{"title":"前言:智能芯片，智能世界","authors":"B. Murmann","doi":"10.1109/ISSCC.2017.7870238","DOIUrl":null,"url":null,"abstract":"Welcome to the 64th International Solid-State Circuits Conference! The Conference continues its tradition of showcasing the most advanced and innovative work from industry and academe around the world, in integrated circuits and systems. The geographical distribution of the accepted technical papers reflects the truly international character of the Conference: 48% of the accepted papers are from North America, 33% are from the Far East, and 19% are from Europe. Of these papers, 63% are from academe, 34% are from industry, and 3% are from research institutions/labs. For the first time this year, the ISSCC paper selection followed a double-blind review process with anonymized manuscripts, which has emerged as the best-known practice within the broader technical community.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"27 1","pages":"5"},"PeriodicalIF":0.0000,"publicationDate":"2017-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Foreword: Intelligent Chips for a Smart World\",\"authors\":\"B. Murmann\",\"doi\":\"10.1109/ISSCC.2017.7870238\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Welcome to the 64th International Solid-State Circuits Conference! The Conference continues its tradition of showcasing the most advanced and innovative work from industry and academe around the world, in integrated circuits and systems. The geographical distribution of the accepted technical papers reflects the truly international character of the Conference: 48% of the accepted papers are from North America, 33% are from the Far East, and 19% are from Europe. Of these papers, 63% are from academe, 34% are from industry, and 3% are from research institutions/labs. For the first time this year, the ISSCC paper selection followed a double-blind review process with anonymized manuscripts, which has emerged as the best-known practice within the broader technical community.\",\"PeriodicalId\":6511,\"journal\":{\"name\":\"2016 IEEE International Solid-State Circuits Conference (ISSCC)\",\"volume\":\"27 1\",\"pages\":\"5\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE International Solid-State Circuits Conference (ISSCC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.2017.7870238\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2017.7870238","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Welcome to the 64th International Solid-State Circuits Conference! The Conference continues its tradition of showcasing the most advanced and innovative work from industry and academe around the world, in integrated circuits and systems. The geographical distribution of the accepted technical papers reflects the truly international character of the Conference: 48% of the accepted papers are from North America, 33% are from the Far East, and 19% are from Europe. Of these papers, 63% are from academe, 34% are from industry, and 3% are from research institutions/labs. For the first time this year, the ISSCC paper selection followed a double-blind review process with anonymized manuscripts, which has emerged as the best-known practice within the broader technical community.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
