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Microsystem Technologies-Micro-And Nanosystems-Information Storage and Processing Systems最新文献

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Sensing liquid density using resonant flexural plate wave devices with sol–gel PZT thin films 用溶胶-凝胶PZT薄膜谐振弯曲板波装置传感液体密度
IF 2.1 4区 工程技术
Microsystem Technologies-Micro-And Nanosystems-Information Storage and Processing Systems Pub Date : 2008-05-22 DOI: 10.5555/1390009.1390033
YuJyh-Cheng, LinHuang-Yao
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引用次数: 0
PNIPAM: a thermo-activated nano-material for use in optical devices PNIPAM:用于光学器件的热活化纳米材料
IF 2.1 4区 工程技术
Microsystem Technologies-Micro-And Nanosystems-Information Storage and Processing Systems Pub Date : 2008-03-19 DOI: 10.5555/1356762.1356781
MiasSolon, SudorJan, CamonHenri
{"title":"PNIPAM: a thermo-activated nano-material for use in optical devices","authors":"MiasSolon, SudorJan, CamonHenri","doi":"10.5555/1356762.1356781","DOIUrl":"https://doi.org/10.5555/1356762.1356781","url":null,"abstract":"In this paper we describe the use of thermo-activated PNIPAM nano-material in optical switching devices. In other publications, the PNIPAM is used either as a carrier for crystalline colloidal arra...","PeriodicalId":49813,"journal":{"name":"Microsystem Technologies-Micro-And Nanosystems-Information Storage and Processing Systems","volume":"5 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2008-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88687915","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Glass frit bonding 玻璃熔块粘合
IF 2.1 4区 工程技术
Microsystem Technologies-Micro-And Nanosystems-Information Storage and Processing Systems Pub Date : 2005-12-01 DOI: 10.5555/3110941.3111116
KnechtelRoy
{"title":"Glass frit bonding","authors":"KnechtelRoy","doi":"10.5555/3110941.3111116","DOIUrl":"https://doi.org/10.5555/3110941.3111116","url":null,"abstract":"This paper reports on glass frit wafer bonding, which is a universally usable technology for wafer level encapsulation and packaging. After explaining the principle and the process flow of glass fr...","PeriodicalId":49813,"journal":{"name":"Microsystem Technologies-Micro-And Nanosystems-Information Storage and Processing Systems","volume":"18 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2005-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81317907","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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