Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

2013 3rd IEEE CPMT Symposium Japan Pub Date : 1900-01-01 DOI:10.1109/ICSJ.2013.6756116

Weixin Fu, J. Mizuno, S. Shoji, T. Kasahara, A. Okada, Shugo Ishizuka

引用次数: 0

Abstract

A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.

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采用刮刀涂层形成的柔性银纳米颗粒层包覆铜凸起的新型键合方法

采用刮刀涂覆的方法，在铜凸包表面涂覆柔性的未完全烧结银纳米颗粒，形成了一种新型的凸包结构。该结构成功地与Cu衬底结合。抗剪强度达到118 MPa。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2013 3rd IEEE CPMT Symposium Japan

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