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Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects

Proceedings of the 2024 International Symposium on Physical Design Pub Date : 2024-03-12 DOI:10.1145/3626184.3635284
J. Choy, Stéphane Moreau, Catherine Brunet-Manquat, V. Sukharev, A. Kteyan
{"title":"Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects","authors":"J. Choy, Stéphane Moreau, Catherine Brunet-Manquat, V. Sukharev, A. Kteyan","doi":"10.1145/3626184.3635284","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":517596,"journal":{"name":"Proceedings of the 2024 International Symposium on Physical Design","volume":"11 2","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2024 International Symposium on Physical Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/3626184.3635284","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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采用先进仿真方法评估芯片封装交互效应的翘曲研究
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Proceedings of the 2024 International Symposium on Physical Design
Proceedings of the 2024 International Symposium on Physical Design
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