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The July 2024 Issue at a Glance [From the Editor’s Desk] 2024 年 7 月刊概览 [来自编辑的消息］
IF 3.6 3区 计算机科学
IEEE Microwave Magazine Pub Date : 2024-06-05 DOI: 10.1109/mmm.2024.3395828
Robert H. Caverly
{"title":"The July 2024 Issue at a Glance [From the Editor’s Desk]","authors":"Robert H. Caverly","doi":"10.1109/mmm.2024.3395828","DOIUrl":"https://doi.org/10.1109/mmm.2024.3395828","url":null,"abstract":"ChatGBT. Copilot. Gemini. These and other artificial intelligence (AI) tools are in the news and help us complete tasks faster than ever. The press coverage on the future of AI technologies is ample and both positive and negative; however presented, though, these technologies are here to stay. These AI tools are a paradigm shift in the way we perform our day-to-day activities, and this includes their place in the publication space. I have had many conversations with colleagues over the last year where concern has been expressed about the impact AI tools will have on publications’ integrity.","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":null,"pages":null},"PeriodicalIF":3.6,"publicationDate":"2024-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141548092","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Review of Electromagnetics-Based Microwave Circuit Design Optimization 基于电磁学的微波电路优化设计综述
IF 3.6 3区 计算机科学
IEEE Microwave Magazine Pub Date : 2024-06-05 DOI: 10.1109/mmm.2024.3387036
Chandan Roy, Ke Wu
{"title":"A Review of Electromagnetics-Based Microwave Circuit Design Optimization","authors":"Chandan Roy, Ke Wu","doi":"10.1109/mmm.2024.3387036","DOIUrl":"https://doi.org/10.1109/mmm.2024.3387036","url":null,"abstract":"Electromagnetics (EM)-based optimization techniques have always been a major interest in the microwave research community due to their vital role in the design and development of microwave circuits and systems. Achieving the desired specifications in terms of S-parameters over different frequency bands is one of the critical steps in the microwave circuit and system design and development process <xref ref-type=\"bibr\" r xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">[1]</xref>\u0000. An optimal design can be accomplished by using an optimization algorithm. Such an optimizer is set to iteratively find the optimized design with respect to predefined specifications starting from an initial design stage by invoking an EM simulator each time for evaluating the design evolution and optimization feasibility. This iterative approach takes an exceptionally long time, as many EM simulations are generally required for different sets of combinatory geometrical parameters during the optimization process <xref ref-type=\"bibr\" r xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">[2]</xref>\u0000.","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":null,"pages":null},"PeriodicalIF":3.6,"publicationDate":"2024-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141548095","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Education Committee News [Education News] 教育委员会新闻 [教育新闻］
IF 3.6 3区 计算机科学
IEEE Microwave Magazine Pub Date : 2024-06-05 DOI: 10.1109/mmm.2024.3387175
Xun Gong, Rashaunda Henderson
{"title":"Education Committee News [Education News]","authors":"Xun Gong, Rashaunda Henderson","doi":"10.1109/mmm.2024.3387175","DOIUrl":"https://doi.org/10.1109/mmm.2024.3387175","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":null,"pages":null},"PeriodicalIF":3.6,"publicationDate":"2024-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141523850","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Welcome to the 27th European Microwave Week in Paris, France [Around the Globe] 欢迎参加在法国巴黎举办的第 27 届欧洲微波周[全球各地］
IF 3.6 3区 计算机科学
IEEE Microwave Magazine Pub Date : 2024-06-05 DOI: 10.1109/mmm.2024.3387132
Guillaume Ducournau, Aurelian Crunteanu
{"title":"Welcome to the 27th European Microwave Week in Paris, France [Around the Globe]","authors":"Guillaume Ducournau, Aurelian Crunteanu","doi":"10.1109/mmm.2024.3387132","DOIUrl":"https://doi.org/10.1109/mmm.2024.3387132","url":null,"abstract":"On behalf of the Organizing Committee, it is our great pleasure to invite you to the 27th European Microwave Week (EuMW), which will take place between 22 and 27 September 2024 at Paris Expo Porte de Versailles in Paris, France.","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":null,"pages":null},"PeriodicalIF":3.6,"publicationDate":"2024-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141523851","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE App IEEE 应用程序
IF 3.6 3区 计算机科学
IEEE Microwave Magazine Pub Date : 2024-05-08 DOI: 10.1109/mmm.2024.3388630
{"title":"IEEE App","authors":"","doi":"10.1109/mmm.2024.3388630","DOIUrl":"https://doi.org/10.1109/mmm.2024.3388630","url":null,"abstract":"","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":null,"pages":null},"PeriodicalIF":3.6,"publicationDate":"2024-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140934311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Class-Φ2 Power Amplifier With Resonant Gate Driver: High-Efficiency Power Amplifier for 50 MHz 带谐振栅极驱动器的Φ2 类功率放大器：50 MHz 的高效功率放大器
IF 3.6 3区 计算机科学
IEEE Microwave Magazine Pub Date : 2024-05-08 DOI: 10.1109/mmm.2024.3379028
Zhechi Ye, Calvin H Lin, Juan Rivas-Davila
{"title":"Class-Φ2 Power Amplifier With Resonant Gate Driver: High-Efficiency Power Amplifier for 50 MHz","authors":"Zhechi Ye, Calvin H Lin, Juan Rivas-Davila","doi":"10.1109/mmm.2024.3379028","DOIUrl":"https://doi.org/10.1109/mmm.2024.3379028","url":null,"abstract":"RF power amplifiers (PAs) serve an important role for various applications, such as communication, induction heating, plasma generation, and wireless power transfer <xref ref-type=\"bibr\" r xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">[1]</xref>\u0000, <xref ref-type=\"bibr\" r xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">[2]</xref>\u0000, <xref ref-type=\"bibr\" r xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">[3]</xref>\u0000. With the current demands for energy conservation, the importance of high-efficiency PAs has been ever increasing. Efficient power delivery alleviates the burden of thermal management, improving the system stability and increasing the power density. In this article, we present our first-place design for the Student Design Competition “High-Efficiency Power Amplifier for 50 MHz” in the 2023 IEEE International Microwave Symposium (IMS) in San Diego, CA, USA.","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":null,"pages":null},"PeriodicalIF":3.6,"publicationDate":"2024-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140934172","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EPEPS 2024 Call for Papers EPEPS 2024 征稿启事
IF 3.6 3区 计算机科学
IEEE Microwave Magazine Pub Date : 2024-05-08 DOI: 10.1109/mmm.2024.3385195
{"title":"EPEPS 2024 Call for Papers","authors":"","doi":"10.1109/mmm.2024.3385195","DOIUrl":"https://doi.org/10.1109/mmm.2024.3385195","url":null,"abstract":"","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":null,"pages":null},"PeriodicalIF":3.6,"publicationDate":"2024-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140934194","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems Calls for Papers IEEE 射频系统中的硅单片集成电路专题会议征集论文
IF 3.6 3区 计算机科学
IEEE Microwave Magazine Pub Date : 2024-05-08 DOI: 10.1109/mmm.2024.3385192
{"title":"IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems Calls for Papers","authors":"","doi":"10.1109/mmm.2024.3385192","DOIUrl":"https://doi.org/10.1109/mmm.2024.3385192","url":null,"abstract":"","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":null,"pages":null},"PeriodicalIF":3.6,"publicationDate":"2024-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140934448","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Report on Chapter Activities During 2023 [Around the Globe] 2023 年分会活动报告 [全球各地］
IF 3.6 3区 计算机科学
IEEE Microwave Magazine Pub Date : 2024-05-08 DOI: 10.1109/mmm.2024.3379031
Somak Bhattacharyya
{"title":"Report on Chapter Activities During 2023 [Around the Globe]","authors":"Somak Bhattacharyya","doi":"10.1109/mmm.2024.3379031","DOIUrl":"https://doi.org/10.1109/mmm.2024.3379031","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":null,"pages":null},"PeriodicalIF":3.6,"publicationDate":"2024-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140934193","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Reflectionless High-Pass Filters for Load-Pull Setups: Reflectionless High-Pass Filters Improve Load Pull Measurement Stability 用于负载拉力设置的无反射高通滤波器：无反射高通滤波器提高负载拉力测量的稳定性
IF 3.6 3区 计算机科学
IEEE Microwave Magazine Pub Date : 2024-05-08 DOI: 10.1109/mmm.2024.3378614
Jongheun Lee, Osman Ceylan, Juseop Lee
{"title":"Reflectionless High-Pass Filters for Load-Pull Setups: Reflectionless High-Pass Filters Improve Load Pull Measurement Stability","authors":"Jongheun Lee, Osman Ceylan, Juseop Lee","doi":"10.1109/mmm.2024.3378614","DOIUrl":"https://doi.org/10.1109/mmm.2024.3378614","url":null,"abstract":"Characterization of devices operating under large signal conditions at nonlinear regions requires specific measurement setups since the output power value, operation efficiency, power gain, and linearity are functions of the source impedance, input signal level, biasing values, and load impedance. Hence, measuring a device’s parameters while varying the source or load impedance (called <italic xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">source-pull</i> and <italic xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">load-pull</i>\u0000, respectively) is essential to evaluate its nonlinear behaviors.","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":null,"pages":null},"PeriodicalIF":3.6,"publicationDate":"2024-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140934319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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