2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)最新文献

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Influence of sample shape and size on the shielding effectiveness of EMI when characterized with the stripline test method 样品形状和尺寸对电磁干扰屏蔽效果的影响
D. Pissoort, T. Claeys, D. Vanoost, F. Vanhee, J. Catrysse, C. Brull
{"title":"Influence of sample shape and size on the shielding effectiveness of EMI when characterized with the stripline test method","authors":"D. Pissoort, T. Claeys, D. Vanoost, F. Vanhee, J. Catrysse, C. Brull","doi":"10.1109/ISEMC.2017.8077949","DOIUrl":"https://doi.org/10.1109/ISEMC.2017.8077949","url":null,"abstract":"This paper studies the influence of a gasket's shape and size on its high-frequency shielding-effectiveness as measured with the stripline test method. Based on full-wave simulations it is shown that the main influencing parameter for the shielding-effectiveness is the gasket's conductivity. Through a comparison with the reverberation room method, it is shown that differences due to shape and size of the gasket are not related to the stripline set-up, but are a reflection of the true shielding effectiveness of the gasket.","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122214671","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Efficient and accurate jitter modeling method for unmatched memory bus 一种高效准确的非匹配存储器总线抖动建模方法
Jun Liao, R. Chakraborty, K. Cai, Marwan Dakroub, R. Meltser
{"title":"Efficient and accurate jitter modeling method for unmatched memory bus","authors":"Jun Liao, R. Chakraborty, K. Cai, Marwan Dakroub, R. Meltser","doi":"10.1109/ISEMC.2017.8077887","DOIUrl":"https://doi.org/10.1109/ISEMC.2017.8077887","url":null,"abstract":"An efficient and accurate jitter modeling methodology for unmatched transmitter/receiver is proposed to close the gap among different disciplines, namely signal integrity, power integrity, and silicon design. This method accurately predict system timing risk, and provide design recommendations for silicon.","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130412645","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
WE-PM-3 Tutorial lab experiences with IEC 60601-1-2 4th Edition WE-PM-3教程实验室经验与IEC 60601-1-2第4版
H. Buchwald
{"title":"WE-PM-3 Tutorial lab experiences with IEC 60601-1-2 4th Edition","authors":"H. Buchwald","doi":"10.1109/ISEMC.2017.8078073","DOIUrl":"https://doi.org/10.1109/ISEMC.2017.8078073","url":null,"abstract":"EMC testing of medical electrical equipment is for specialist as well as for manufacturer! Close communications and collaboration between the manufacturer and the EMC test lab is an obligation","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116982505","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Mitigating potential hazards of TIG welding on spacecraft 降低航天器上TIG焊接的潜在危害
M. Bodeau
{"title":"Mitigating potential hazards of TIG welding on spacecraft","authors":"M. Bodeau","doi":"10.1109/ISEMC.2017.8078118","DOIUrl":"https://doi.org/10.1109/ISEMC.2017.8078118","url":null,"abstract":"TIG = Tungsten (W) Inert Gas (Ar or He used to prevent oxidation and contamination of weld joint)","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132634436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Plant perspective for the digital I&C implementation process with respect to EMC 与EMC相关的数字化I&C实施过程的工厂视角
Michael A. Hoffman
{"title":"Plant perspective for the digital I&C implementation process with respect to EMC","authors":"Michael A. Hoffman","doi":"10.1109/ISEMC.2017.8078086","DOIUrl":"https://doi.org/10.1109/ISEMC.2017.8078086","url":null,"abstract":"• U.S. nuclear power plant operating philosophy • The E-M Environment • Digital changes and challenges • EMC within the design change process • Testing & review for EMC","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128263695","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Sensitivity analysis and empirical optimization of cross-domain coupling on RFICs using polynomial chaos expansion 基于多项式混沌展开的rfic跨域耦合灵敏度分析及经验优化
Ö. Yildiz, J. Preibisch, J. Niehof, C. Schuster
{"title":"Sensitivity analysis and empirical optimization of cross-domain coupling on RFICs using polynomial chaos expansion","authors":"Ö. Yildiz, J. Preibisch, J. Niehof, C. Schuster","doi":"10.1109/ISEMC.2017.8077849","DOIUrl":"https://doi.org/10.1109/ISEMC.2017.8077849","url":null,"abstract":"This work aims at investigating the variability of internal coupling mechanisms between different domains of a Radio Frequency Integrated Circuit (RFIC). In doing so, an Equivalent Circuit Model (ECM) is used in order to model the various coupling paths. First, the elements of the ECM are assumed to be uniformly distributed and their exact values therefore not fully known. Afterwards, the impact of theses uncertainties on the cross-domain transfer function, i.e. the coupling from the digital domain – the aggressor – into the other more sensitive domains – the victims – is analyzed using Polynomial Chaos Expansion (PCE) in combination with a sampling-based technique known as Stochastic Testing (ST). This approach intends to account for not accurately known configurations of the RFIC and package. In addition, the PCE representation allows for conducting sensitivity analysis through the derivation of conditional variances, i.e. Sobol indices, and sensitivities. PCE in combination with ST offers an efficient way to analyze the coupling effects. Finally, an improved version of the original design is proposed using an empirical optimization approach based on the techniques described above.","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128412462","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Worst case prediction of shielding effectiveness of board level shields 板级屏蔽效能的最坏情况预测
Ruijie He, V. Khilkevich, Ling Zhang, M. Khorrami, P. Dixon, Y. Arien
{"title":"Worst case prediction of shielding effectiveness of board level shields","authors":"Ruijie He, V. Khilkevich, Ling Zhang, M. Khorrami, P. Dixon, Y. Arien","doi":"10.1109/ISEMC.2017.8077948","DOIUrl":"https://doi.org/10.1109/ISEMC.2017.8077948","url":null,"abstract":"A method is proposed to predict the worst case shielding effectiveness of a board level shield (BLS). This method estimates the shielding effectiveness (SE) of the shield below and above the first resonance of a cavity formed by the BLS. The apertures of the BLS are modelled as antennas with known radiation efficiency. The estimation of the maximum field inside the cavity is used to calculate the magnetic currents driving the antennas above the first resonance of the cavity. Below the first resonance the field inside the cavity is estimated using the resonant LC circuit model. An approximated formula for the radiation of the uniformly placed apertures is developed. The worst case prediction is validated by the full wave simulation and also in measurement on a real BLS.","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134510013","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Isotropy study for over-the-Air measurements in a loaded reverberation chamber 负载混响室空中测量的各向同性研究
D. Senic, D. Cavaliere, Matt V. North, Maria G. Becker, K. Remley, C. Wang, C. Holloway
{"title":"Isotropy study for over-the-Air measurements in a loaded reverberation chamber","authors":"D. Senic, D. Cavaliere, Matt V. North, Maria G. Becker, K. Remley, C. Wang, C. Holloway","doi":"10.1109/ISEMC.2017.8077853","DOIUrl":"https://doi.org/10.1109/ISEMC.2017.8077853","url":null,"abstract":"We performed a field isotropy study based on the reverberation chamber transfer function for three different reverberation chamber configurations. Guidance for reducing the anisotropy based on the polarization-balanced antenna is also provided. We show that chamber isotropy is strongly influenced by loading such that an unloaded chamber can be considered as an isotropic environment, while a loaded chamber is more-or-less anisotropic depending on the amount of loading present. The loading of the chamber is crucial for wireless tests involving modulated signals. Its purpose is to create a flat channel, which enables successful demodulation of the signal without distortion. Consequently, understanding this effect is important in quantifying measurement uncertainty in loaded conditions.","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133980630","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
A novel z-directed embedded component for the reduction of voltage ripple on the power distribution network for PCBs 一种用于减少pcb配电网电压纹波的新型z向嵌入式元件
Biyao Zhao, K. Hardin, A. Hosseinbeig, Y. S. Cao, N. Dikhaminjia, Zachary C. N. Kratzer, J. Fessler, J. Drewniak
{"title":"A novel z-directed embedded component for the reduction of voltage ripple on the power distribution network for PCBs","authors":"Biyao Zhao, K. Hardin, A. Hosseinbeig, Y. S. Cao, N. Dikhaminjia, Zachary C. N. Kratzer, J. Fessler, J. Drewniak","doi":"10.1109/ISEMC.2017.8077871","DOIUrl":"https://doi.org/10.1109/ISEMC.2017.8077871","url":null,"abstract":"A new capacitor package and PCB embedding technique is introduced to significantly reduce the system power distribution network impedance at the pads of surface mounted integrated circuits. The capacitor is multi-layer ceramic capacitor (MLCC) that is a right cylindrical shape with via channels in the outer wall along the axis of the part. The capacitor called a Z-Directed component (ZDC) is then pressed into a hole in the PCB. The connections to the component are then made by the copper plating process similar to via hole construction. This new configuration dramatically improves the PDN performance of PCBs with fewer components than the conventional solution with SMD decoupling capacitors.","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123976367","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
On inductance of power islands and its impact on decoupling behavior in high speed boards 高速线路板中功率岛的电感及其对去耦性能的影响
M. Mondal, B. Archambeault
{"title":"On inductance of power islands and its impact on decoupling behavior in high speed boards","authors":"M. Mondal, B. Archambeault","doi":"10.1109/ISEMC.2017.8077935","DOIUrl":"https://doi.org/10.1109/ISEMC.2017.8077935","url":null,"abstract":"Design of power delivery networks for printed circuit boards hosting both analog and digital parts often employs small power islands for supplying power to sensitive components. While providing necessary isolation from noise generated by other components, the power islands also experience increased inductance due to current crowding at the bridge. In this paper, the inductance at a port on the power island has been quantified. The variation of port inductance with the bridge width and slot/gap width has been studied. It has been demonstrated that the increased inductance adversely affects the effectiveness of decoupling capacitors. This necessitates more careful design of the decoupling capacitors to be placed on the power islands. To enable better design space exploration involving power islands, a methodology to model the inductance of power island ports has been described. To illustrate the effectiveness of the methodology, case studies are presented on (1) finding the region on the main power area with maximum isolation from the power island ports (2) quantification of the loss of decoupling effectiveness as seen by ports on a power island.","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128991537","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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