Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,最新文献_第2页

Maglev microrobotics: an approach toward highly integrated small-scale manufacturing systems 磁悬浮微型机器人:迈向高度集成的小规模制造系统的途径

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68988

R. Pelrine

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引用次数: 8

Effects of material and process on the reliability of very small hermetic microwave packages 材料和工艺对微型密封微波封装可靠性的影响

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68996

L. B. Lian-Mueller, J. Lau

引用次数: 0

Engineering research centers: the Purdue experience 工程研究中心:普渡大学经验

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.69005

J. Solberg

引用次数: 2

SPC implementation and real time results SPC实施和实时结果

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68958

M. Matthews, N. Whitlow

引用次数: 0

Nondestructive evaluation of debonding within plastic integrated circuit packages using different methods of acoustic microscopy 用不同声学显微镜方法无损评价塑料集成电路封装内的脱粘

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68997

J. Semmens, L. W. Kessler

引用次数: 2

Using coarse/fine manipulation with vision to place fine pitch SMD components 使用粗/细操作与视觉放置小间距SMD组件

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68986

J. Baartman, A.E. Brennemann, S. Buckley, M. C. Moed

引用次数: 3

Nondestructive evaluation of TAB bonds by acoustic microscopy 声学显微镜对TAB键的无损评价

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68999

L. W. Kessler, J. Semmens, F.T. Cichanski

引用次数: 4

The University of Illinois Manufacturing Research Center 伊利诺伊大学制造研究中心

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68970

S. Danyluk

引用次数: 0

Managing manufacturing performance 管理制造性能

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68944

R. Odom

引用次数: 0

A process for prevention of low temperature oxide growth over gold coated backside of silicon wafer 一种防止镀金硅片背面低温氧化物生长的方法

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, Pub Date : 1989-09-25 DOI: 10.1109/EMTS.1989.68978

M. Khan, H. Fatemi

{"title":"A process for prevention of low temperature oxide growth over gold coated backside of silicon wafer","authors":"M. Khan, H. Fatemi","doi":"10.1109/EMTS.1989.68978","DOIUrl":"https://doi.org/10.1109/EMTS.1989.68978","url":null,"abstract":"A process for the stabilization of gold film deposited on the back of silicon wafers was developed whereby low-temperature migration of silicon through gold and its oxidation could be prevented. The process consisted of rapid thermal alloying of a sputtered gold film deposited over a fine-ground backside of silicon wafer. The alloying was done at 400 degrees C in an inert environment for a duration of 30 s. The effectiveness of this treatment was demonstrated by improved wetting of an aged, alloyed film with melted gold preform used in gold-silicon eutectic die bonding compared with a nonalloyed specimen. Rapid thermal alloying at 400 degrees C in an inert atmosphere was found to be the most effective means of stabilizing the gold-coated wafer backside. Convection alloying was found to induce some surface oxidation. Surface finish had a notable effect on the resistance to oxidation of the alloyed film; smoother finish was found to be better. Evaporated gold film was found to have a thin underlying SiO/sub 2/ layer. Such a structure would be a potential hazard to the reliability of die bonding. In such a case, sputtering would be the preferred method of gold deposition.<<ETX>>","PeriodicalId":432803,"journal":{"name":"Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,","volume":"8 13","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-09-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113932910","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1