Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,最新文献_第7页

A multilayer surface mount technology elevated by an aramid-paper and epoxy-resin composite 一种由芳纶纸和环氧树脂复合材料提升的多层表面贴装技术

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68991

E. Tsunashima, A. Okuno, K. Nagai, M. Kadowaki, E. Akiyama

引用次数: 2

Preparation of custom gate array silicon wafers to handle specific wafer size in metallization process 定制门阵列硅片的制备，以处理金属化过程中特定的晶圆尺寸

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1900-01-01 DOI: 10.1109/EMTS.1989.69001

F. Ghahghahi, P. Hoss

引用次数: 0

Low stress silver-glass die attach material 低应力银玻璃模具贴附材料

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1900-01-01 DOI: 10.1109/EMTS.1989.68979

M. Nguyen

引用次数: 4

Analyzing the mechanical strength of SMT attached solder joints 分析SMT贴附焊点的机械强度

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1900-01-01 DOI: 10.1109/EMTS.1989.68952

W. Chen

引用次数: 0

Enhanced high speed performance from HDI thin film multi-chip modules 从HDI薄膜多芯片模块增强高速性能

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1900-01-01 DOI: 10.1109/EMTS.1989.69003

E. Bogatin, P. Ghandi, G. Weihe, S. Szeto, C. Lofdahl

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引用次数: 1