2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)最新文献

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Hotspot thermal management via thin-film evaporation 薄膜蒸发热点热管理
S. Adera, D. Antao, R. Raj, E. Wang
{"title":"Hotspot thermal management via thin-film evaporation","authors":"S. Adera, D. Antao, R. Raj, E. Wang","doi":"10.1109/ITHERM.2016.7517572","DOIUrl":"https://doi.org/10.1109/ITHERM.2016.7517572","url":null,"abstract":"The emerging three-dimensional vertical chip stacking architecture is expected to reduce form factor and improve performance by providing energy efficient chip design. However, increased power density and non-uniform heat generation in stacked dies offset its advantages and pose a significant thermal management challenge by creating hotspots where heat loads in excess of 1 kW/cm2 are generated from sub-millimeter areas. Furthermore, the localized heating in hotspots creates high junction temperature which can degrade the performance, reliability, and life time of electronic chips. Such ultra-high heat fluxes are challenging to remove using state-of-the-art single-phase cooling technology. Consequently, chip-level phase-change based hotspot thermal management is increasingly becoming pivotal for cooling next-generation of microelectronic devices and power amplifiers. This work experimentally characterizes capillary-limited thin-film evaporation from well-defined silicon micropillar wicks to demonstrate its potential as a thermal solution for ultra-high heat fluxes. We used contact photolithography and deep-reactive-ion-etching to create a 1×1 cm2 microstructured area. The microstructured area was surrounded by a water reservoir. Various sized thin-film heaters which were created using electron-beam evaporation and acetone lift-off were integrated on the backside of the test sample. Hotspots were emulated by locally heating a 640×620 μm2 area while background heating was emulated by heating the entire 1×1 cm2 microstructured area. The background and hotspot heaters were calibrated prior to experiment to measure temperature. All experiments were conducted in an environmental chamber which was maintained near saturated condition, i.e., saturation temperature and corresponding pressure. The working fluid, degassed de-ionized water, was transported from the surrounding water reservoir to the microstructured area passively via capillary-wicking. We dissipated ≈5.8 kW/cm2 from a 620×640 μm2 footprint when the hotspot temperature was ≈260 °C. Most importantly, when the surface dried out at ≈5.8 kW/cm2, the background temperature as well as the local temperatures 3 mm away from the hotspot were less than 50 °C. Increasing the heat flux beyond ≈5.8 kW/cm2 resulted in the formation of a dry island at the center of the hotspot which grew radially outwards. Dryout and thermal runaway occurred when viscous losses exceed the capillary pressure. Furthermore, the maximum dryout heat flux from a single hotspot decreased from ≈5.8 kW/cm2 to ≈2.9 kW/cm2 when the hotspot was assisted by a 20 W/cm2 background heating. Lastly, the dryout heat flux decreased from ≈5.8 kW/cm2 to ≈2.9 kW/cm2 per heater when three spatially distributed hotspots were created concurrently. Unlike the dryout heat flux, the total heating power increased by assisting hotspot with background heating as well as by creating spatially distributed concurrent hotspots over the microstructured area.","PeriodicalId":426908,"journal":{"name":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133254747","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Thermal annealing effects on copper microstructure in Through-Silicon-Vias 热退火对硅通孔中铜微观结构的影响
Yaqin Song, R. Abbaspour, M. Bakir, S. Sitaraman
{"title":"Thermal annealing effects on copper microstructure in Through-Silicon-Vias","authors":"Yaqin Song, R. Abbaspour, M. Bakir, S. Sitaraman","doi":"10.1109/ITHERM.2016.7517533","DOIUrl":"https://doi.org/10.1109/ITHERM.2016.7517533","url":null,"abstract":"In this paper, we have studied the microstructure evolution of one-year room-temperature-aged Through-Silicon Via (TSV) copper after annealing the TSV samples at 300 °C, 400 °C and 500 °C for 180 minutes. Hardness and elastic modulus values are obtained by using nano-indentation technique. The hardness and elastic modulus values decrease as annealing temperature increases. The microstructure of copper (Cu) is examined to obtain grain size and texture, using electron backscatter diffraction (EBSD). Copper grain growth, if any, is studied under different annealing temperatures. There was no observable grain growth for the annealing temperatures studied in this work. Moreover, microstructure variation at different locations within a Cu TSV is also studied.","PeriodicalId":426908,"journal":{"name":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133695121","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
2 phase microprocessor cooling system with controlled pool boiling of dielectrics over micro-and-nano structured Integrated Heat Spreaders 2相微处理器冷却系统控制池沸腾介电介质在微纳结构集成散热器
Miguel Moura, E. Teodori, A. Moita, A. Moreira
{"title":"2 phase microprocessor cooling system with controlled pool boiling of dielectrics over micro-and-nano structured Integrated Heat Spreaders","authors":"Miguel Moura, E. Teodori, A. Moita, A. Moreira","doi":"10.1109/ITHERM.2016.7517574","DOIUrl":"https://doi.org/10.1109/ITHERM.2016.7517574","url":null,"abstract":"The present work addresses a microprocessor cooling technique based on pool boiling of a dielectric fluid, HFE-7000 with a compact closed loop thermosyphon, which requires no pumping or auxiliary components to operate. Aiming at modern desktop CPU cooling, the devised system is modular to infer on the optimization of several parameters influencing the system performance. The evaporator bottom surface is enhanced with micro-structured cavities to increase the liquid/solid contact area and optimize nucleation and bubble dynamics within the heterogeneous nucleation process. Optimization of surface structuring must account for several interaction mechanisms and assure that the flow near the surface maximizes the heat transfer mechanisms present in pool boiling heat transfer. This optimization is based on the minimization of steady-state overall thermal resistance of the system and on transient power conditions to control the onset of nucleate boiling and the inherent temperature overshoot upon regime transition at start-up. The condenser tilt angle is optimized as well as the effect of evaporator dimensions, orientation (horizontal and vertical positioning) and liquid fill charges. Based on the outcomes of this exploratory research, a cooling system is implemented in a working computer, cooling a modern CPU, mounted vertically.","PeriodicalId":426908,"journal":{"name":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131790350","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
Eulerian multiphase conjugate model development and validation for flow boiling in micro-pin field 微针场流动沸腾的欧拉多相共轭模型的建立与验证
P. Parida, T. Chainer
{"title":"Eulerian multiphase conjugate model development and validation for flow boiling in micro-pin field","authors":"P. Parida, T. Chainer","doi":"10.1109/ITHERM.2016.7517713","DOIUrl":"https://doi.org/10.1109/ITHERM.2016.7517713","url":null,"abstract":"Chip-embedded micrometer scale two-phase cooling technology can be essential to fully optimize the benefits of improved integration density of three-dimensional (3D) stacking in high performance integrated circuits (ICs) for future computing systems; but is faced with significant developmental challenges including high fidelity modeling. In the present work, an Eulerian multiphase model has been developed for simulating two-phase evaporative cooling through chip embedded microscale cavities populated with pin-fins. First the model is used to predict the flow and heat transfer characteristics for coolant R1234ze flowing through a two-port ~10 mm long micro-cavity populated with 80 μm diameter pin-fins arranged in an in-line manner. The flow is sub-cooled in the initial section of the cavity and saturated in the remaining. The results were compared to experimental data available from fundamental experiments, focusing on the model capability to predict the correct flow pattern, temperature profile and pressure drop.","PeriodicalId":426908,"journal":{"name":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"116 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134136514","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Energy assessment of CRAH bypass for enclosed aisle data centers 封闭通道数据中心CRAH旁路的能量评估
H. Erden, M. Yildirim, M. Koz, H. Khalifa
{"title":"Energy assessment of CRAH bypass for enclosed aisle data centers","authors":"H. Erden, M. Yildirim, M. Koz, H. Khalifa","doi":"10.1109/ITHERM.2016.7517581","DOIUrl":"https://doi.org/10.1109/ITHERM.2016.7517581","url":null,"abstract":"Temperature non-uniformities in traditional data centers can be eliminated or at least reduced by utilizing containment systems. As all servers receive the same inlet air temperature in a contained configuration, the cooling system can be operated more efficiently at a higher temperature, which also increases the potential for free cooling through various economizer modes. However, enclosed aisle configurations require computer room air handler (CRAH) fans to operate at a higher speed and provide entire rack air flow through the perforated tiles, unlike open aisle data centers that can make up a fraction of server air from the data center air space. Hence, the traditional enclosed aisle configuration is likely to consume more fan power. This study confirms that enclosing the aisle does not guarantee optimum cooling infrastructure power in air cooled data centers. Proposed CRAH bypass configuration for enclosed aisle data centers provides a fraction of the tile airflow rate through a set of bypass fans while CRAH fans operate at lower speeds. These low-lift fans operate across a pressure difference between the room and plenum, which is significantly less than the flow resistance of CRAH units. Meanwhile, CRAH fans operate at lower speeds and consume less energy. Accordingly, a certain bypass air fraction with respect to total rack air flow rate leads to a minimum cooling infrastructure power for a particular configuration. This study investigates energy savings potential of the enclosed aisle data centers with CRAH bypass configuration utilizing a calibrated flow network model for estimating the energy consumption of air movers as well as a thermodynamic modeling tool to evaluate the off-design performance of major components of data center cooling infrastructure. Hour-by-hour annual energy simulations complement the energy assessment for 7 U.S. cities considering indirect air side economizer operation.","PeriodicalId":426908,"journal":{"name":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"599 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131798585","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Properties and reliability of molybdenum-copper-composites for thermal management applications 热管理用钼铜复合材料的性能和可靠性
M. Seiß, T. Mrotzek, T. Hutsch, W. Knabl
{"title":"Properties and reliability of molybdenum-copper-composites for thermal management applications","authors":"M. Seiß, T. Mrotzek, T. Hutsch, W. Knabl","doi":"10.1109/ITHERM.2016.7517651","DOIUrl":"https://doi.org/10.1109/ITHERM.2016.7517651","url":null,"abstract":"Multilayered composites made of molybdenum and copper combine a low coefficient of thermal expansion with a high thermal conductivity. By varying the layer structure, both properties can be tailored to the application requirements. Therefore, these composites are interesting candidates for the thermal management of electronics in general and especially for thermal management of GaN based devices. In this work reliability tests were performed on a three layered structure (Cu-Mo-Cu) with 63 wt% copper according to EN 60068-2-14. The results show that the interface is not degrading by thermal cycling between -40 °C and +125 °C after 2000 cycles. Moreover, no change in thermal conductivity or flatness of the samples was observed. The molybdenum-copper-interface was found to be stable up to the melting point of copper.","PeriodicalId":426908,"journal":{"name":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132416588","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Proportional Hazard Model of doped low creep lead free solder paste under thermal shock 热冲击下掺杂低蠕变无铅锡膏的比例危害模型
A. Raj, S. Thirugnanasambandam, T. Sanders, S. Sridhar, Seth Gordon, John L. Evans, F. Megahed, M. Bozack, W. Johnson, Mark Carpenter
{"title":"Proportional Hazard Model of doped low creep lead free solder paste under thermal shock","authors":"A. Raj, S. Thirugnanasambandam, T. Sanders, S. Sridhar, Seth Gordon, John L. Evans, F. Megahed, M. Bozack, W. Johnson, Mark Carpenter","doi":"10.1109/ITHERM.2016.7517683","DOIUrl":"https://doi.org/10.1109/ITHERM.2016.7517683","url":null,"abstract":"In this experiment, the thermal performance of various lead-free doped solder paste alloys on leaded and leadless packages on laminate substrates were investigated. The Primary Goal of this test is to find a manufactureable solder paste that will mitigate the effects of aging on lead free solder joints. The results discuss the effects of different paste materials, the effects of doping level, and reflow profile on the resulting reliability of a variety of surface mount components. The test vehicle consists of 35 mm (PBGA 1156), 31mm (SBGA 304), 15 mm (CABGA 208) and 6mm (CABGA 36) ball grid array packages with 1.0 mm, 1.27mm and 0.8mm pitch, respectively. Additionally, a leadless 5mm QFN package (MLF 20) with 0.65mm pitch and 2512 SMRs are included in order to understand the effect of doped solder paste on conventional packages. The test boards are built with (a) three different reflow profiles on 6 mil stencil thickness, and (b) one reflow profile on a 4 mil stencil thickness, to study the differences in doping volume effects of the new doped alloys. The test vehicles were subjected to high temperature accelerated life test (HALT) in liquid shock (thermal shock) testing. Each test vehicle underwent 3000 thermal cycles with peak temperatures of -40°C to +125°C on a 15-minute thermal profile (5 minutes dwell time and 2.5 minutes transition time). Reliability of the test packages were determined from the ability of the components and solder interconnects to withstand the thermal stresses induced by alternating high and low temperature extremes. The time to failure were right censored after 3000 cycles. The experimental variables include paste materials, solder paste manufacturer, Reflow profile, stencil thickness, packages and component solder sphere. The response variable used in this test is Time to Failure (cycles). The effect of experimental variables on Time to Failure were assessed at 5% level of significance using Proportional Hazard Model. It is found that all the experimental variables except reflow profile have significant impact on the Time to Failure. Since this experimental data consists of heavy censoring, Censored Quantile Regression model is developed and it is compared with Proportional Hazard Model.","PeriodicalId":426908,"journal":{"name":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"41 166","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132476936","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Stress reduction methods within the Far Back End of Line (FBEOL) for fine pitch and 2.5D/3D packaging configurations 用于细间距和2.5D/3D封装配置的远后端线(FBEOL)内的应力减小方法
K. Tunga, T. Wassick, L. Guerin, Maryse Cournoyer
{"title":"Stress reduction methods within the Far Back End of Line (FBEOL) for fine pitch and 2.5D/3D packaging configurations","authors":"K. Tunga, T. Wassick, L. Guerin, Maryse Cournoyer","doi":"10.1109/ITHERM.2016.7517526","DOIUrl":"https://doi.org/10.1109/ITHERM.2016.7517526","url":null,"abstract":"Fine pitch interconnects combined with 2.5D/3D packaging technology offers enormous potential towards decreasing signal latency and by making it possible to package increased electrical functionality within a given area. However, fine pitch interconnects present their own set of challenges not seen in packages with coarse pitch interconnects. Increased stresses within the Far Back End of Line (FBEOL) and Back End of Line (BEOL) layers within the chip are the primary concerns. Several 2D and 2.5D test vehicles with fine pitch and coarse pitch interconnects were built and tested for mechanical integrity by subjecting them to accelerated thermal cycling between -55°C and 125°C. Finite-element based mechanical modeling was done to determine the stress level within the FBEOL layers of these test vehicles. For all the tested assemblies, experimental data and modeling results showed a strong correlation between reduced pitch and increased level of stresses and increased incidence of failures within the FBEOL region. These failures were observed exclusively at the passivation layer and aluminum pad inter face. Experimental data in conjunction with mechanical modeling was used to determine a safe level of stress at the aluminum interface. Global and local design changes were explored to determine their effect on the stresses at this interface. Several guidelines have been provided to reduce these stresses for a 2.5D/3D package assembly with fine pitch interconnects. Finally, an optimized configuration has been proposed that is expected to be robust with very low chance of failure within the FBEOL region.","PeriodicalId":426908,"journal":{"name":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116420328","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Evaluation of a new data center air-cooling architecture: The down-flow Plenum 一种新的数据中心空气冷却架构的评估:下流式静压室
D. Hackenberg, M. Patterson
{"title":"Evaluation of a new data center air-cooling architecture: The down-flow Plenum","authors":"D. Hackenberg, M. Patterson","doi":"10.1109/ITHERM.2016.7517576","DOIUrl":"https://doi.org/10.1109/ITHERM.2016.7517576","url":null,"abstract":"The rate of innovation in IT system design and especially in High Performance Computing continues to be very high. To keep pace TU Dresden has constructed its new data center using the Plenum concept. The traditional raised floor was substituted by a full building story, creating a highly flexible space to transport power, water, and air. A strict hot-aisle air separation is used and the computer room air-handling (CRAH) units in downflow configuration are positioned directly beneath the hot aisles. This unique arrangement necessitates an unconventional downward flow of hot air from the enclosed hot aisle. Extensive testing has been performed in a cluster of 24 racks (12 per side) equipped with (3+1)×100 kW CRAH unit cooling capacity and 60 test fixtures (air heaters) with 5-15 kW heating power each. Our analysis demonstrates the extremely high efficiency of this air cooling concept even in high-density configurations, up to at least 30 kW per rack. This efficiency is mostly due to the very short airflow paths and wide open cross-sections. We also showcase that no malicious thermal stratification occurs in our hot air downflow configuration. A detailed analysis of the CRAH controls for temperature (through cooling water flow modulation) and airflow (fan speed) highlights the challenges of such control systems in enclosed hot aisle configurations at high power density and short feedback loops. The analysis also considers dynamically changing load patterns including very low partial load scenarios and aspects of operational reliability.","PeriodicalId":426908,"journal":{"name":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116229237","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
The design and construction of a bench-top Organic Rankine Cycle for data center applications 用于数据中心应用的台式有机朗肯循环的设计和构造
S. Araya, Gerard F. Jones, A. Fleischer
{"title":"The design and construction of a bench-top Organic Rankine Cycle for data center applications","authors":"S. Araya, Gerard F. Jones, A. Fleischer","doi":"10.1109/ITHERM.2016.7517577","DOIUrl":"https://doi.org/10.1109/ITHERM.2016.7517577","url":null,"abstract":"The growing demand for data center utilization and the resulting increases in energy requirements are creating significant challenges for data center operators and for thermal designers. Design options which can cool the servers efficiently while also reducing electricity usage are thus of considerable interest. One potential technique is the use of Organic Rankine Cycle (ORC) technology which can absorb the server heat into an organic fluid and then use this heat in a power cycle to create electricity. The ORC has been found to match well with data center requirements and this paper presents the analysis of an ORC system matched with data center operating conditions and the design of an ORC test bed. The ORC test bed is designed for 20kW of waste heat collected from 2 full racks. The complete design includes the ORC power cycle and one secondary cycle as heat source. Component selection has been carefully studied in each of the two cycles. The main goals of this investigation are the steady-state characterization of an ORC under different data center operating conditions and the design of a test bed which will prove out the concept of mating ORC with data center conditions for potential customers who are seeking alternatives for data center waste heat recovery.","PeriodicalId":426908,"journal":{"name":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121899526","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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