIUrl":"https://doi.org/10.1109/arith.2013.13","url":null,"abstract":"","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"100 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124703204","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Copyright page 版权页
2013 3rd IEEE CPMT Symposium Japan Pub Date : 1900-01-01 DOI: 10.1109/transducers.2015.7180844
{"title":"Copyright page","authors":"","doi":"10.1109/transducers.2015.7180844","DOIUrl":"https://doi.org/10.1109/transducers.2015.7180844","url":null,"abstract":"Copyright and Reprint Permission: Abstracting is permitted with credit to the source. Libraries are permitted to photocopy beyond the limit of U.S. copyright law for private use of patrons those articles in this volume that carry a code at the bottom of the first page, provided the per-copy fee indicated in the code is paid through Copyright Clearance Center, 222 Rosewood Drive, Danvers, MA 01923. For other copying, reprint or republication permission, write to IEEE Copyrights Manager, IEEE Operations Center, 445 Hoes Lane, Piscataway, NJ 08854. All rights reserved. Copyright 2013 by IEEE.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"824 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125081804","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Development of high-speed X-ray CT inspection system using X-ray line sensor 利用x射线线传感器研制高速x射线CT检测系统
2013 3rd IEEE CPMT Symposium Japan Pub Date : 1900-01-01 DOI: 10.1109/ICSJ.2013.6756131
Daisuke Suzuki, K. Noguchi, T. Murakoshi, A. Teramoto
{"title":"Development of high-speed X-ray CT inspection system using X-ray line sensor","authors":"Daisuke Suzuki, K. Noguchi, T. Murakoshi, A. Teramoto","doi":"10.1109/ICSJ.2013.6756131","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756131","url":null,"abstract":"The recent progress in surface mount technology has highlighted an urgent demand for a higher performance level of inspection technology. X-ray inspection is one of the most suitable systems for substituting the conventional automated optical inspection system. In particular, X-ray computed tomography (CT) inspection provides precise inspection as it can obtain three-dimensional data and can distinguish the features on the top side of a double-sided printed circuit board (PCB) from those on the bottom side. However, X-ray inspection systems are not in common use in the surface mount production line due to their complex image capturing mechanism, which requires a longer inspection time. Taking this limitation into consideration, we developed a simple mechanism utilizing an X-ray line sensor to obtain CT images of a wide area at a faster rate. We term this system as linear CT. In this paper, we explain the image capturing mechanism of linear CT and report that this mechanism can generate cross-sectional images of sufficiently high quality for precise inspection.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"147 Pt 8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126313651","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Highly efficient connectivity between VCSEL and multimode optical waveguide VCSEL与多模光波导之间的高效连接
2013 3rd IEEE CPMT Symposium Japan Pub Date : 1900-01-01 DOI: 10.1109/ICSJ.2013.6756098
H. Ishikawa, R. Kinoshita, T. Ishigure
{"title":"Highly efficient connectivity between VCSEL and multimode optical waveguide","authors":"H. Ishikawa, R. Kinoshita, T. Ishigure","doi":"10.1109/ICSJ.2013.6756098","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756098","url":null,"abstract":"We evaluated connectivity between a Vertical Cavity Surface Emitting Laser (VCSEL) and a multimode optical waveguide. It is important to evaluate Far Field Pattern (FFP) of VCSEL. FFP is different depending on the VCSEL maker. Tolerance curve of Graded Index-Multi Mode Fiber (GI-MMF) and GI-core polymer waveguide under shifted VCSEL from center differed. We estimate the difference is depending on material and process. GI-core polymer waveguide makes scattering in optical waveguide.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133272328","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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