发布求助
文献互助 智能选刊 最新文献

Proceedings of the 2024 International Symposium on Physical Design最新文献

筛选
英文 中文
FuILT: Full Chip ILT System With Boundary Healing FuILT： 具有边界愈合功能的全芯片 ILT 系统
Proceedings of the 2024 International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3633315
Shuo Yin, Wenqian Zhao, Li Xie, Hong Chen, Yuzhe Ma, Tsung-Yi Ho, Bei Yu
{"title":"FuILT: Full Chip ILT System With Boundary Healing","authors":"Shuo Yin, Wenqian Zhao, Li Xie, Hong Chen, Yuzhe Ma, Tsung-Yi Ho, Bei Yu","doi":"10.1145/3626184.3633315","DOIUrl":"https://doi.org/10.1145/3626184.3633315","url":null,"abstract":"","PeriodicalId":517596,"journal":{"name":"Proceedings of the 2024 International Symposium on Physical Design","volume":"117 16","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140285094","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Unified 3D-IC Multi-Chiplet System Design Solution 统一 3D-IC 多芯片系统设计解决方案
Proceedings of the 2024 International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3635279
Wang-Tyng Lay
{"title":"Unified 3D-IC Multi-Chiplet System Design Solution","authors":"Wang-Tyng Lay","doi":"10.1145/3626184.3635279","DOIUrl":"https://doi.org/10.1145/3626184.3635279","url":null,"abstract":"","PeriodicalId":517596,"journal":{"name":"Proceedings of the 2024 International Symposium on Physical Design","volume":"95 6","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140285125","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
PANEL: EDA Challenges at Advanced Technology Nodes B 小组讨论：先进技术节点 B 的 EDA 挑战
Proceedings of the 2024 International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3639699
Guang-Wan Liao
{"title":"PANEL: EDA Challenges at Advanced Technology Nodes B","authors":"Guang-Wan Liao","doi":"10.1145/3626184.3639699","DOIUrl":"https://doi.org/10.1145/3626184.3639699","url":null,"abstract":"","PeriodicalId":517596,"journal":{"name":"Proceedings of the 2024 International Symposium on Physical Design","volume":"68 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140284766","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Satisfiability Modulo Theories-Based Qubit Mapping for Trapped-Ion Quantum Computing Systems 基于满意度模数理论的陷阱离子量子计算系统的质子映射
Proceedings of the 2024 International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3633329
Wei-Hsiang Tseng, Yao-Wen Chang, J. Jiang
{"title":"Satisfiability Modulo Theories-Based Qubit Mapping for Trapped-Ion Quantum Computing Systems","authors":"Wei-Hsiang Tseng, Yao-Wen Chang, J. Jiang","doi":"10.1145/3626184.3633329","DOIUrl":"https://doi.org/10.1145/3626184.3633329","url":null,"abstract":"","PeriodicalId":517596,"journal":{"name":"Proceedings of the 2024 International Symposium on Physical Design","volume":"223 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140284785","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Large Language Models for EDA: Future or Mirage? 用于 EDA 的大型语言模型：未来还是幻影？
Proceedings of the 2024 International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3639700
Zhuolun He, Bei Yu
{"title":"Large Language Models for EDA: Future or Mirage?","authors":"Zhuolun He, Bei Yu","doi":"10.1145/3626184.3639700","DOIUrl":"https://doi.org/10.1145/3626184.3639700","url":null,"abstract":"","PeriodicalId":517596,"journal":{"name":"Proceedings of the 2024 International Symposium on Physical Design","volume":"14 2","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140284949","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects 采用先进仿真方法评估芯片封装交互效应的翘曲研究
Proceedings of the 2024 International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3635284
J. Choy, Stéphane Moreau, Catherine Brunet-Manquat, V. Sukharev, A. Kteyan
{"title":"Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects","authors":"J. Choy, Stéphane Moreau, Catherine Brunet-Manquat, V. Sukharev, A. Kteyan","doi":"10.1145/3626184.3635284","DOIUrl":"https://doi.org/10.1145/3626184.3635284","url":null,"abstract":"","PeriodicalId":517596,"journal":{"name":"Proceedings of the 2024 International Symposium on Physical Design","volume":"11 2","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140284736","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
首页 上一页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信