Nanotechnology and Precision Engineering最新文献

{"title":"Study on the method of precision adjustment of star sensor","authors":"Xiaoyan Wang,&nbsp;Ran Zheng,&nbsp;Yanpeng Wu,&nbsp;Jianbo Sun,&nbsp;Jun Zhong,&nbsp;Long Wang,&nbsp;Miaomiao Wang","doi":"10.1016/j.npe.2018.12.001","DOIUrl":"10.1016/j.npe.2018.12.001","url":null,"abstract":"<div><p>Star sensors are indispensable spatial measurement sensors for high-resolution earth observation and astronomical observations, and the demand for high measurement accuracy of satellite sensors continues to increase; thus, the star sensor optical machine adjustment error cannot be ignored. The commonly used installation error correction method cannot solely meet the precision analysis requirements. In this paper, the relationship between the optical machine installation and the star sensor measurement error is analyzed, and several common adjustment error correction methods are compared. An adjustment method for optical machines is proposed to meet the requirements of very high precision star sensors. The assembly precision requirements of the investigated very high precision star sensor are analyzed considering the whole machine, and then the optical components are controlled through optical precision adjustments to satisfy the precision requirements. Finally, through the complete machine calibration, the star sensor precision adjustment for an optical machine structure is verified. This method meets the requirements of very high precision sensors and is suitable for the precision adjustment of optical machine structures, which is of practical significance to improve the precision of star sensors.</p></div>","PeriodicalId":87330,"journal":{"name":"Nanotechnology and Precision Engineering","volume":"1 4","pages":"Pages 248-257"},"PeriodicalIF":0.0,"publicationDate":"2018-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/j.npe.2018.12.001","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47237926","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Finite element simulation of the micromachining of nanosized-silicon-carbide-particle reinforced composite materials based on the cohesive zone model","authors":"Hongmin Pen ,&nbsp;Jianhua Guo ,&nbsp;Zizhen Cao ,&nbsp;Xianchong Wang ,&nbsp;Zhiguo Wang","doi":"10.1016/j.npe.2018.12.003","DOIUrl":"10.1016/j.npe.2018.12.003","url":null,"abstract":"<div><p>A finite element method based on the cohesive zone model was used to study the micromachining process of nanosized silicon-carbide-particle (SiCp) reinforced aluminum matrix composites. As a hierarchical multiscale simulation method, the parameters for the cohesive zone model were obtained from the stress-displacement curves of the molecular dynamics simulation. The model considers the random properties of the silicon-carbide-particle distribution and the interface of bonding between the silicon carbide particles and the matrix. The machining mechanics was analyzed according to the chip morphology, stress distribution, cutting temperature, and cutting force. The simulation results revealed that the random distribution of nanosized SiCp causes non-uniform interaction between the tool and the reinforcement particles. This deformation mechanics leads to inhomogeneous stress distribution and irregular cutting force variation.</p></div>","PeriodicalId":87330,"journal":{"name":"Nanotechnology and Precision Engineering","volume":"1 4","pages":"Pages 242-247"},"PeriodicalIF":0.0,"publicationDate":"2018-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/j.npe.2018.12.003","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41777213","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Formation of subsurface cracks in silicon wafers by grinding","authors":"Jingfei Yin ,&nbsp;Qian Bai ,&nbsp;Yinnan Li ,&nbsp;Bi Zhang","doi":"10.1016/j.npe.2018.09.003","DOIUrl":"10.1016/j.npe.2018.09.003","url":null,"abstract":"<div><p>Single-crystal silicon is an important material in the semiconductor and optical industries. However, being hard and brittle, a silicon wafer is vulnerable to subsurface cracks (SSCs) during grinding, which is detrimental to the performance and lifetime of a wafer product. Therefore, studying the formation of SSCs is important for optimizing SSC-removal processes and thus improving surface integrity. In this study, a statistical method is used to study the formation of SSCs induced during grinding of silicon wafers. The statistical results show that grinding-induced SSCs are not stochastic but anisotropic in their distributions. Generally, when grinding with coarse abrasive grains, SSCs form along the cleavage planes, primarily the {111} planes. However, when grinding with finer abrasive grains, SSCs tend to form along planes with a fracture-surface energy higher than that of the cleavage planes. These findings provide a guidance for the accurate detection of SSCs in ground silicon wafers.</p></div>","PeriodicalId":87330,"journal":{"name":"Nanotechnology and Precision Engineering","volume":"1 3","pages":"Pages 172-179"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/j.npe.2018.09.003","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47624311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Anisotropic brittle-ductile transition of monocrystalline sapphire during orthogonal cutting and nanoindentation experiments","authors":"Philipp Maas ,&nbsp;Yuta Mizumoto ,&nbsp;Yasuhiro Kakinuma ,&nbsp;Sangkee Min","doi":"10.1016/j.npe.2018.09.005","DOIUrl":"10.1016/j.npe.2018.09.005","url":null,"abstract":"<div><p>Single-crystal sapphire is utilized as a high-performance engineering material, especially in extreme and harsh environments. However, due to its extreme hardness and brittleness, the machinability of sapphire is still a challenge. By means of nanoindentation and plunge-cut experiments, the anisotropic brittle-ductile transition of the prismatic M-plane and rhombohedral R-plane is examined by analyzing crack morphologies and the critical depth-of-cut (CDC). The experimental results of the nanoindentation tests are correlated to the plunge-cut experiment. Both the prism plane and the rhombohedral crystal plane exhibit a two-fold symmetry of ductility with various crack patterns along the machined grooves. The direction-dependent plasticity of the hexagonal sapphire crystal is mainly connected to a twinning process accompanied by slip dislocation.</p></div>","PeriodicalId":87330,"journal":{"name":"Nanotechnology and Precision Engineering","volume":"1 3","pages":"Pages 157-171"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/j.npe.2018.09.005","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48269543","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Kinematic error modeling and error compensation of desktop 3D printer","authors":"Shane Keaveney,&nbsp;Pat Connolly,&nbsp;Eoin D. O'Cearbhaill","doi":"10.1016/j.npe.2018.09.002","DOIUrl":"10.1016/j.npe.2018.09.002","url":null,"abstract":"<div><p>Desktop 3D printers have revolutionized how designers and makers prototype and manufacture certain products. Highly popular fuse deposition modeling (FDM) desktop printers have enabled a shift to low-cost consumer goods markets, through reduced capital equipment investment and consumable material costs. However, with this drive to reduce costs, the computer numerical control (CNC) systems implemented in FDM printers are often compromised by poor accuracy and contouring errors. This condition is most critical as users begin to use 3D-printed components in load-bearing applications or to perform mechanical functions. Improved methods of low-cost 3D printer calibration are needed before their open-design potential can be realized in applications, including 3D-printed orthotics and prosthetics. This paper applies methodologies associated with high-precision CNC machining systems, namely, kinematic error modeling and compensation coupled with standardized test methods from ISO230-4, such as the ballbar for kinematic and dynamic error measurements, to examine the influence and feasibility for use on low-cost CNC/3D printing platforms. Recently, the U.S. Food and Drug Administration's “Technical considerations for additive manufactured medical devices” highlighted the need to develop standards specific to additive manufacturing in regulated manufacturing environments. This paper shows the benefits of the methods described within ISO230-4 for error assessment, alongside applying kinematic error modeling and compensation to the popular kinematic configuration of an Ultimaker 3D printer. A Renishaw ballbar QC10 is used to quantify the Ultimaker's errors and thereby populate the error model. This method quantifies machine errors and populates these in a mathematical model of the CNC system. Then, a post-processor can be used to compensate the printing code. Subsequently, the ballbar is used to demonstrate the dramatic impact of the error compensation model on the accuracy and contouring of the Ultimaker printer with 58% reduction in overall circularity error and 90% reduction in squareness error.</p></div>","PeriodicalId":87330,"journal":{"name":"Nanotechnology and Precision Engineering","volume":"1 3","pages":"Pages 180-186"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/j.npe.2018.09.002","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46817580","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Au maskless patterning for vacuum packaging using the electrochemical method","authors":"Bo Xie,&nbsp;Deyong Chen,&nbsp;Junbo Wang,&nbsp;Jian Chen,&nbsp;Wen Hong","doi":"10.1016/j.npe.2018.09.001","DOIUrl":"10.1016/j.npe.2018.09.001","url":null,"abstract":"<div><p>The interconnection of wires is an important issue in vacuum-packaged microelectromechanical systems devices because of the difficulties of hermetical sealing and electrical insulation. This paper presents an approach of Au film selective patterning on highly uneven surfaces for wire interconnections of devices in which silicon-on-insulator (SOI) wafers are anodically bonded to glass. The Au film on the handle layer, functioned as an anode, was selectively removed with electrochemical dissolution in a chloride solution. The choice of etchant solution and etching conditions were optimized to improve the process efficiency, resulting in a high yield of gold portions within the via holes for wire interconnection. The proposed wire interconnection technology was employed to fabricate a vacuum-packaged resonant pressure sensor as a proof-of-concept demonstration. Reliable wire bonding and vacuum package were achieved as well as a <em>Q</em> factor that does not decrease over a year. As a platform technology, this method provides a new approach of wire interconnection for vacuum-packaged devices based on SOI–glass anodic bonding.</p></div>","PeriodicalId":87330,"journal":{"name":"Nanotechnology and Precision Engineering","volume":"1 3","pages":"Pages 191-196"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/j.npe.2018.09.001","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49004097","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Optimization experiment on eccentric lapping of cylindrical rollers","authors":"Jia Su,&nbsp;Julong Yuan,&nbsp;Sen Zhang,&nbsp;Binghai Lv","doi":"10.1016/j.npe.2018.09.004","DOIUrl":"10.1016/j.npe.2018.09.004","url":null,"abstract":"<div><p>Cylindrical rollers are important elements of bearings, and their machining accuracy and consistency affect the bearing quality. Using a GCr15 cylindrical roller of <em>Ф</em>11 × 12 as the processing object in this study, the effects of loading pressure, abrasive concentration, and speed combination on cylindrical roller machining precision were investigated using the orthogonal experimental design method on a double-side eccentric pendulum lapping and polishing machine. The machining parameters of the lapping stage were optimized, and the lapping optimal process parameters were determined by S/N response analysis and analysis of variance (ANOVA). The results show that when the experiment was optimized using loading pressure of 10 N/roller, abrasive concentration (3000#Al₂O₃) of 20.0 wt%, and rotational speed combination, the material removal rate (MRR) of cylindrical roller reached 0.0896 μm/min; the average roughness of the batch decreased from 0.056 μm to 0.027 μm, 51.8% lower than the original batch average roughness, and the deviation decreased from the initial 0.022 μm to 0.014 μm; the batch average roundness error decreased from 0.47 μm to 0.28 μm, 40.4% lower than the original batch average roundness error, and the deviation decreased from the initial 0.19 μm to 0.038 μm; and the batch average diameter variation decreased from 4.5 μm to about 3.6 μm, 20% lower than the original batch average diameter variation. The double-side eccentric lapping of cylinder rollers does not only lead to improvement in the surface quality and shape accuracy of rollers, but also improvement in the batch consistency.</p></div>","PeriodicalId":87330,"journal":{"name":"Nanotechnology and Precision Engineering","volume":"1 3","pages":"Pages 197-204"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/j.npe.2018.09.004","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41265484","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Two-dimensional distributed strain sensing with an Archimedean spiral arrangement in optical frequency domain reflectometry","authors":"Yamei Guo,&nbsp;Zhenyang Ding,&nbsp;Kun Liu,&nbsp;Junfeng Jiang,&nbsp;Chenhuan Wang,&nbsp;Tiegen Liu","doi":"10.1016/j.npe.2018.07.002","DOIUrl":"10.1016/j.npe.2018.07.002","url":null,"abstract":"<div><p>We demonstrate a distributed two-dimensional (2D) strain-sensing system in optical frequency domain reflectometry (OFDR) with an Archimedean spiral arrangement of the sensing fiber. The Archimedean spiral describes a simple relationship between the radial radius and polar angle, such that each circle (the polar angle from 0 to 2π) can sense the 2D strain in all directions. The strain between two adjacent circles can also be easily obtained because an Archimedean spiral facilitates sensing of every angle covering the full 2D range. Based on the mathematical relation of Archimedean spirals, we deduce the relationship between the one-dimensional position of the sensing fiber and 2D distribution in polar coordinates. The results of the experiment show that an Archimedean spiral arrangement system can achieve 2D strain sensing with different strain load angles.</p></div>","PeriodicalId":87330,"journal":{"name":"Nanotechnology and Precision Engineering","volume":"1 3","pages":"Pages 187-190"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/j.npe.2018.07.002","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42378034","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"An Investigation on Efficient Acoustic Energy Reflection of Flexible Film Bulk Acoustic Resonators","authors":"Chuanhai Gao,&nbsp;Yuan Jiang,&nbsp;Lin Zhang,&nbsp;Bohua Liu,&nbsp;Menglun Zhang","doi":"10.13494/j.npe.20180011","DOIUrl":"10.13494/j.npe.20180011","url":null,"abstract":"<div><p>This paper investigates the issues on acoustic energy reflection of flexible film bulk acoustic resonators (FBARs). The flexible FBAR was fabricated with an air cavity in the polymer substrate, which endowed the resonator with efficient acoustic reflection and high electrical performance. The acoustic wave propagation and reflection in FBAR were first analyzed by Mason model, and then flexible FBARs of 2.66 GHz series resonance in different configurations were fabricated. To validate efficient acoustic reflection of flexible resonators, FBARs were transferred onto different polymer substrates without air cavities. Experimental results indicate that efficient acoustic reflection can be efficiently predicted by Mason model. Flexible FBARs with air cavities exhibit a higher figure of merit (FOM). Our demonstration provides a feasible solution to flexible MEMS devices with highly efficient acoustic reflection (i.e. energy preserving) and free-moving cavities, achieving both high flexibility and high electrical performance.</p></div>","PeriodicalId":87330,"journal":{"name":"Nanotechnology and Precision Engineering","volume":"1 2","pages":"Pages 129-132"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.13494/j.npe.20180011","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41359037","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Self-Adaptive Grinding for Blind Tip Reconstruction of AFM Diamond Probe","authors":"Linyan Xu 1,&nbsp;Qishan Guo 2,&nbsp;Shuangbei Qian,&nbsp;Sen Wu","doi":"10.13494/j.npe.20170010","DOIUrl":"10.13494/j.npe.20170010","url":null,"abstract":"<div><p>Blind tip reconstruction (BTR) method is one of the favorable methods to estimate the atomic force microscopy (AFM) probe shape. The exact shape of the characterizer is not required for BTR, while the geometry of the sample may affect the reconstruction significantly. A cone-shaped array sample was chosen as a characterizer to be evaluated. The target AFM probe to be reconstructed was a diamond triangular pyramid probe with two feature angles, namely front angle (FA) and back angle (BA). Four conical structures with different semi-angles were dilated by the pyramid probe. Simulation of scanning process demonstrates that it is easy to judge from the images of the isolated rotary structure, cone-shaped, the suitability of the sample to be a tip characterizer for a pyramid probe. The cone-shaped array sample was repeatedly scanned 50 times by the diamond probe using an AFM. The series of scanning images shrank gradually and more information of the probe was exhibited in the images, indicating that the characterizer has been more suitable for BTR. The feature angle FA of the characterizer increasingly reduces during the scanning process. A self-adaptive grinding between the probe and the characterizer contributes to BTR of the diamond pyramid probe.</p></div>","PeriodicalId":87330,"journal":{"name":"Nanotechnology and Precision Engineering","volume":"1 2","pages":"Pages 150-155"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.13494/j.npe.20170010","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44184493","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}