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2016 IEEE International Solid-State Circuits Conference (ISSCC)最新文献

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Session 3 overview: Digital processors 第三部分概述:数字处理器
2016 IEEE International Solid-State Circuits Conference (ISSCC) Pub Date : 2017-02-01 DOI: 10.1109/ISSCC.2017.7870254
Thomas Burd, James Myers, Byeong-Gyu Nam
{"title":"Session 3 overview: Digital processors","authors":"Thomas Burd, James Myers, Byeong-Gyu Nam","doi":"10.1109/ISSCC.2017.7870254","DOIUrl":"https://doi.org/10.1109/ISSCC.2017.7870254","url":null,"abstract":"Digital processors continue to diversify in scope, utilizing a variety of process technologies, application-specific architectures, power management techniques, and heterogeneous processors integrated on a single die. The first two papers cover next-generation high-performance POWER and x86 CPUs, followed by ISSCC's first high-density FPGA. Next comes the first highly integrated power-optimized mobile SOC in 10nm, an automotive microcontroller and a MIMO baseband chip. The final paper is a vision processor for autonomous drones.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"277 1","pages":"48-49"},"PeriodicalIF":0.0,"publicationDate":"2017-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77844827","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 10 overview: DC-DC converters 第10部分概述:DC-DC转换器
2016 IEEE International Solid-State Circuits Conference (ISSCC) Pub Date : 2017-02-01 DOI: 10.1109/ISSCC.2017.7870318
Hoi Lee, Gerard Villar Pique, A. Thomsen
{"title":"Session 10 overview: DC-DC converters","authors":"Hoi Lee, Gerard Villar Pique, A. Thomsen","doi":"10.1109/ISSCC.2017.7870318","DOIUrl":"https://doi.org/10.1109/ISSCC.2017.7870318","url":null,"abstract":"The session on DC-DC converters is about improvements of power density, power efficiency and power dissipation in switched-capacitor, hybrid, and inductor-based DC-DC converters. The first paper addresses the power efficiency and power-density tradeoff of switched-capacitor power conversion. The next four papers present innovative ideas in inductor- and capacitor-assisted hybrid DC-DC converters. This is followed by two high-frequency inductor-based DC-DC converters. Finally, the last paper focuses on sub-nW DC-DC converter design.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"22 1","pages":"176-177"},"PeriodicalIF":0.0,"publicationDate":"2017-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72828198","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 27 overview: Biomedical circuits 第27部分概述:生物医学电路
2016 IEEE International Solid-State Circuits Conference (ISSCC) Pub Date : 2017-02-01 DOI: 10.1109/ISSCC.2017.7870453
G. Cauwenberghs, M. Pertijs, M. Ikeda
{"title":"Session 27 overview: Biomedical circuits","authors":"G. Cauwenberghs, M. Pertijs, M. Ikeda","doi":"10.1109/ISSCC.2017.7870453","DOIUrl":"https://doi.org/10.1109/ISSCC.2017.7870453","url":null,"abstract":"Advances in biomedical circuits and systems are essential technology drivers in addressing critical societal needs to increase the effectiveness and reduce the cost of healthcare. This session highlights the latest circuit innovations that contribute to advances in medical devices, sensing and imaging. For implantable and unobtrusive devices, ultrasonic power delivery and telemetry, and improved neural sensing and stimulation are addressed. Advanced medical sensing increasingly combines multiple modalities in a single device, several examples of which are also featured in this session. Finally, circuit innovations enabling improved ultrasonic and magnetic resonance imaging and optical spectroscopy are presented.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"340 1","pages":"446-447"},"PeriodicalIF":0.0,"publicationDate":"2017-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74096217","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 17 overview: TX and RX building blocks 第17节概述:TX和RX构建模块
2016 IEEE International Solid-State Circuits Conference (ISSCC) Pub Date : 2017-02-01 DOI: 10.1109/ISSCC.2017.7870375
B. Ginsburg, P. Heydari, P. Wambacq
{"title":"Session 17 overview: TX and RX building blocks","authors":"B. Ginsburg, P. Heydari, P. Wambacq","doi":"10.1109/ISSCC.2017.7870375","DOIUrl":"https://doi.org/10.1109/ISSCC.2017.7870375","url":null,"abstract":"RF transceivers enable everything from the plethora of connectivity on mobile devices to emerging applications in fixed point-to-point links, imaging, and sensing. Advances across all aspects of signal generation, modulation, power amplification, and radiation are required to reduce power dissipation while increasing performance. The papers in this session highlight several advances in the state of the art in RF, mm-wave, and THz domains. Antenna interface improvements include a circulator for TX/RX isolation, a digitally assisted CMOS front-end module, a polar PA with intrinsic nonlinearity compensation, electrical-balance-duplexer impedance detection, and radiator-embedded power combining. Wideband systems for spectroscopy achieve a wide bandwidth for integrated spectroscopy and parallel multi-tone generation. A 310-to-370GHz array embeds beam steering with independent frequency tuning. High data-rate communication is demonstrated with a 5m 130GHz 12.5Gb/s link and a 105Gb/s 300GHz transmitter.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"8 1","pages":"290-291"},"PeriodicalIF":0.0,"publicationDate":"2017-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89543278","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Foreword: Intelligent Chips for a Smart World 前言:智能芯片，智能世界
2016 IEEE International Solid-State Circuits Conference (ISSCC) Pub Date : 2017-02-01 DOI: 10.1109/ISSCC.2017.7870238
B. Murmann
{"title":"Foreword: Intelligent Chips for a Smart World","authors":"B. Murmann","doi":"10.1109/ISSCC.2017.7870238","DOIUrl":"https://doi.org/10.1109/ISSCC.2017.7870238","url":null,"abstract":"Welcome to the 64th International Solid-State Circuits Conference! The Conference continues its tradition of showcasing the most advanced and innovative work from industry and academe around the world, in integrated circuits and systems. The geographical distribution of the accepted technical papers reflects the truly international character of the Conference: 48% of the accepted papers are from North America, 33% are from the Far East, and 19% are from Europe. Of these papers, 63% are from academe, 34% are from industry, and 3% are from research institutions/labs. For the first time this year, the ISSCC paper selection followed a double-blind review process with anonymized manuscripts, which has emerged as the best-known practice within the broader technical community.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"27 1","pages":"5"},"PeriodicalIF":0.0,"publicationDate":"2017-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87905022","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 11 overview: Nonvolatile memory solutions 第11部分概述:非易失性存储器解决方案
2016 IEEE International Solid-State Circuits Conference (ISSCC) Pub Date : 2017-02-01 DOI: 10.1109/ISSCC.2017.7870327
T. Kono, Ki-Tae Park, Leland Chang
{"title":"Session 11 overview: Nonvolatile memory solutions","authors":"T. Kono, Ki-Tae Park, Leland Chang","doi":"10.1109/ISSCC.2017.7870327","DOIUrl":"https://doi.org/10.1109/ISSCC.2017.7870327","url":null,"abstract":"Continued proliferation of semiconductors drives the evolution of nonvolatile memory technologies towards higher density, lower power consumption, and lower cost. This year, NAND Flash memories are demonstrated in 3D technologies with up to 64 stacked word-line layers. An embedded split-gate NOR Flash is also shown to dramatically reduce power consumption and meet the requirements of high-temperature sensing applications. Finally, logic anti-fuse one-time-programmable (OTP) memory is scaled down to the 10nm technology node.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"20 1","pages":"194-195"},"PeriodicalIF":0.0,"publicationDate":"2017-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86793996","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Session 21 overview: Smart SoCs for innovative applications 第21场概述:创新应用的智能soc
2016 IEEE International Solid-State Circuits Conference (ISSCC) Pub Date : 2017-02-01 DOI: 10.1109/ISSCC.2017.7870405
A. Dupret, Pui-in Mak, E. Cantatore
{"title":"Session 21 overview: Smart SoCs for innovative applications","authors":"A. Dupret, Pui-in Mak, E. Cantatore","doi":"10.1109/ISSCC.2017.7870405","DOIUrl":"https://doi.org/10.1109/ISSCC.2017.7870405","url":null,"abstract":"While System on Chips (SoC) are common in the consumer electronics market, smart SoCs now emerge to enable more demanding applications, from biomedical sensors to security. In this Technology Directions session we showcase the high sensitivity, large dynamic range, energy efficiency and security issues that must be addressed to make possible the widespread uptake of these technologies. The session consists of 8 papers, including the demonstration of SoCs for bacterial sensing, 3D lung ventilation or intra-ocular pressure monitoring, piezoelectric drivers for diverse applications, mixed signal processing for acoustic sensing, and a secure actively detuned wireless power receiver.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"106 1","pages":"350-351"},"PeriodicalIF":0.0,"publicationDate":"2017-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80064945","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 23 overview: DRAM, MRAM & DRAM interfaces 第23部分概述:DRAM, MRAM和DRAM接口
2016 IEEE International Solid-State Circuits Conference (ISSCC) Pub Date : 2017-02-01 DOI: 10.1109/ISSCC.2017.7870423
T. Yoshikawa, Seung-Jun Bae, Leland Chang
{"title":"Session 23 overview: DRAM, MRAM & DRAM interfaces","authors":"T. Yoshikawa, Seung-Jun Bae, Leland Chang","doi":"10.1109/ISSCC.2017.7870423","DOIUrl":"https://doi.org/10.1109/ISSCC.2017.7870423","url":null,"abstract":"Dynamic memories are at the heart of every computing system. Improvements in the memory sub-system are therefore directly impacting user experience - battery-powered systems operate longer, graphics are crisper and our phones will simply react more smoothly.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"18 1","pages":"386-387"},"PeriodicalIF":0.0,"publicationDate":"2017-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85895957","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 2 overview: Power amplifiers 第二部分概述:功率放大器
2016 IEEE International Solid-State Circuits Conference (ISSCC) Pub Date : 2017-02-01 DOI: 10.1109/ISSCC.2017.7870245
Kohei Onizuka, A. Komijani, P. Wambacq
{"title":"Session 2 overview: Power amplifiers","authors":"Kohei Onizuka, A. Komijani, P. Wambacq","doi":"10.1109/ISSCC.2017.7870245","DOIUrl":"https://doi.org/10.1109/ISSCC.2017.7870245","url":null,"abstract":"Improving efficiency at back-off power levels has become an active area of research to support spectrally efficient modulation schemes with high peak-to-average power ratios. Doherty power-amplifier topology and envelope-tracking supply modulation are key enablers to improve the back-off efficiency of transmitters. Increasing signal bandwidths for applications such as carrier-aggregation LTE and WiFi 802.11ac poses challenges for supply modulation. Implementing the Doherty topology for 5G applications operating at mm-wave frequencies is an active area of research.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"5 1","pages":"30-31"},"PeriodicalIF":0.0,"publicationDate":"2017-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80386949","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 19 overview: Frequency generation 第19部分概述:频率生成
2016 IEEE International Solid-State Circuits Conference (ISSCC) Pub Date : 2017-02-01 DOI: 10.1109/ISSCC.2017.7870390
A. Mazzanti, Xiang Gao, P. Wambacq
{"title":"Session 19 overview: Frequency generation","authors":"A. Mazzanti, Xiang Gao, P. Wambacq","doi":"10.1109/ISSCC.2017.7870390","DOIUrl":"https://doi.org/10.1109/ISSCC.2017.7870390","url":null,"abstract":"This session covers the latest advancements in frequency sources and synthesis, fundamental blocks for communication, sensing and imaging systems. The first presentation in the session demonstrates a high-efficiency, high-power multiport radiating element at 114GHz in a SiGe BiCMOS technology. The second paper proposes an efficient calibration technique applied to a 27-to-31GHz injection-locking frequency multiplier with quadrature outputs. The next three presentations discuss frequency synthesizers. The first is a digital 50-to-66GHz PLL featuring low noise and low spur levels by leveraging a high-speed TDC and intensive calibrations. The second and third PLLs are based on ring-oscillators and leverage subsampling phase detection and FIR filtering, respectively, to achieve simultaneously low noise and compact area. The session is concluded with an ultra-low-voltage DCO in a 16nm FinFET technology.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"36 1","pages":"320-321"},"PeriodicalIF":0.0,"publicationDate":"2017-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78301452","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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