Influence of Packaging Forms and Interconnection Structures on Thermal Fatigue Reliability of Large-Scale Packaging

Abstract

At present, with the development of the electronic packaging industry, the size of the packaging is getting larger and larger, and the density of the interconnection is getting higher and higher, which brings great challenges to the reliability of the packaged device. Both the packaging forms and the interconnection structures have a great influence on the reliability of the electronic packaging. Column grid array and ball grid array are the two most widely used forms of array interconnects, and the ceramic packaging and plastic packaging are the most widely used forms of packaging. Therefore, in view of different packaging forms and different interconnection structures, three different devices, namely, CCGA (Ceramic Column Grid Array), CBGA (Ceramic Ball Grid Array) and PBGA (Ceramic Ball Grid Array), are used for temperature cycling. Through comparative analysis, the effects of packaging forms and interconnection structures on the reliability of large-scale packaging in low-temperature thermal fatigue environment were studied, and life prediction was carried out. According to the analysis, under the same temperature cycling condition, the form of plastic packaging is better than that of ceramic packaging, and the thermal fatigue resistance of the solder column interconnection structure is stronger than that of the solder ball interconnection structure.