采用先进仿真方法评估芯片封装交互效应的翘曲研究

{"title":"采用先进仿真方法评估芯片封装交互效应的翘曲研究","authors":"J. Choy, Stéphane Moreau, Catherine Brunet-Manquat, V. Sukharev, A. Kteyan","doi":"10.1145/3626184.3635284","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":517596,"journal":{"name":"Proceedings of the 2024 International Symposium on Physical Design","volume":"11 2","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects\",\"authors\":\"J. Choy, Stéphane Moreau, Catherine Brunet-Manquat, V. Sukharev, A. Kteyan\",\"doi\":\"10.1145/3626184.3635284\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":517596,\"journal\":{\"name\":\"Proceedings of the 2024 International Symposium on Physical Design\",\"volume\":\"11 2\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-03-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 2024 International Symposium on Physical Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/3626184.3635284\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2024 International Symposium on Physical Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/3626184.3635284","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}