Yung-Hsun Wu, Chia-Hao Tsai, Yi-Hsiu Wu, Y. Cherng, Ming-Jou Tai, Potilar Huang, I-An Yao, Chiu-Lien Yang
{"title":"5‐2: Invited Paper: High dynamic range 2117‐ppi LCD for VR displays","authors":"Yung-Hsun Wu, Chia-Hao Tsai, Yi-Hsiu Wu, Y. Cherng, Ming-Jou Tai, Potilar Huang, I-An Yao, Chiu-Lien Yang","doi":"10.1002/sdtp.16481","DOIUrl":"https://doi.org/10.1002/sdtp.16481","url":null,"abstract":"We demonstrate a mini‐LED backlit 2117‐ppi LCD for virtual \u0000reality displays, which greatly enhances the dynamic range and \u0000mitigates the screen door effect. The major challenges and \u0000potential solutions for achieving over 2000‐ppi LCDs and the \u0000advantages of using mini‐LED backlight and low power solutions \u0000will be discussed.","PeriodicalId":91069,"journal":{"name":"Digest of technical papers. SID International Symposium","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49610255","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Kyung-II Joo, Sungjin Lim, Ki-Dong Lim, Jin Su Lee, Min-Kyu Park, Seon Kyu Yoon, Kwang-Hoon Lee
{"title":"P‐89: Digital Holography Microscope with liquid crystal phase modulator","authors":"Kyung-II Joo, Sungjin Lim, Ki-Dong Lim, Jin Su Lee, Min-Kyu Park, Seon Kyu Yoon, Kwang-Hoon Lee","doi":"10.1002/sdtp.16843","DOIUrl":"https://doi.org/10.1002/sdtp.16843","url":null,"abstract":"We proposed a DHM system with improved resolution property by using liquid crystal (LC) phase modulator. The LC phase modulator can stably control the phase modulation characteristics of the interference pattern and implements the four‐step phase shifting scheme. The proposed DHM system showed a four‐fold improvement in resolution compared to the conventional DHM with polarized camera. Finally, it was confirmed that the modulation transfer function (MTF) value was improved 2 times at the resolution target of 105 lines/mm.","PeriodicalId":91069,"journal":{"name":"Digest of technical papers. SID International Symposium","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42624905","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"52‐1: Ultracompact Virtual Reality System","authors":"Junyu Zou, Zhenyi Luo, Y. Rao, Shin‐Tson Wu","doi":"10.1002/sdtp.16667","DOIUrl":"https://doi.org/10.1002/sdtp.16667","url":null,"abstract":"We demonstrate an ultracompact virtual reality (VR) system with thickness of about 1‐cm. In this system, the imaging optics consists of a lenslet array, a deflector array, and a Pancharatnam‐Berry deflector (PBD). We have experimentally demonstrated a polarization interpolation configuration to reduce the system thickness by nearly 50%.","PeriodicalId":91069,"journal":{"name":"Digest of technical papers. SID International Symposium","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42744531","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"14‐3: Drop Resistance Optimization Through Post‐Hoc Analysis of Chemically Strengthened Glass","authors":"Myunghun Baek, Tae-Hwan An, S. Kuk, Kyongtae Park","doi":"10.1002/sdtp.16517","DOIUrl":"https://doi.org/10.1002/sdtp.16517","url":null,"abstract":"In the market of the mobile cover glass, the development of chemically strengthened glass is focused on the drop resistance improvement. The cover glass which protects the display panel is a typical brittle material that the micro cracks tends to be occurred underneath a glass surface by physical impacts. The micro cracks tends to be propagated by tensile stress and it is known as a general procedures on glass breakage. In purpose of the cover glass strength improvement, compressive stress is applied to the glass surface using chemical strengthening method by ion exchange. However, since the central area of the glass is relatively subjected to tensile stress, the glass is instantly broken when the propagated cracks are reached on the tensile stress exerted area. The glass specifications have been managed for maintaining the strength using parameters of compressive stress (CS), depth of compression (DOC), and central tension (CT). However, there was no method to judge the most effective factor for impact drop resistance. In order to solve this problem, we developed a machine learning program for cover glass that can predict the breakage height based on stress and mapped evaluation data based on the measured stress profile data and the actual drop breakage simulated evaluation. Especially, eXplainable AI (XAI) method is used to identify the effective factors on drop breakage height. And the test and measurement data were applied to various chemically strengthened glass for analysis.In this study, it was possible to predict the drop breakage height only by measuring the stress profile of chemically strengthened glass. The feature value of chemically strengthened that has the most effect on the drop breakage resistance on rough surfaces was identified to be stress value at 30um in the case of alkali aluminosilicate glass. And it was proved that the drop breakage height was improved by 25% only by increasing the compressive stress at 30um depth.","PeriodicalId":91069,"journal":{"name":"Digest of technical papers. SID International Symposium","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42972737","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Steudel, J. Vertommen, E. Le Boulbar, Giuseppe Buscemi, Lars Bach, S. Van Huylenbroeck, Shuo Kang, J. de Vos, A. Miller, H. Osman, K. Rebibis
{"title":"4‐3: MircoLED display on 300mm CMOS platform – crosstalk and optical outcoupling","authors":"S. Steudel, J. Vertommen, E. Le Boulbar, Giuseppe Buscemi, Lars Bach, S. Van Huylenbroeck, Shuo Kang, J. de Vos, A. Miller, H. Osman, K. Rebibis","doi":"10.1002/sdtp.16478","DOIUrl":"https://doi.org/10.1002/sdtp.16478","url":null,"abstract":"We have implemented microLED integration into a 300mm \u0000CMOS platform with 9150ppi and brightness > 1Mnits. Here we \u0000show the impact of light outcoupling optimization on optical \u0000crosstalk and efficiency extraction. By implementing wafer level \u0000optics we achieve a crosstalk reduction of more than 20dB \u0000between neighboring pixels with >20% of the light within the \u0000APEX angle of +/‐20deg relevant for waveguide optics.","PeriodicalId":91069,"journal":{"name":"Digest of technical papers. SID International Symposium","volume":"60 12","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50828828","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Ming Yang, Zhi K. Gao, Chuan X. Xu, Xuan Feng, Minghua Xuan
{"title":"25‐3: Design and fabricate of Under‐Display Camera OLED panel","authors":"Ming Yang, Zhi K. Gao, Chuan X. Xu, Xuan Feng, Minghua Xuan","doi":"10.1002/sdtp.16561","DOIUrl":"https://doi.org/10.1002/sdtp.16561","url":null,"abstract":"5.5inch FHD UDC OLED panel is designed and fabricated. The \u0000OLED panel is divided into three parts, i.e., UDC, transition and \u0000nomal area. Transition area locates at the left and right side of \u0000UDC area, the height and width of transition area and UDC \u0000area are the same. Drive circuits corresponding to EL in UDC \u0000area locate at odd rows of transition area, while drive circuits \u0000corresponding to EL in the transition area locate at even rows of \u0000transition area. Meanwhile, drive circuit in the transition area \u0000correspondes to two EL with the same color in UDC or transition \u0000area.","PeriodicalId":91069,"journal":{"name":"Digest of technical papers. SID International Symposium","volume":"64 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50828933","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Xing Liu, Hai Tang, Xiaolin Geng, Yongle Fang, Liang Gao, Ming Zhai, Haiwei Sun
{"title":"59‐3: Application of 3D printing in the reflector of glass‐based Mini LED Backlight","authors":"Xing Liu, Hai Tang, Xiaolin Geng, Yongle Fang, Liang Gao, Ming Zhai, Haiwei Sun","doi":"10.1002/sdtp.16696","DOIUrl":"https://doi.org/10.1002/sdtp.16696","url":null,"abstract":"This paper mainly introduces a method of making Mini‐LED backlight reflective layer by 3D printing technology. Compared with the conventional method, this method improves the optical brightness and the yield of the product while simplifying the technological process.","PeriodicalId":91069,"journal":{"name":"Digest of technical papers. SID International Symposium","volume":"54 12","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50829262","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"67‐1: Laser Process for Full Screen OLED Displays","authors":"Eonseok Oh, Taehyun Sung, J. Seo, Jehyun Song","doi":"10.1002/sdtp.16723","DOIUrl":"https://doi.org/10.1002/sdtp.16723","url":null,"abstract":"In this paper, a new process technology for full screen OLED display is presented, and this process targets premium smartphones using laser process. We have developed a laser patterning process that removes the EL material and cathode for the front screen of a smartphone. Punch‐hole display and UDC (Under Display Camera) have been successfully implemented using this technology, and it is expected that the degree of freedom in design will be improved through this process.","PeriodicalId":91069,"journal":{"name":"Digest of technical papers. SID International Symposium","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47933554","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"P‐158: Late‐News Poster: Dynamic Crosstalk Evaluation Method for Eye‐tracking based Autostereoscopic Display using a Virtual Image","authors":"Satoshi Mitani, Noriyuki Kato, Yuji Nakahata","doi":"10.1002/sdtp.16928","DOIUrl":"https://doi.org/10.1002/sdtp.16928","url":null,"abstract":"We propose a highly accurate dynamic crosstalk evaluation method for an eye‐tracking based autostereoscopic display. The method using a general‐purpose luminance meter and a virtual facial image for eye‐tracking enables the accurate crosstalk measurement while minimizing artifact caused by misalignment between the presented eye's position and detected eye's position.","PeriodicalId":91069,"journal":{"name":"Digest of technical papers. SID International Symposium","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44555056","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"3‐5: Privacy Device Using Peripheral Encoding","authors":"T. Large, Sehoon Lim","doi":"10.1002/sdtp.16476","DOIUrl":"https://doi.org/10.1002/sdtp.16476","url":null,"abstract":"Foveal rendering – where peripheral image content is rendered \u0000with lower resolution than axial content ‐ is well known as a \u0000technique for reducing computation requirements for wide \u0000angle displays. In this paper, we discuss various aspects of a \u0000peripheral encoding technique utilized for display privacy.","PeriodicalId":91069,"journal":{"name":"Digest of technical papers. SID International Symposium","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46877372","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}