Gold Bulletin最新文献_第8页

Highlights from recent literature 近期文献亮点

IF 2.2 4区工程技术

Gold Bulletin Pub Date : 2014-08-12 DOI: 10.1007/s13404-014-0148-7

引用次数: 0

Gold nanoparticle synthesis using the thermophilic bacterium Thermus scotoductus SA-01 and the purification and characterization of its unusual gold reducing protein 利用嗜热细菌Thermus scotoductus SA-01合成金纳米颗粒及其不同寻常的金还原蛋白的纯化和表征

IF 2.2 4区工程技术

Gold Bulletin Pub Date : 2014-08-06 DOI: 10.1007/s13404-014-0147-8

Mariana Erasmus, Errol Duncan Cason, Jacqueline van Marwijk, Elsabé Botes, Mariekie Gericke, Esta van Heerden

{"title":"Gold nanoparticle synthesis using the thermophilic bacterium Thermus scotoductus SA-01 and the purification and characterization of its unusual gold reducing protein","authors":"Mariana Erasmus, Errol Duncan Cason, Jacqueline van Marwijk, Elsabé Botes, Mariekie Gericke, Esta van Heerden","doi":"10.1007/s13404-014-0147-8","DOIUrl":"https://doi.org/10.1007/s13404-014-0147-8","url":null,"abstract":"Nanoparticles are very important materials for implementing nanotechnology in diverse areas and are abundant in nature as living organisms operate at a nanoscale. As nanoparticles exhibit interesting size- and shape-dependent physical and chemical properties, the synthesis of uniform nanoparticles with controlled sizes and shapes is of great importance. Nanoparticles are the end products of a wide variety of physical, chemical and biological processes, some of which are novel and radically different and others of which are quite commonplace. The ability to produce nanoparticles with specific shapes and controlled sizes could result in interesting new applications that can potentially be utilized in areas such as optics, electronics and the biomedical field. In the present study, we have demonstrated the ability of the thermophilic bacterium Thermus scotoductus SA-01 to synthesize gold nanoparticles and determined the effect of the physico-chemical parameters on particle synthesis. Furthermore, a protein purified from this bacterium is shown to be capable of reducing HAuCl4 to form elemental nanoparticles in vitro. The protein was purified to homogeneity and identified through N-terminal sequencing as an ABC transporter, peptide-binding protein. It is speculated that this protein reduces Au(III) through an electron shuttle mechanism involving a cysteine disulphide bridge. Through manipulation of physico-chemical parameters, it was possible to vary nanoparticles in terms of number, shape and size. This is the first report of a transporter protein from a thermophile with the ability to produce nanoparticles in vitro thus expanding the limited knowledge around biological gold nanoparticle synthesis.","PeriodicalId":55086,"journal":{"name":"Gold Bulletin","volume":null,"pages":null},"PeriodicalIF":2.2,"publicationDate":"2014-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1007/s13404-014-0147-8","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"4239538","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 25

Phase diagram of Au–Al–Pd at 500 °C 500℃时Au-Al-Pd的相图

IF 2.2 4区工程技术

Gold Bulletin Pub Date : 2014-07-26 DOI: 10.1007/s13404-014-0146-9

Jyun Lin Li, Pei Jen Lo, Ming Chi Ho, Rick Yu, Ker-Chang Hsieh

引用次数: 1

Gold etching for microfabrication 微加工用金蚀刻

IF 2.2 4区工程技术

Gold Bulletin Pub Date : 2014-05-11 DOI: 10.1007/s13404-014-0143-z

T. A. Green

引用次数: 103

Room temperature evolution of gold nanodots deposited on silicon 硅上沉积金纳米点的室温演化

IF 2.2 4区工程技术

Gold Bulletin Pub Date : 2014-05-09 DOI: 10.1007/s13404-014-0142-0

C. Garozzo, A. Filetti, C. Bongiorno, A. La Magna, F. Simone, R. A. Puglisi

{"title":"Room temperature evolution of gold nanodots deposited on silicon","authors":"C. Garozzo, A. Filetti, C. Bongiorno, A. La Magna, F. Simone, R. A. Puglisi","doi":"10.1007/s13404-014-0142-0","DOIUrl":"https://doi.org/10.1007/s13404-014-0142-0","url":null,"abstract":"In this work, the morphological and structural evolution of gold nanodots deposited on Si substrates has been monitored for 2.4?×?103?h. Gold nanodots on Si are of great scientific interest because they can be used in numerous ways, for example as subwavelength antennas in plasmonics, as electrical contacts in nanometric devices, or as catalysts for the formation of quasi-1dimensional nanostructures. Their characteristics have been studied in a very large number of papers in literature, and among the several aspects, it is known that continuous Au films peculiarly interact with Si by interdiffusion even at room temperature. It would be expected that also small nanostructures could undergo to an interdiffusion and consequent modifications of their structure and shape after aging. Despite the cruciality of this topic, no literature papers have been found showing a detailed morphological and structural characterization of aged Au nanodots. Au nanoparticles have been deposited by sputtering on Si and stored in air at temperature between 20 and 23?°C and humidity of about 45?%, simulating the standard storage conditions of most of the fabrication labs. The morphological and structural characterizations have been performed by bright field transmission electron microscopy (TEM). A specific procedure has been used in order to avoid any modification of the material during the specimen preparation for the TEM analysis. A digital processing of the TEM images has allowed to get a large statistical analysis on the particles size distribution. Two different types of nanoparticles are found after the deposition: pure gold crystalline nanodots on the Si surface and gold amorphous nanoclusters interdiffused into the Si subsurface regions. While the nanodots preserve both morphology and structure all over the time, the amorphous agglomerates show an evolution during aging in morphology, structure, and chemical phase.","PeriodicalId":55086,"journal":{"name":"Gold Bulletin","volume":null,"pages":null},"PeriodicalIF":2.2,"publicationDate":"2014-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1007/s13404-014-0142-0","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"4394859","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Probing the surface oxidation of chemically synthesised gold nanospheres and nanorods 探测化学合成金纳米球和纳米棒的表面氧化

IF 2.2 4区工程技术

Gold Bulletin Pub Date : 2014-05-03 DOI: 10.1007/s13404-014-0141-1

Blake J. Plowman, Nathan Thompson, Anthony P. O’Mullane

引用次数: 7

Effect of gold addition on the microstructure, mechanical properties and corrosion behavior of Ti alloys 添加金对钛合金组织、力学性能和腐蚀行为的影响

IF 2.2 4区工程技术

Gold Bulletin Pub Date : 2014-04-16 DOI: 10.1007/s13404-014-0138-9

Yong-Ryeol Lee, Mi-Kyung Han, Min-Kang Kim, Won-Jin Moon, Ho-Jun Song, Yeong-Joon Park

{"title":"Effect of gold addition on the microstructure, mechanical properties and corrosion behavior of Ti alloys","authors":"Yong-Ryeol Lee, Mi-Kyung Han, Min-Kang Kim, Won-Jin Moon, Ho-Jun Song, Yeong-Joon Park","doi":"10.1007/s13404-014-0138-9","DOIUrl":"https://doi.org/10.1007/s13404-014-0138-9","url":null,"abstract":"We performed a systematic investigation of the Ti–xAu (x?=?5, 10, 15, 20, and 40?wt%) alloys to assess the effect of addition of element Au on the microstructure, mechanical properties, and corrosion behavior of commercially pure titanium (cp-Ti). The phase and microstructure were characterized using X-ray diffraction (XRD), optical microscopy, scanning electron microscopy (SEM), and transmission electron microscopy (TEM). The results indicated that the Ti–xAu alloys containing up to 15?wt% Au showed a hexagonal close-packed α-Ti structure, whereas the Ti–xAu alloys containing more than 20?wt% Au were mainly composed of the α-Ti phase and Ti3Au intermetallic phase. We also investigated the effect of alloying element Au on the mechanical properties (including Vickers hardness and modulus) and corrosion behavior of Ti–xAu binary alloys. The addition of gold to Ti improved its hardness. Electrochemical results showed that the Ti–xAu alloys exhibited improved corrosion resistance than cp-Ti.","PeriodicalId":55086,"journal":{"name":"Gold Bulletin","volume":null,"pages":null},"PeriodicalIF":2.2,"publicationDate":"2014-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1007/s13404-014-0138-9","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"4635575","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 20

Evolution and investigation of copper and gold ball bonds in extended reliability stressing 扩展可靠性应力下铜和金球键的演化与研究

IF 2.2 4区工程技术

Gold Bulletin Pub Date : 2014-03-29 DOI: 10.1007/s13404-014-0135-z

C. L. Gan, F. C. Classe, B. L. Chan, U. Hashim

{"title":"Evolution and investigation of copper and gold ball bonds in extended reliability stressing","authors":"C. L. Gan, F. C. Classe, B. L. Chan, U. Hashim","doi":"10.1007/s13404-014-0135-z","DOIUrl":"https://doi.org/10.1007/s13404-014-0135-z","url":null,"abstract":"This paper discusses the microstructure evolution of copper (Cu) and gold (Au) ball bonds after various extended reliability stresses such as biased highly accelerated temperature and humidity test (HAST), unbiased highly accelerated temperature and humidity test (UHAST), temperature cycling (TC), and high temperature storage life (HTSL) in BGA package. Objective of this study is to study the microstructure evolution and changes after long hours and long cycles of component reliability stressing and its predicted failure mechanisms and to determine the long-term reliability comparison with combination of bonding wires in HAST, UHAST, and TC. Secondary electron microscopy (SEM) and energy dispersive X-ray (EDX) have been carried out to understand the respective microstructure of failed samples in HAST, UHAST, TC, and HTSL long-term reliability failures. Respective failure mechanisms of copper and gold ball bonds carrion under HAST and UHAST, ball bond lifting in TC and HTSL have been analyzed and proposed. The evolution of surface morphology, including copper and gold ball bond micro cracking, gold ball bond Kirkendall microvoiding and intermetallic compound (IMC) formation, was studied in FBGA package with copper and gold ball bonds during various reliability stresses. Biased HAST, UHAST, TC, and HTSL mechanisms were proposed to explain the observed morphological changes and the resulting ball bond wear out modes after extended reliability stresses. Weibull reliability analyses have been established to compare the performance of copper and gold ball bonds under humid and dry environmental tests.","PeriodicalId":55086,"journal":{"name":"Gold Bulletin","volume":null,"pages":null},"PeriodicalIF":2.2,"publicationDate":"2014-03-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1007/s13404-014-0135-z","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"5122968","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 21

Highlights from recent literature 近期文献亮点

IF 2.2 4区工程技术

Gold Bulletin Pub Date : 2013-12-14 DOI: 10.1007/s13404-013-0132-7

引用次数: 0

Soldering of non-wettable Al electrode using Au-based solder 用金基焊料焊接不湿性铝电极

IF 2.2 4区工程技术

Gold Bulletin Pub Date : 2013-12-12 DOI: 10.1007/s13404-013-0130-9

Fengqun Lang, Hiroshi Nakagawa, Hiroshi Yamaguchi

{"title":"Soldering of non-wettable Al electrode using Au-based solder","authors":"Fengqun Lang, Hiroshi Nakagawa, Hiroshi Yamaguchi","doi":"10.1007/s13404-013-0130-9","DOIUrl":"https://doi.org/10.1007/s13404-013-0130-9","url":null,"abstract":"In manufacturing three-dimensional SiC power modules, the Al electrode of SiC power devices should be soldered to the substrate. However, the Al electrode is difficult to be bonded by a solder due to the naturally formed aluminum oxide on it. In this paper, we describe an effective approach for soldering the non-wettable Al electrode by fabricating a Au-stud bump in the Al electrode together with a Au-20?wt% Sn or Au-12?wt% Ge solder. The soldering initiated at the Au bump and spreaded on the Al electrode. The soldering featured as reactive wetting, realized by the reaction of liquid Au in the Au-base solder and the Al electrode. The activation energy of the Au-20?wt% Sn soldering the Al electrode was Q?=?159?kJ/mol. A continuous Au4Al layer formed at the Au-20?wt% Sn bond interface. The shear strength exceeded 60?MPa, ～1 order magnitude higher than the required shear strength. For the bond with Au-12?wt% Ge solder on the Al electrode with a Au bump, the liquid Au-12?wt% Ge solder reacted with the solid Al electrode and formed a Au-Ge-Al solid solution after solidification. The shear strength of the Au-12?wt% Ge solder on the Al electrode with a Au bump was beyond 50?MPa. Little electrical characteristics of the SiC-SBD changed after the Al electrode was bonded to a circuit substrate using this technology.","PeriodicalId":55086,"journal":{"name":"Gold Bulletin","volume":null,"pages":null},"PeriodicalIF":2.2,"publicationDate":"2013-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1007/s13404-013-0130-9","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"4483775","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4