Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)最新文献_第4页

How can experiences from reuse activities influence the development of DFE-tools 重用活动的经验如何影响dfe工具的开发

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924537

M. Hoffmann, R. Knoth, B. Kopacek, P. Kopacek

引用次数: 6

Comparison of major environmental performance metrics and their application to typical electronic products 主要环境绩效指标的比较及其在典型电子产品中的应用

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924508

Y. Luo, P. Wirojanagud, R. Caudill

引用次数: 20

Lead-free soldering-toxicity, energy and resource consumption 无铅焊接-毒性，能源和资源消耗

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924542

O. Deubzer, H. Hamano, T. Suga, H. Griese

{"title":"Lead-free soldering-toxicity, energy and resource consumption","authors":"O. Deubzer, H. Hamano, T. Suga, H. Griese","doi":"10.1109/ISEE.2001.924542","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924542","url":null,"abstract":"Toxicity, energy consumption and economical effects of applying SnPb/sub 37/ solder and PCB finish, SnAg/sub 3.0/Cu/sub 0.5/ solder, SnCu/sub 0.75/ solder, SnZn/sub 9/ solder and Sn as well as Ni/Au PCB finishes were compared to the respective tin-lead soldering materials. All assessed lead-free materials, besides the Ni/Au PCB finish, considerably reduce the toxic releases from PCBs into the environment. Lead-free soldering with SnAgCu and SnCu solders and current equipment increases the energy consumption in reflow soldering. To a minor degree it also enhances the energy demand for metal production. The energy consumption of the reflow oven is an environmental hot spot in the life cycle. The situation will improve with already available new oven technology. Evaluation with the Eco Indicator 95 and the Eco Point method show, that lead-free soldering with current soldering equipment and with the assessed lead-free solders and the tin PCB finish considerably reduces the overall burden to the environment. Surplus energy cost and, especially in case of SnAgCu solder, increased solder cost will hardly affect the total cost of a PCB, as solder and energy cost are only a minor part of the total PCB cost. Due to the silver content, the SnAgCu solder decreases the recycling cost.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122423506","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

The evolution of design for environment in electronics firms 电子企业环境设计的演变

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924528

J. Fava, D. Noble, A. Russell

{"title":"The evolution of design for environment in electronics firms","authors":"J. Fava, D. Noble, A. Russell","doi":"10.1109/ISEE.2001.924528","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924528","url":null,"abstract":"The electronics sector is a recognized leader in developing and adopting design for environment (DfE) practices. However, there is no standard way of implementing DfE and few guidelines for designing successful DfE programs. Research was done to document and analyze existing DfE programs and the key external and internal drivers shaping the evolution of these DfE programs in several leading electronics firms. The goal of the research was to understand how and why DfE has evolved differently in different electronics firms. A combination of primary (interviews with managers responsible for DfE programs) and secondary research methods using published materials was used. The range of programs examined included companies that developed entirely new DfE programs, to others that modified existing environmental frameworks. Findings indicate that the strengths and weaknesses of a particular DfE program can only be judged by understanding the factors influencing its evolution and by examining how a particular program contributes to implementing the environmental strategy of the specific firm.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127064669","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Assessing product design alternatives with respect to environmental performance and sustainability: a case study for circuit pack faceplates 从环境性能和可持续性方面评估产品设计方案:电路封装面板的案例研究

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924535

J. Mosovsky, J. Dispenza, D. Dickinson, J. Morabito, R. Caudill, N. Alli

{"title":"Assessing product design alternatives with respect to environmental performance and sustainability: a case study for circuit pack faceplates","authors":"J. Mosovsky, J. Dispenza, D. Dickinson, J. Morabito, R. Caudill, N. Alli","doi":"10.1109/ISEE.2001.924535","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924535","url":null,"abstract":"Environmental lifecycle assessment (LCA) must be integrated into design systems to achieve continuous improvement in the environmental performance of products. This provides the designer feedback on the lifecycle environmental impacts of an evolving design, emphasizing material, process or form substitution to decrease environmental impact. The New Jersey Institute of Technology (NJIT) has developed a prototype design for environment (DFE) and environmental LCA software tool that interfaces with Pro/Engineer (CAD tool) to extract product description and bill of materials data in order to conduct an environmental LCA inventory analysis. The inventory analysis is modeled to account for materials flows, energy usage, and environmental burdens, as well as costs associated with the product life cycle. Environmental impact assessment of the inventory analysis and interpretation of the results are performed with EcoPro, a universal lifecycle metric developed at Lucent Technologies that can provide the designer quantified feedback on environmental performance and sustainability in the form of single indicators for resource productivity (RP) and eco-efficiency (EE). Two different circuit pack faceplate designs were evaluated. Pro/Engineer files representing a proposed \"two-shot\" molded thermoplastic faceplate and a current metal (aluminum) assembly design were evaluated using the NJIT software tool and EcoPro. Results for RP and EE of the two designs and comparison of cost data demonstrate the benefits of the proposed design as well as the advantages of using this approach to evaluate alternative designs, construction, processes and materials.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"2014 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128226932","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Product environmental care, a praxis-based system uniting ISO 14001, ISO 14062, IPP, EEE and ecolabel elements 产品环境保护，一个以实践为基础的体系，结合了ISO 14001, ISO 14062, IPP, EEE和生态标签元素

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924501

A. Stevels

引用次数: 2

Disassembly complexity and recyclability analysis of new designs from CAD file data 从CAD文件数据分析新设计的拆卸复杂性和可回收性

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924495

V. Mani, S. Das, R. Caudill

{"title":"Disassembly complexity and recyclability analysis of new designs from CAD file data","authors":"V. Mani, S. Das, R. Caudill","doi":"10.1109/ISEE.2001.924495","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924495","url":null,"abstract":"It is well known that most decisions that effect the end-of-life disposal and recycling of a product are made during the product design phase. The premise of a design for environment (DfE) approach is that product designers will evaluate and improve their designs from an environmental perspective. The authors' survey of designers indicates they are typically overburdened with product functionality and cost reduction objectives. This more or less eliminates any serious DfE analysis, particularly in small and medium sized companies. There is therefore a need for DfE tools that require minimal user input and hence can be run automatically in the shadow of the design process. At MERC, the authors are involved in the development of such a suite of tools, which evaluate several life-cycle analysis dimensions simultaneously. In this paper, they present DfD-Compact, a design tool that evaluates disassembly complexity and material recyclability. The only input data required by this tool is readily extracted from common CAD programs. Specifically, this data includes a part relationship tree, part weight and part material composition. All other data is stored in standardized libraries. The CAD file data does not typically include all the data required to make a detailed analysis. The authors have developed a procedure that is able to use this core data to estimate other product data and then combine this with the library data to generate a reliable DfD-Ratio. This ratio evaluates the product in three dimensions: (i) material separation and recyclability; (ii) unfastening difficulty; and (iii) disassembly accessibility. The DfD-Ratio is measured on an open-ended scale starting from zero, with zero indicating the worst case. The higher the ratio the better the design. This ratio can be used by the designer to compare design alternatives, improve the design, and/or meet minimum DfE objectives. The procedure is illustrated by an example.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116977409","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 16

The DBOM standard: a specification for efficient product data transfer between manufacturers and demanufacturers DBOM标准:在制造商和非制造商之间有效传输产品数据的规范

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924533

S. Das, S. Naik

{"title":"The DBOM standard: a specification for efficient product data transfer between manufacturers and demanufacturers","authors":"S. Das, S. Naik","doi":"10.1109/ISEE.2001.924533","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924533","url":null,"abstract":"In this paper we present the DBOM (Disassembly Bill of Materials) standard, which attempts to facilitate the transfer of product disassembly and recycling data from OEMs to the recycling community. We believe this standard will not only improve disassembly and recycling economics, but will also increase the number of product types that are demanufactured. The DBOM provides a representation of the physical structure of the product in a disassembly context. Our analysis reveals that to facilitate efficient disassembly, the DBOM must contain information about the parts, the fasteners, and the fastening structure. We present a standard coding structure for documenting and transmitting this knowledge. The DBOM part list is usually an aggregated version of the assembly bill of materials, since details about all parts is typically not required. We provide guidelines to determine whether a group of mating parts should be listed as one part in the DBOM. The DBOM also relates each part to a material recycling stream and provides an estimate of its purity. In the future we expect the product manufacturer to create and distribute the DBOM to potential collection and disassembly facilities through product labeling or a public access website.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129006507","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

A system for integrating design for environment (DFE) criteria into the new product introduction process 一个将环境设计(DFE)标准整合到新产品引入过程中的系统

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924518

T. L. Neal, M. Heintz

引用次数: 7

A logistic concept to improve the re-usability of electric and electronic equipment 提高电气和电子设备再使用性的物流概念

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924512

R. Knoth, M. Hoffmann, B. Kopacek, P. Kopacek

引用次数: 8