Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,最新文献

Job disposition cost model 工作配置成本模型

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68990

R. Kuracina, A. Kovalchuk

引用次数: 0

Achieving semiconductor equipment reliability 实现半导体设备的可靠性

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68943

D. Ditmore, J. Stewart, R. Dudley, N. Bright

{"title":"Achieving semiconductor equipment reliability","authors":"D. Ditmore, J. Stewart, R. Dudley, N. Bright","doi":"10.1109/EMTS.1989.68943","DOIUrl":"https://doi.org/10.1109/EMTS.1989.68943","url":null,"abstract":"It is noted that the increasing complexity of semiconductor manufacturing processes and the competitiveness of worldwide device production demand step function improvements in production equipment reliability and predictability of its availability for use. The scope of the challenge to improve reliability is discussed, and a summary of key device and equipment changes forecast for the next five years is given. The present status and approach to delivering predictable equipment availability are discussed, and how this will change with time is considered. Experience at Applied Materials is reviewed. Equipment reliability attainments at Applied Materials include: system modeling; reliability specifications by module as a design parameter, and the iterative process of feedback from application laboratories and customer use for problem identification; and engineering programs for corrective action. It is predicted that continuing improvement in reliability, aided by technology to reduce the cost of delivering service to the machine in the field, will reverse the current trend toward increasing equipment ownership costs.<<ETX>>","PeriodicalId":432803,"journal":{"name":"Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-09-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122080459","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

University/industry (and government) interdisciplinary centers, programs, consortia, inter-relations, and initiatives 大学/行业(和政府)跨学科中心、项目、联盟、相互关系和倡议

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68968

L. Keys

引用次数: 0

Plastic package moisture absorption hazards in SMT board assembly 塑料封装在SMT板组装中的吸湿危害

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68949

X. Saint-martin, J. Joly

{"title":"Plastic package moisture absorption hazards in SMT board assembly","authors":"X. Saint-martin, J. Joly","doi":"10.1109/EMTS.1989.68949","DOIUrl":"https://doi.org/10.1109/EMTS.1989.68949","url":null,"abstract":"The package cracking hazard is discussed from an SMT (surface mount technology) board assembly manufacturer's point of view. On the basis of previous studies, the allowed maximum moisture levels after drying and after moisture absorption are defined. Drying curves and moisture absorption curves after drying are plotted for different component types, including quad-flat-packs, under specified conditions. As a result, recommendations are given on drying time, storage time, and temperatures and conditions to be applied. Because of the large number of large-size die memories in SOJ 20-26 packages currently purchased, a complete evaluation, including crack investigation for different moisture levels, has been performed. This moisture related reliability hazard drastically points out the need for new packaging materials, new packing procedures, and a mountability test in qualification files of SMT components. It is shown that a reduction of moisture-related hazards requires either that components be purchased in shipping bags which will guarantee a moisture level below 0.2% or that they be baked for 16 h at a temperature of 125 degrees C. Shelf-life is 40 h under uncontrolled conditions or 1 month if components are stored under 20 degrees C 50% RH.<<ETX>>","PeriodicalId":432803,"journal":{"name":"Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-09-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114620622","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Solderability test requirements for plastic surface mount packages 塑料表面贴装封装的可焊性试验要求

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68948

C.L. Alger, D. E. Pope, P.M. Rehm, N. Sivasubramanian

引用次数: 4

Reducing the cost and effort of computer-aided test program development 减少计算机辅助测试程序开发的成本和工作量

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68939

J. Rose

引用次数: 0

Improving exposure system's compatibility by changing the lamp calibration method 通过改变光源标定方法，提高曝光系统的兼容性

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68955

S. Wible, K. Kasten

引用次数: 1

Effect of heat and moisture on thick positive photoresist 热、湿对厚正性光刻胶的影响

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68995

B. Mani

{"title":"Effect of heat and moisture on thick positive photoresist","authors":"B. Mani","doi":"10.1109/EMTS.1989.68995","DOIUrl":"https://doi.org/10.1109/EMTS.1989.68995","url":null,"abstract":"A Novolac resin AZ 4903 for lithographic evaluation is discussed from the standpoint of moisture and heat effects. Differential gravimetric and thermogravimetric analyses (DTG and TGA) were used for investigating the chemical changes of the photoresist associated with heat. The variations of moisture (humidity levels) were used to evaluate the hydrolyzation of the photoresist. The hydrolyzation was followed by UV light exposure and development of photoresist. Scanning electron and optical microscopy was used to determine the efficiency of photoresist development. The DTG and TGA revealed five chemical changes in photoresist (AZ 4903) materials due to the effect of heat from 25 to 700 degrees C. The changes are related to the lithographic process. The first process is due to evaporation of high volatile solvent; the second process is due to removal of low volatile solvent and nitrogen (partly); the third process is due to removal of photosensitizer and monomer; the fourth process is due to removal of low molecular resin; and the fifth process is due to decomposition of organics. The increase of humidity for hydrolyzation reduced the resist developing time. A 40% time saving is possible for hydrolyzation at 70% humidity compared to the time required for hydrolyzation at 40% humidity. However, the quantity of water required for hydrolyzation remained constant.<<ETX>>","PeriodicalId":432803,"journal":{"name":"Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-09-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127240551","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Improving circuit speed through resin chemistry (a polycyanate resin for high speed PWB applications) 通过树脂化学提高电路速度(用于高速PWB应用的聚氰酸酯树脂)

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68993

N.L. Wassberg, G.W. Bogan, G.A. Monnerat

{"title":"Improving circuit speed through resin chemistry (a polycyanate resin for high speed PWB applications)","authors":"N.L. Wassberg, G.W. Bogan, G.A. Monnerat","doi":"10.1109/EMTS.1989.68993","DOIUrl":"https://doi.org/10.1109/EMTS.1989.68993","url":null,"abstract":"The knowledge that low aromatic polymers promote improved dielectric response allowed the development of a polycyanate resin from a cycloaliphatic/aromatic hybrid. This product allows improvement in dielectric properties without reduction in the enhanced thermal properties associated with triazine resins. The cured polycyanate (containing cycloaliphatic bridges between aromatic rings) is capable of a low dielectric constant over a wide temperature and frequency range. The improved dielectric properties of this resin can promote circuit speed increases from 14 to 25%. The product also exhibits the thermal stability characteristics of triazine-type cures offering a glass transition temperature of 256 degrees C. This cycloaliphatic/aromatic hybrid resin contributes both extremely low moisture absorption and relatively simple processing capabilities. The added benefit of low moisture absorption prevents the degradation of the dielectric and mechanical properties. This product appears well suited for applications where higher-speed components and excellent laminate heat stability are required.<<ETX>>","PeriodicalId":432803,"journal":{"name":"Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-09-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121088960","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Fluoropolymer composite multichip modules 含氟聚合物复合多芯片模块

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68961

S. Lockard

引用次数: 1