2019 20th International Conference on Electronic Packaging Technology(ICEPT)最新文献_第3页

Study on AlN micromachined ultrasonic transducer array with beamforming 基于波束成形的AlN微机械超声换能器阵列研究

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245155

Dan Gong, Yihsiang Chiu, Shengli Ma, Yufeng Jin, Hongbing Li

引用次数: 0

Effect of pressure during graphitization on mechanical properties of graphene films 石墨化过程中压力对石墨烯薄膜力学性能的影响

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245174

Maomao Zhang, Shujin Chen, Xiaoxin Zhang, Nan Wang, Xiuzhen Lu, Ziwei Jiang, Qianlong Wang, Xiaohua Liu, Johan Liu, L. Ye

引用次数: 1

Heat Dissipation Simulation of Double-sided Liquid-cooled IGBT Module Package 双面液冷IGBT模块封装散热仿真

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245119

Yuan Xu, J. Bao, R. Ning, L. Hou, Zhenhai Chen, Wenyi Xu, Bin Zhou

{"title":"Heat Dissipation Simulation of Double-sided Liquid-cooled IGBT Module Package","authors":"Yuan Xu, J. Bao, R. Ning, L. Hou, Zhenhai Chen, Wenyi Xu, Bin Zhou","doi":"10.1109/ICEPT47577.2019.245119","DOIUrl":"https://doi.org/10.1109/ICEPT47577.2019.245119","url":null,"abstract":"In order to alleviate the pressure of energy and environment on human life and social development, the development of electric vehicle industry is very rapid. Insulated Gate Bipolar Transistor ( IGBT ) module with superior performance has become the core component of electric vehicle converter. But limited heat dissipation space and complex packaging structure will cause excessive local temperature of the IGBT chip, and then the chip damaged. Therefore, the packaging structure of IGBT module for efficient heat dissipation is the key to ensure the safe and reliable operation of converters and even electric vehicles. Based on the double-sided forced liquid-cooled packaging structure of high-power IGBT module, a three-dimensional coupled model of heat conduction and coolant flow was established in this paper. Pressure distribution of cooling medium and temperature distribution of chips and the radiator at different inlet flow rates are calculated. The maximum temperature of chip surface and pressure difference between inlet and outlet under different inlet flow rates are analyzed. The results show that when the inlet flow rate is relatively small, the larger the inlet flow rate, the better the heat dissipation effect, but the greater the flow resistance; when the inlet flow rate reaches a certain value, the increase of flow rate can only greatly increase the flow resistance, but the heat dissipation is not obviously improved; the heat dissipation effect of liquid cooled radiator is non-uniform, the chip temperature near the inlet is lower, and the chip temperature near the outlet is higher. Finally, in order to alleviate the local high temperature of the chip near the outlet, graphene-based films (GBFs) were applied to the chips surface near the outlet in this model. The simulation results show that the maximum temperature of the outlet chip decreases to a certain extent with the same fluidity.","PeriodicalId":6676,"journal":{"name":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","volume":"29 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89738473","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Research on Synchronization Control Algorithm of Gantry-Type Motion Platform Based on IC Package 基于IC封装的龙门式运动平台同步控制算法研究

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245781

Yunbo He, Zhanchao Li, Jian Gao, C. Cui

{"title":"Research on Synchronization Control Algorithm of Gantry-Type Motion Platform Based on IC Package","authors":"Yunbo He, Zhanchao Li, Jian Gao, C. Cui","doi":"10.1109/ICEPT47577.2019.245781","DOIUrl":"https://doi.org/10.1109/ICEPT47577.2019.245781","url":null,"abstract":"As global semiconductor gradually develop into the post-Moore era, the status of microelectronic packaging technology in the IC industry is becoming increasingly prominent, and the requirements for high precision and high speed of microelectronic packaging equipment are also increasing. The gantry type motion platform is widely used in chip packaging. However, due to the mechanical coupling of the beam between the two linear motors of the gantry type motion platform, the system positioning accuracy and synchronization performance are seriously affected. In this paper, a self-made gantry motion platform is taken as the research object, and a cross-coupling synchronization algorithm based on fuzzy feedforward controller is proposed to realize the synchronous control of the system, including a fuzzy feedforward controller and a compensation controller based on cross-coupling principle. The cross-coupling controller takes the speed difference of two linear motors as the input signals, which compensates to the speed loop after being adjusted by the PI controller. The simulation results show that the crosscoupling synchronization algorithm based on fuzzy feedforward control can ensure the positioning accuracy, the response speed is faster, the anti-interference ability is stronger, and the synchronous follow performance is good, which basically meets the high-speed and high-precision requirements of the microelectronic packaging industry.","PeriodicalId":6676,"journal":{"name":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","volume":"3 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90282637","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

1/f Noise Characterization for Wavelength-tunable Semiconductor Lasers 波长可调谐半导体激光器的1/f噪声特性

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245759

Yuchen Chen, Yuze Wu, Da Chen, Yonglin Yu

引用次数: 0

A stretchable and transparent triboelectric nanogenerator based on prestretching PDMS with silver nanowires as electrode 以银纳米线为电极，基于预拉伸PDMS的可拉伸透明摩擦纳米发电机

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245301

Xuecheng Yu, Leicong Zhang, Xianwen Liang, Pengli Zhu, R. Sun, C. Wong

引用次数: 1

High Conductivity and Stability of Welded Silver Nanowires Transparent Films Encapsulated by a Graphene Layer 石墨烯层封装银纳米线透明薄膜的高导电性和稳定性

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245764

Yiru Li, Wenhao Shu, Huaying Hu, Jianhua Zhang, Lianqiao Yang

引用次数: 0

Influence of Packaging Forms and Interconnection Structures on Thermal Fatigue Reliability of Large-Scale Packaging 封装形式和互连结构对大型封装热疲劳可靠性的影响

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245350

Rourou Jia, Bin Zhou, Si Chen, Tong An, F. Qin

{"title":"Influence of Packaging Forms and Interconnection Structures on Thermal Fatigue Reliability of Large-Scale Packaging","authors":"Rourou Jia, Bin Zhou, Si Chen, Tong An, F. Qin","doi":"10.1109/ICEPT47577.2019.245350","DOIUrl":"https://doi.org/10.1109/ICEPT47577.2019.245350","url":null,"abstract":"At present, with the development of the electronic packaging industry, the size of the packaging is getting larger and larger, and the density of the interconnection is getting higher and higher, which brings great challenges to the reliability of the packaged device. Both the packaging forms and the interconnection structures have a great influence on the reliability of the electronic packaging. Column grid array and ball grid array are the two most widely used forms of array interconnects, and the ceramic packaging and plastic packaging are the most widely used forms of packaging. Therefore, in view of different packaging forms and different interconnection structures, three different devices, namely, CCGA (Ceramic Column Grid Array), CBGA (Ceramic Ball Grid Array) and PBGA (Ceramic Ball Grid Array), are used for temperature cycling. Through comparative analysis, the effects of packaging forms and interconnection structures on the reliability of large-scale packaging in low-temperature thermal fatigue environment were studied, and life prediction was carried out. According to the analysis, under the same temperature cycling condition, the form of plastic packaging is better than that of ceramic packaging, and the thermal fatigue resistance of the solder column interconnection structure is stronger than that of the solder ball interconnection structure.","PeriodicalId":6676,"journal":{"name":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","volume":"75 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74648282","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Effect of loading rate on the shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads 加载速率对耦合机电载荷下微尺度BGA结构Cu/ Sn-3.0Ag-0.5Cu /Cu接头剪切性能及断裂行为的影响

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245285

W. Le, Tao Sun, Jie-Ying Zhou, Min-bo Zhou, Xin-Ping Zhang

引用次数: 1

Laser-assisted Glass Frit Bonding Combined With Blue Light-shielding 激光辅助玻璃熔块结合蓝光屏蔽

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245232

Yanan Yang, Yi Li, Jun Yang, Luqiao Yin, Longlong Chen, Jianhua Zhang

{"title":"Laser-assisted Glass Frit Bonding Combined With Blue Light-shielding","authors":"Yanan Yang, Yi Li, Jun Yang, Luqiao Yin, Longlong Chen, Jianhua Zhang","doi":"10.1109/ICEPT47577.2019.245232","DOIUrl":"https://doi.org/10.1109/ICEPT47577.2019.245232","url":null,"abstract":"Laser-assisted glass frit bonding as a noncontact thermal bonding method has been widely applied in the organic light-emitting diodes (OLEDs) encapsulation field. However, blue light emitting from the OLEDs devices could cause many hazards. Therefore, it is of significance to develop a high reliable packaging technology with blue light-shielding performance for OLEDs. In this work, a BiVO4 thin film capable of shielding blue radiation applied in glass frit laser encapsulation were developed. BiVO4 thin films were deposited on glass by chemical solution deposition process. The effect of annealing temperature ranging from 573 to 873K on blue light-blocking performance has been investigated. The optimized BiVO4 films exhibited the best blue light-shielding capability and could block 50.32 % short wavelength blue light (400 - 450 nm), while maintaining greater than 87 % average transmittance in the wavelength range of 500 - 800 nm. Finally, the laser-assisted glass frit bonding device combined with optimized BiVO4 blue light-shielding film has been fabricated. Therefore, transparent BiVO4 film with high blue light-shielding efficiency are desirable for practical encapsulation applications.","PeriodicalId":6676,"journal":{"name":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","volume":"26 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72650757","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0