{"title":"MEMS-LSI多芯片模块异构集成互连新技术","authors":"LeeKang-Wook, KoyanagiMitsumasa","doi":"10.5555/1712972.1712984","DOIUrl":null,"url":null,"abstract":"We developed novel interconnection technology for heterogeneous integration of MEMS and LSI multi-chip module, in which MEMS and LSI chips would be horizontally integrated on substrate and vertical...","PeriodicalId":49813,"journal":{"name":"Microsystem Technologies-Micro-And Nanosystems-Information Storage and Processing Systems","volume":"7 1","pages":""},"PeriodicalIF":1.6000,"publicationDate":"2009-12-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Novel interconnection technology for heterogeneous integration of MEMS–LSI multi-chip module\",\"authors\":\"LeeKang-Wook, KoyanagiMitsumasa\",\"doi\":\"10.5555/1712972.1712984\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We developed novel interconnection technology for heterogeneous integration of MEMS and LSI multi-chip module, in which MEMS and LSI chips would be horizontally integrated on substrate and vertical...\",\"PeriodicalId\":49813,\"journal\":{\"name\":\"Microsystem Technologies-Micro-And Nanosystems-Information Storage and Processing Systems\",\"volume\":\"7 1\",\"pages\":\"\"},\"PeriodicalIF\":1.6000,\"publicationDate\":\"2009-12-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microsystem Technologies-Micro-And Nanosystems-Information Storage and Processing Systems\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.5555/1712972.1712984\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microsystem Technologies-Micro-And Nanosystems-Information Storage and Processing Systems","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.5555/1712972.1712984","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Novel interconnection technology for heterogeneous integration of MEMS–LSI multi-chip module
We developed novel interconnection technology for heterogeneous integration of MEMS and LSI multi-chip module, in which MEMS and LSI chips would be horizontally integrated on substrate and vertical...
期刊介绍:
"Microsystem Technologies - Micro- and Nanosystems. Information Storage and Processing Systems" is intended to provide rapid publication of important and timely results on electromechanical, materials science, design, and manufacturing issues of these systems and their components.
The MEMS/NEMS (Micro/NanoElectroMechanical Systems) area includes sensor, actuators and other micro/nanosystems, and micromechatronic systems integration.
Information storage systems include magnetic recording, optical recording, and other recording devices, e.g., rigid disk, flexible disk, tape and card drives. Processing systems include copiers, printers, scanners and digital cameras.
All contributions are of international archival quality. These are refereed by MST editors and their reviewers by rigorous journal standards. The journal covers a wide range of interdisciplinary technical areas. It brings together and cross-links the knowledge, experience, and capabilities of academic and industrial specialists in many fields. Finally, it contributes to the economically and ecologically sound production of reliable, high-performance MEMS and information storage & processing systems.