2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1)最新文献_第8页

Linearizing the protein-carbon nanotube/graphene amperometric sensors using negative feedback 负反馈线性化蛋白质-碳纳米管/石墨烯安培传感器

2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1) Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260957

M. Sundaramurthy

引用次数: 0

Selective detection of NH3 by Ag6Mo10O33 thick film by AC impedance spectroscopy Ag6Mo10O33厚膜的交流阻抗光谱选择性检测NH3

2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1) Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260920

E. Prabhu, C. Mariappan, G. Hareesh, K. I. Gnanasekar, V. Jayaraman, T. Gnanasekaran

引用次数: 0

Solid state sensors for biomedical instruments 生物医学仪器用固态传感器

2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1) Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260959

R. A. Mishra, Narendra B. Raut

引用次数: 0

Magnetically controlled flexible valve for flow manipulation in polymer microfluidic devices 用于聚合物微流控装置中流量操纵的磁控柔性阀

2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1) Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260969

Madhushree Bute, A. Sheikh, V. Mathe, D. Bodas, R. N. Karekar, S. Gosavi

引用次数: 3

Characterization of PZT multi-layer actuator PZT多层致动器的特性研究

2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1) Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260881

S. Premkumar, S. Shinde, H. H. Kumar, D. K. Kharat

引用次数: 3

Microcantilever based biosensor with electrical read-out method 基于电读出方法的微悬臂生物传感器

2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1) Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260937

J. Kalambe, R. Patrikar

{"title":"Microcantilever based biosensor with electrical read-out method","authors":"J. Kalambe, R. Patrikar","doi":"10.1109/ISPTS.2012.6260937","DOIUrl":"https://doi.org/10.1109/ISPTS.2012.6260937","url":null,"abstract":"Recently, an all polymer system based biosensor with integrated optical read-out has been developed. Optical detection techniques are perhaps the most common due to their prevalent use in biology and life sciences. Fluorescence-based detection in Bio-MEMS has been applied to detection of cells within micro-chips, using antibody-based assays. Majority of the detection schemes in microarray and numerous lab-on-a-chip devices and applications utilize optical detection schemes. For size shrinkage, and to reduce the hardware we proposed the new read-out method which utilize the electrical detection method. The paper present design and analysis of microcantilever based biosensor based with electrical read-out method. This method is ideal for the manufacture of low cost disease diagnostic Kits. The sensor structure is designed and simulated using Coventorware software. The corresponding deflection with respect to voltage and stress is analyzed. To solve the fabrication process related issue of the sensor control circuit has been designed and tested using Spartan II-FPGA Kit & PCB. The reliability issues of the sensor are also studied.","PeriodicalId":6431,"journal":{"name":"2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1)","volume":"108 1","pages":"249-252"},"PeriodicalIF":0.0,"publicationDate":"2012-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75926468","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

A new transition metal oxide sensor material for thermistor applications: Manganese-vanadium-oxide 一种用于热敏电阻的新型过渡金属氧化物传感器材料:氧化锰钒

2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1) Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260898

Girish M. Gouda, C. L. Nagendra

引用次数: 4

New LTCC materials: From fundamental to applied research 新型LTCC材料:从基础到应用研究

2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1) Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260950

M. Valant

{"title":"New LTCC materials: From fundamental to applied research","authors":"M. Valant","doi":"10.1109/ISPTS.2012.6260950","DOIUrl":"https://doi.org/10.1109/ISPTS.2012.6260950","url":null,"abstract":"Over the last twenty years, low-temperature co-firing ceramic (LTCC) technology has advanced to such an extent that it now allows the integration of a variety of passive components within the LTCC module. However, to achieve better performance some of them are still mounted as discrete components on the top of the module. An example of this type of component is a capacitor. In principle, no technological or design obstacles exist that would prevent the integration of capacitors into the module. The only problem is a lack of suitable LTCC material that exhibits the proper dielectric characteristics and is compatible with current LTCC materials and technology. Because the NP0-type capacitors represent the largest group of capacitors used with LTCC modules for RF applications we started the development of an NP0-type ceramic layer suitable for direct implementation with existing LTCC production lines. In this talk an example of such development will be presented where the very fundamental research has successfully been upgraded with an applied research and the new functional LTCC layers have been developed. They are characterized by K80, temperature stability, low dielectric loss and cosinterability with commercial low K tapes and silver electrode. The review of all the material properties relevant for the existing LTCC technology shows the possibility of a direct integration of the developed NP0-capacitor layer into the current LTCC modules.","PeriodicalId":6431,"journal":{"name":"2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1)","volume":"43 1","pages":"1-1"},"PeriodicalIF":0.0,"publicationDate":"2012-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87565706","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Investigation of acoustic structure interaction for flawed structure 缺陷结构声结构相互作用研究

2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1) Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260877

P.S Soumya, K. Surabhi, V. Krishnappa, G. Miranda, N. D. Dushyantha

引用次数: 1

Development of vertically stacked packaging based miniaturized camera electronics for high resolution imaging payloads 用于高分辨率成像载荷的垂直堆叠封装小型化相机电子器件的开发

2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1) Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260951

Shweta Kirkire, Ashok Kumar, M. Karimi, Amarnath, Hanuman Prasad, Ashish Srivastava, Sanjeev Mehta, Sandip Paul, R. Parmar, D. Samudraiah

{"title":"Development of vertically stacked packaging based miniaturized camera electronics for high resolution imaging payloads","authors":"Shweta Kirkire, Ashok Kumar, M. Karimi, Amarnath, Hanuman Prasad, Ashish Srivastava, Sanjeev Mehta, Sandip Paul, R. Parmar, D. Samudraiah","doi":"10.1109/ISPTS.2012.6260951","DOIUrl":"https://doi.org/10.1109/ISPTS.2012.6260951","url":null,"abstract":"Future Remote Sensing Satellites with high resolution electro-optical payloads require multiple detectors to meet mission goals of multiple spectral bands and large swath. High speed detectors are available with limited pixels array length with multiple video ports. Large number of detectors at the focal plane calls for miniaturized camera electronics. Miniaturization requires usage of low power, low weight components and adaption of new packaging techniques like Multi chip module, System-in Package, Systems-on-chip and wafer level packaging etc. These technologies require multiple dice which are not readily available in required high quality levels. Hence, new packaging approach named as vertically stacked packaging (VSP) is developed in-house and demonstrated. This incorporates vertical stacking of PCBs, inter-board interfaces using copper leads, usage of flexi-rigid boards, single external interface connector and vertical passive component mounting. Here, using VSP technology, reduction is achieved in size by about 91% and weight by about 85% as compared to traditional packaging approaches. This paper mainly discusses the VSP development, optimization and integrated test results with 4K TDI detector.","PeriodicalId":6431,"journal":{"name":"2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1)","volume":"20 1","pages":"294-297"},"PeriodicalIF":0.0,"publicationDate":"2012-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85708434","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1