International Journal of Extreme Manufacturing最新文献

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Advances and Challenges in Direct Additive Manufacturing of Dense Ceramic Oxides 直接添加制造致密氧化陶瓷的进展与挑战
International Journal of Extreme Manufacturing Pub Date : 2024-06-04 DOI: 10.1088/2631-7990/ad5424
Zhiqi Fan, Qiyang Tan, Chengwei Kang, Han Huang
{"title":"Advances and Challenges in Direct Additive Manufacturing of Dense Ceramic Oxides","authors":"Zhiqi Fan, Qiyang Tan, Chengwei Kang, Han Huang","doi":"10.1088/2631-7990/ad5424","DOIUrl":"https://doi.org/10.1088/2631-7990/ad5424","url":null,"abstract":"\u0000 Ceramic oxides, renowned for their exceptional combination of mechanical, thermal, and chemical properties, are indispensable in numerous crucial applications across diverse engineering fields. However, conventional manufacturing methods frequently grapple with limitations, such as challenges in shaping intricate geometries, extended processing durations, elevated porosity, and substantial shrinkage deformations. Direct additive manufacturing (dAM) technology stands out as a state-of-the-art solution for ceramic oxides production. It facilitates the one-step fabrication of high-performance, intricately designed components characterized by dense structures. Importantly, dAM eliminates the necessity for post-heat treatments, streamlining the manufacturing process and enhancing overall efficiency. This study undertakes a comprehensive review of recent developments in dAM for ceramic oxides, with a specific emphasis on the laser powder bed fusion and laser directed energy deposition techniques. A thorough investigation is conducted into the shaping quality, microstructure, and properties of diverse ceramic oxides produced through dAM. Critical examination is given to key aspects including feedstock preparation, laser–material coupling, formation and control of defects, in-situ monitoring and simulation. This paper concludes by outlining future trends and potential breakthrough directions, taking into account current gaps in this rapidly evolving field.","PeriodicalId":502508,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"1 11","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-06-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141266216","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Advancements in Transfer Printing Techniques for Flexible Electronics: Adjusting Interfaces and Promoting Versatility 用于柔性电子产品的转移印花技术的进步:调整接口和促进多功能性
International Journal of Extreme Manufacturing Pub Date : 2024-06-03 DOI: 10.1088/2631-7990/ad5391
Zijian Chen, Chi Zhang, Zijian Zheng
{"title":"Advancements in Transfer Printing Techniques for Flexible Electronics: Adjusting Interfaces and Promoting Versatility","authors":"Zijian Chen, Chi Zhang, Zijian Zheng","doi":"10.1088/2631-7990/ad5391","DOIUrl":"https://doi.org/10.1088/2631-7990/ad5391","url":null,"abstract":"\u0000 The burgeoning interest in flexible electronics necessitates the creation of patterning technology specifically tailored for flexible substrates and complex surface morphologies. Among a variety of patterning techniques, transfer printing emerges as one of the most efficient, cost-effective, and scalable methods. It boasts the ability for high-throughput fabrication of 0-3D micro- and nano-structures on flexible substrates, working in tandem with traditional lithography methods. This review highlights the critical issue of transfer printing: the flawless transfer of devices during the pick-up and printing process. We encapsulate recent advancements in numerous transfer printing techniques, with a particular emphasis on strategies to control adhesion forces at the substrate/device/stamp interfaces. These strategies are employed to meet the requirements of competing fractures for successful pick-up and print processes. The mechanism, advantages, disadvantages, and typical applications of each transfer printing technique will be thoroughly discussed. The conclusion section provides design guidelines and probes potential directions for future advancements.","PeriodicalId":502508,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"22 4","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141271705","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Damage evolution and removal behaviors of GaN crystals involved in double-grits grinding 参与双磨粒研磨的氮化镓晶体的损伤演变和去除行为
International Journal of Extreme Manufacturing Pub Date : 2024-01-19 DOI: 10.1088/2631-7990/ad207f
Chen Li, Yuxiu Hu, Zongze Wei, Chongjun Wu, Yunfeng Peng, Feihu Zhang, Yanquan Geng
{"title":"Damage evolution and removal behaviors of GaN crystals involved in double-grits grinding","authors":"Chen Li, Yuxiu Hu, Zongze Wei, Chongjun Wu, Yunfeng Peng, Feihu Zhang, Yanquan Geng","doi":"10.1088/2631-7990/ad207f","DOIUrl":"https://doi.org/10.1088/2631-7990/ad207f","url":null,"abstract":"\u0000 Understanding the complex interactions between the work material and abrasives is a difficult and hot topic during grinding of Gallium nitride (GaN) single crystals. In this work, molecular dynamics (MD) simulations of double-grits interacted grinding of GaN crystals were performed, and the grinding force, coefficient of friction, stress distribution, plastic damage behaviors, and abrasive damage were systematically investigated. The results demonstrated that interacted distance with both radial and transverse directions achieved better grinding quality than that with only one direction or single-grit grinding. The grinding force, grinding induced stress, subsurface damage depth, and abrasive wear increases as the transverse interacted distance increases. However, the influence laws of the interacted distance on atom number of phase transition and dislocation length are not distinct. Appropriate interacted distances between abrasives can decrease grinding force, coefficient of friction, grinding induced stress, subsurface damage depth, and abrasive wear during the grinding process. Grinding test combined with the cross-sectional TEM detection verified the reliability of the simulated damage behaviors, i.e. amorphous, high-pressure phase transition, dislocations, stacking faults, and lattice distortions. The results not only enhance the understanding of damage accumulation and material removal caused by the coupling actions of abrasives in grinding process, but also provide a feasible approach for the wheel design of ordered abrasives.","PeriodicalId":502508,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"90 9","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-01-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139612932","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Recent advances in fabrication and functions of neuromorphic system based on organic field effect transistor 基于有机场效应晶体管的神经形态系统制造与功能的最新进展
International Journal of Extreme Manufacturing Pub Date : 2024-01-12 DOI: 10.1088/2631-7990/ad1e25
Yaqian Liu, Minrui Lian, Wei Chen, Huipeng Chen
{"title":"Recent advances in fabrication and functions of neuromorphic system based on organic field effect transistor","authors":"Yaqian Liu, Minrui Lian, Wei Chen, Huipeng Chen","doi":"10.1088/2631-7990/ad1e25","DOIUrl":"https://doi.org/10.1088/2631-7990/ad1e25","url":null,"abstract":"\u0000 The development of various artificial electronics and machines would explosive increase the information and data, which need to be processed in-situ remediation. Bioinspired synapse devices can store and process signals in a parallel way, then improve fault tolerance and decrease the power consumption of artificial systems. The organic field effect transistor (OFET) is a promising component for bioinspired neuromorphic systems because it is suitable for large-scale integrated circuits and flexible devices. In this review, the organic semiconductor materials, structures and fabrication, and different artificial sensory perception systems functions based on micro-sized neuromorphic OFET devices are summarized. Finally, a summary and challenges of neuromorphic OFET devices are provided. This review presents a detailed introduction to the recent progress of neuromorphic OFET devices from semiconductor materials to perception systems, which would provide a reference for the achievement of neuromorphic systems in future bioinspired electronics.","PeriodicalId":502508,"journal":{"name":"International Journal of Extreme Manufacturing","volume":" 3","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-01-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139624619","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A review on current development of thermophotovoltaic technology in heat recovery 热回收领域热光电技术发展现状综述
International Journal of Extreme Manufacturing Pub Date : 2024-01-11 DOI: 10.1088/2631-7990/ad1dca
Shuni Chen, Yanming Guo, Qinghui Pan, Yong Shuai
{"title":"A review on current development of thermophotovoltaic technology in heat recovery","authors":"Shuni Chen, Yanming Guo, Qinghui Pan, Yong Shuai","doi":"10.1088/2631-7990/ad1dca","DOIUrl":"https://doi.org/10.1088/2631-7990/ad1dca","url":null,"abstract":"\u0000 The burning of fossil fuels in industry results in significant carbon emissions, and the heat generated is often not fully utilized. For high-temperature industries, thermophotovoltaics (TPV) is an effective means of waste heat recovery. This review covers two aspects of high-efficiency TPV systems and industrial waste heat applications. At the system level, representative results of TPV complete systems, selective emitters and photovoltaic cells in the last decade are compiled, and key points of components to improve energy conversion efficiency is further analyzed. At the application level, the feasibility of TPV in high-temperature industrial applications is shown from the world waste heat utilization situation, and then the potential of TPV in waste heat recovery is illustrated with the steel industry as an example.","PeriodicalId":502508,"journal":{"name":"International Journal of Extreme Manufacturing","volume":" 5","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-01-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139626538","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Isotropic sintering shrinkage of 3D glass-ceramic nanolattices: backbone preforming and mechanical enhancement 三维玻璃陶瓷纳米晶格的各向同性烧结收缩:骨架预成型和机械强化
International Journal of Extreme Manufacturing Pub Date : 2023-12-22 DOI: 10.1088/2631-7990/ad1857
Nianyao Chai, Yunfan Yue, Xiangyu Chen, Zhongle Zeng, Sheng Li, Xuewen Wang
{"title":"Isotropic sintering shrinkage of 3D glass-ceramic nanolattices: backbone preforming and mechanical enhancement","authors":"Nianyao Chai, Yunfan Yue, Xiangyu Chen, Zhongle Zeng, Sheng Li, Xuewen Wang","doi":"10.1088/2631-7990/ad1857","DOIUrl":"https://doi.org/10.1088/2631-7990/ad1857","url":null,"abstract":"There is a perpetual pursuit for free-form glasses and ceramics featuring outstanding mechanical properties as well as chemical and thermal resistance. It is a promising idea to shape inorganic materials in three-dimensional (3D) forms to reduce their weight while maintaining high mechanical properties. A popular strategy for the preparation of 3D inorganic materials is to mold the organic-inorganic hybrid photoresists into 3D micro- and nano-structures and remove the organic components by subsequent sintering. However, due to the discrete arrangement of inorganic components in the organic-inorganic hybrid photoresists, it remains a huge challenge to attain isotropic shrinkage during sintering. Herein, we demonstrate the isotropic sintering shrinkage by forming the consecutive -Si-O-Si-O-Zr-O- inorganic backbone in photoresists and fabricate 3D glass-ceramic nanolattices with enhanced mechanical properties. The femtosecond (fs) laser is used for two-photon polymerization (TPP) to fabricate 3D green body structures. After subsequent sintering at 1000 ℃, high-quality 3D glass-ceramic microstructures can be obtained with perfectly intact and smooth morphology. In-suit compression experiments and finite-element simulations reveal that octahedral-truss (Oct-Truss) lattices possess remarkable adeptness in bearing stress concentration and maintain the structural integrity to resist rod bending, indicating that this structure is a candidate for preparing lightweight and high stiffness glass-ceramic nanolattices. 3D printing of such glasses and ceramics has significant implications in a number of industrial applications, including metamaterials, microelectromechanical systems, photonic crystals, and damage-tolerant lightweight materials.","PeriodicalId":502508,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"58 6","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-12-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139164334","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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