{"title":"Advanced quality planning issues","authors":"C. Craig","doi":"10.1109/HOLM.1989.77926","DOIUrl":"https://doi.org/10.1109/HOLM.1989.77926","url":null,"abstract":"Summary form only given. Activities prior to tooling were considered, including: (1) product design FMEA (identification of critical product characteristics, identification of major product characteristics, determination and justification of specification limits, determination of appropriate gaging techniques, and raw material requirements); (2) process FMEA, which encompasses all primary processes such as stamping, molding, plating, and assembly. Also considered were tool qualification (first article requirements, process potential study requirements, gage potential requirements, and long-term process qualification); and quality requirements (Cpk requirements, deviation from target, and quality as produced and shipped evaluation).<<ETX>>","PeriodicalId":441734,"journal":{"name":"Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on Electrical Contacts","volume":"110 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126962314","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Erosion behaviour and 'erodibility' of Ag/CdO and Ag/SnO/sub 2/ contacts under AC 3 and AC 4 test conditions","authors":"H. Manhart, W. Rieder","doi":"10.1109/HOLM.1989.77905","DOIUrl":"https://doi.org/10.1109/HOLM.1989.77905","url":null,"abstract":"Contact erosion depends on both the duration and efficiency of interaction between arc and contacts. The arc motion in a magnetic field was recorded, and the material loss caused by arc erosion was weighed. The material loss related to 1 ms of arc interaction, called erodibility, was evaluated for the contact materials Ag/CdO and Ag/SnO/sub 2/. All tests were performed in one type of commercial contactor (rated current 110 A). The erodibility was determined for new and partly eroded contacted prestressed during life tests under AC 3 and AC 4 conditions according to IEC test specification 158-1. AC 4 erosion was mainly caused by break arcs, but the effect of make arcs was negligible, whereas AC 3 erosion was due to both break and make arcs. The latter were more effective in Ag/SnO/sub 2/ contacts. After AC 3 life tests the erodibility values determining the erosion of Ag/SnO/sub 2/ contacts at the site of arc formation were higher than those of Ag/CdO; after AC 4 life tests, however, there was hardly any difference between the erodibilities of the two materials.<<ETX>>","PeriodicalId":441734,"journal":{"name":"Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on Electrical Contacts","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121982395","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A mathematical model relating card-edge connectors failure to normal force and lubrication in office dust environment","authors":"M. Singer, V. Florescu","doi":"10.1109/HOLM.1989.77929","DOIUrl":"https://doi.org/10.1109/HOLM.1989.77929","url":null,"abstract":"A study was undertaken to develop a mathematical model that correlates gold-plated card-edge connector reliability with contact design parameters in office-type corrosive gas and dust environments. The first phase of the study focused on connector behavior in an office dust environment. The authors describe the experiments, the statistical modeling approach, and the resultant mathematical model. This led to developing a novel expression for contact failure as a function of normal force and lubrication levels. Increasing contact normal force is found to decrease failure, whereas increasing lubrication levels (in the office dust environment) increase failure.<<ETX>>","PeriodicalId":441734,"journal":{"name":"Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on Electrical Contacts","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125442549","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Requirements for reliable connector contacts","authors":"G. Bolger","doi":"10.1109/HOLM.1989.77925","DOIUrl":"https://doi.org/10.1109/HOLM.1989.77925","url":null,"abstract":"Summary form only given. Xerox requirements for reliable connector contacts were addressed. The thrust of the activity is a cooperative technical effort with the vendor. From the information on the program's machine environment, class, lifecycle, PWBA assembly processes, and cable harness cost targets (robotics implication), the qualification requirements were defined. Xerox start-up protection activities were also considered. These activities are undertaken to ensure that the quality targets (in this case, the connector contacts) are met before the product passes to the manufacturing phase. Activities in three program phases (design, prototype, and early manufacturing) were discussed. In each phase, specific activities are performed to measure the performance of the interconnect system. The role of closed-loop corrective action and history file was discussed in terms of negotiated quality targets with the vendor(s).<<ETX>>","PeriodicalId":441734,"journal":{"name":"Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on Electrical Contacts","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129549590","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"The influence of circuit parameters and contact materials on the reignition of high frequency vacuum arcs","authors":"M. Lindmayer, Ernst-Dieter Wilkening","doi":"10.1109/HOLM.1989.77945","DOIUrl":"https://doi.org/10.1109/HOLM.1989.77945","url":null,"abstract":"The extinction or reignition of high-frequency transients plays an important role in the generation of voltage surges. Investigations with currents of several hundred amperes peak and current frequencies from 100 kHz up to 1 MHz were made to examine the reignition behavior of short vacuum gaps using different contact materials. The experiments were carried out in an UHV (ultrahigh vacuum) test chamber connected to an LC test circuit with voltages in the 10-kV range. The statistical distribution of the reignition voltage after current zero of HF vacuum arcs yields two probable reignition mechanisms, the cold gap behavior and the plasma-influenced reignition. The reignition tendency increases with rising di/dt and rising current frequency. The reignition voltages of the examined contact materials increase in the sequence: OFHC Cu, Cr, Cu/Cr 75/25.<<ETX>>","PeriodicalId":441734,"journal":{"name":"Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on Electrical Contacts","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126346655","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"The corrosion of copper and porous gold in flowing mixed gas environments","authors":"W. Abbott","doi":"10.1109/HOLM.1989.77933","DOIUrl":"https://doi.org/10.1109/HOLM.1989.77933","url":null,"abstract":"Experiments were conducted on the corrosion of materials in a broad variety of single-component and multicomponent flowing mixed gas environments. One purpose of the experiments was to document in a consistent manner the corrosion rates and effect which can be expected for different gas mixtures. A second objective was to demonstrate the importance of standardized control materials for documenting environmental tests. The results confirm that flowing mixed gas environments based upon the use of the sulfide-chloride synergisms produce relevant corrosion with useful accelerator factors. Nonchloride environments were found to be relatively high. Two materials were demonstrated to be useful for documenting the conditions actually obtained during environmental tests. These are copper and porous gold. Neither alone can present an adequate descriptor of the test conditions actually achieved. Used together, however, they can provide a sensitive indicator of corrosion rates and mechanisms.<<ETX>>","PeriodicalId":441734,"journal":{"name":"Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on Electrical Contacts","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133967206","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Enhanced surface segregation in sliding wear tracks","authors":"R. Kothari, R. Vook, J.G. Zhang, M.D. Zhu","doi":"10.1109/HOLM.1989.77914","DOIUrl":"https://doi.org/10.1109/HOLM.1989.77914","url":null,"abstract":"The effect of sliding wear on the rate of surface segregation of sulfur from an OFHC copper sample was investigated. This work was carried out in an ultra-high vacuum system having a residual gas pressure of 5*10/sup -11/ torr. Wear tracks were formed on OFHC Cu that had previously been annealed and argon-ion sputter cleaned. A bent pin was made to slide across the surface with a contact force of 25 g for 9000 cycles. No surface segregation was observed to occur as a result of forming the wear track. Subsequent in situ isothermal annealing between 310 degrees C and 470 degrees C produced S enhancement on the specimen surface. It was observed that the rate of S segregation on the wear track was much faster than off track up to approximately 390 degrees C, where this rate decreased significantly. At higher temperatures, the rate of S segregation on track approximately equaled the off-track rate. The drop in the rate of S segregation on the track at 390 degrees C is interpreted as due to annealing-out of the short-circuit diffusion paths associated with the defects formed when the wear track was made. The subsequent increase in S concentration at higher temperatures is due to the normal surface segregation phenomenon which occurs in annealed samples.<<ETX>>","PeriodicalId":441734,"journal":{"name":"Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on Electrical Contacts","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132407720","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A possible degeneration mechanism in stationary electrical contacts","authors":"R. Timsit","doi":"10.1109/HOLM.1989.77940","DOIUrl":"https://doi.org/10.1109/HOLM.1989.77940","url":null,"abstract":"A mechanism for the degeneration of stationary electrical contacts is proposed. The mechanism derives from Mullins' model (1959) of flattening of free surfaces through the action of capillarity forces. Mass transport for surface deformation is assumed to occur through volume self-diffusion and is calculated on the basis of diffusion constants characteristic of plastically deformed or mechanically stressed aluminium. A simple electrical contact model suggests that the increase in contact resistance stemming from surface flattening in Al at room temperature can become noticeable in a time interval of a few days ( approximately 10/sup 6/ s). This result may explain the deterioration of contaminated Al/Al stationary electrical contacts operated at room temperature, after run-times of 10/sup 5/-10/sup 6/ s. Finally, since many metals are characterized both by rapid volume or surface diffusion and by a large surface energy, the results suggest that asperity flattening can lead to degeneration in all bulk electrical interfaces.<<ETX>>","PeriodicalId":441734,"journal":{"name":"Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on Electrical Contacts","volume":"149 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122456933","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Overview: connector contact quality","authors":"R. Malucci","doi":"10.1109/HOLM.1989.77923","DOIUrl":"https://doi.org/10.1109/HOLM.1989.77923","url":null,"abstract":"Summary form only given. Electrical connectors are passive devices that interconnect circuit elements through low-resistance stationary contacts. For an electronic system to perform reliably, the interconnect system must be reliable in the environment and throughout the expected life of the system. It is noted that building reliability and quality into an electrical interconnect system is a very complex process that depends on systematically addressing these issues at every step of the development cycle through the initial production phase. The major steps in the development cycle through initial production were reviewed with regard to reliability and quality. This included topics such as system requirements, contact physics considerations, product design, tool build, initial production, qualification testing, and process control. In addition, an attempt was made to define the number of variables involved in defining requirements, specifying designs, manufacturing products, and controlling the processes involved in producing and maintaining quality products.<<ETX>>","PeriodicalId":441734,"journal":{"name":"Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on Electrical Contacts","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123956148","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
T. Yokokawa, T. Yano, C. Kawakita, K. Hinohara, T. Kobayashi
{"title":"Thickness of ruthenium oxide film produced by the surface deactivation treatment of ruthenium-plated contact reed switches","authors":"T. Yokokawa, T. Yano, C. Kawakita, K. Hinohara, T. Kobayashi","doi":"10.1109/HOLM.1989.77937","DOIUrl":"https://doi.org/10.1109/HOLM.1989.77937","url":null,"abstract":"A precise analysis of ruthenium-plated contact surfaces was made to obtain information on the thickness of ruthenium oxide film. The thickness of ruthenium oxide film before and after high-temperature oxygen treatment was measured. As a result of investigation using ellipsometry and Auger electron spectroscopy, it was found that the thickness of ruthenium oxide film on the ruthenium-plated contact surface treated with oxygen at 450 degrees C optimum treatment temperature is approximately 50 AA and that the thickness increases as treatment temperature rises.<<ETX>>","PeriodicalId":441734,"journal":{"name":"Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on Electrical Contacts","volume":"191 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122979846","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}