第三部分概述:数字处理器

Thomas Burd, James Myers, Byeong-Gyu Nam
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引用次数: 0

摘要

数字处理器的范围继续多样化,利用各种工艺技术、特定应用架构、电源管理技术和集成在单个芯片上的异构处理器。前两篇论文涵盖了下一代高性能POWER和x86 cpu,其次是ISSCC的第一个高密度FPGA。接下来是第一个高度集成的10nm功率优化移动SOC,一个汽车微控制器和一个MIMO基带芯片。最后一篇论文是自主无人机的视觉处理器。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Session 3 overview: Digital processors
Digital processors continue to diversify in scope, utilizing a variety of process technologies, application-specific architectures, power management techniques, and heterogeneous processors integrated on a single die. The first two papers cover next-generation high-performance POWER and x86 CPUs, followed by ISSCC's first high-density FPGA. Next comes the first highly integrated power-optimized mobile SOC in 10nm, an automotive microcontroller and a MIMO baseband chip. The final paper is a vision processor for autonomous drones.
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